With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
Crossbow allows designers to take advantage of all the benefits associated with orthogonal mid-plane architectures as the differential pairs on each side of the mid-plane share vias creating a straight pass-through connection. This shared via approach combined with the Crossbow footprint, eliminates most electrical problems associated with the typical backplane via stub.
The Cryo-Seal Hermetic connector series is designed for extreme low-temperature environments. They are built to retain contact-to-contact sealing in temperatures as low as -319 °F (-195° C).
Temperatures falling below -85 °F (-65 °C) typically leaves one at risk of losing the pin-to-pin environmental seal and/or having cracked elastomeric components leading to electrical shorting.
Amphenol CDI’s cryogenic semi‑rigid cable assemblies are engineered for precision, stability, and ultra‑low‑temperature performance, delivering reliable signal integrity for quantum computing, scientific instrumentation, aerospace, and advanced electronic systems. Built with robust materials, rugged construction, and flexible configuration options—including customizable connectors, lengths, etc.
Amphenol LTW's Cable Glands are applied in conjunction with cable or wiring for power or electrical purpose. The Cable Glands are attached to the end equipment and act as a sealing of the terminating housing to ensure the protection of electrical equipment and enclosures. Available in different sizes, materials【Quick guide: https://amphenolltw.com/down.php?supp_download=90】
The Amphenol cStack™ high speed solder-less interconnect solution provides limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications when terminated to a flex circuit. With offerings in 1mm to 5mm housing heights and multiple sizes, Amphenol's cStack™ connector provides a solution for any application where space is tight and speed and...
Amphenol's cStack™ flexible circuit assemblies are designed for applications where flexibility, space, weight, and performance are critical. They are available in standard and custom flex circuit and connector designs. cStack™ Flex is a compression-based interconnect utilizing Amphenol's cStack™ interposer terminated to a multi-layer impedance-controlled flexible circuit in a compact footprint.
Amphenol LTW offers a comprehensive range of rugged USB Type-C connectors delivering a high data transmission rate of up to 10 Gbps and superior power charging up to 5A current. Designed in various form factors with multiple termination options make it ideal to fulfill industrial harsh application【Quick Guide: https://amphenolltw.com/down.php?supp_download=111】
Amphenol's Flex Cable Assemblies provide value-added solutions to challenging interconnect problems where a flexible solution is desirable. Amphenol flex cables can be engineered to use any mezzanine connector in the Amphenol portfolio to meet unique signal integrity, mechanical, power, and environmental requirements.Amphenol flex cables are qualified in a wide range of commercial and military...
Amphenol's CXP passive copper cable assemblies are designed to meet the high bandwidth capacity demands being requested by data centers and high-performance computing applications. The CXP copper cables are a high-density cabling interconnect system capable of delivering aggregate data bandwidths of 120Gb/s and 168 Gb/s.
Data Guide Cable is a quality manufacturer of specialty electronic and electrical cable products for a variety of applications. Major markets serviced include instrumentation, data communications, robotics, broadcast/studio, computer, utility, shipboard, and factory automation among others. The main focus is manufacturing products in compliance with USA specific standards such as NEC, UL, NFPA, ABS, MSHA,
DDR3 vertical DIMM sockets are designed to accept 240 position DDR3 memory modules that conform to JEDEC M0-269. Low-resistance contacts support the use of RDIMM (registered DIMM), which helps to further reduce power consumption in data center hardware.
Vertical DDR4 DIMM sockets from Amphenol provide 288 contacts on 0.85mm pitch and are designed to accept DDR4 memory modules that conform to JEDEC MO-309. The DDR4 series complies with the new interface standard JEDEC POD12. It allows a module seating plane of 2.40mm and supports module variants in UDIMM, RDIMM, and LRDIMM.
HIGH-SPEED HIGH-DENSITY SO-DIMM SOCKETS
DDR4 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. Different key positions aid alignment and prevent mismating. 260 position SO-DIMM connectors are available in 4.00mm, 5.20mm, 8.00mm, 9.20mm height, in standard or reverse options.
DDR4 Ultra Low Profile (ULP) vertical DIMM sockets provide 288 contacts on 0.85mm pitch. It facilitates convenient memory expansion in servers, workstations, desktop PCs, and embedded applications in communications and industrial equipment. With an ultra-low module seating height of 1.1mm and connector height of 13.1mm, it reduces the overall profile of the connector.
112G DOUBLE ENDED HIGH PERFORMANCE CABLING INTERCONNECT
DensiLink® OverPass™ products remove high speed signaling from the PCB and create a double ended, high performance cabling interconnect. These cables support 56G and 112G signaling in hardware system designs as well as technology for future 224G signaling systems.
Ideal for miniature applications, the DensiMate™ connector system provides highly reliable performance, which meets industrial automation and IT/Datacom challenges.
With wire gauge range from 30AWG-26AWG, these connectors are available in double row, vertical SMT, and right angle SMT configurations. DensiMate™ comes with an active latch to provide enhanced contact reliability.
Amphenol LTW DVI Connectors feature a 1.5A current rating, a ≤20mΩ contact resistance, and a ≥1000MΩ @ 500VDC insulation resistance rating. The DVI has a copper alloy, gold-plated contacts and steel, nickel-plated shell. It offers the durability of 100 cycles and an IP68 rating. Operate in the -20°C to +80°C temperature range【Quick Guide: https://amphenolltw.com/down.php?supp_download=94】
FCI Basics DIN IDC cable connectors are available in 4 connector sizes as 96, 42, 21 and 9 positions. Available in wire sizes 30AWG to 24AWG, their unique insulation displacement design grants the lowest installed cost for users. Standard accessories are also offered to make up a fully modular system. This robust and standardized solution is widely used in Industrial and Instrumentation markets.
HIGH-PERFORMANCE DIGITAL AUDIO/VIDEO INTERCONNECT SOLUTION
Amphenol DisplayPort connector system is a scalable solution that transmits 1, 2, or 4 lanes of High-Definition video at 2.7Gb/s per lane up to a maximum of 10.8Gb/s. DisplayPort also allows flexible allocation of available bandwidth between audio and video.