IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
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Ceres Circular Connector
Amphenol LTW Ceres Connectors are environmentally sealed, up to IP68, rugged, and cost-effective, available in plastic and metal. Our Ceres provides a comprehensive size range and variety of mating styles such as screw, lock bayonet, and push-lock to meet various harsh environments and are suitable for power and data applications【Quick guide: https://amphenolltw.com/down.php?supp_download=92】.
CFP2
Amphenol's CFP2 series offers a 104 position, 0.6mm pitch connector designed to be compatible with 100Gb/s Form Factor Pluggable (CFP) Multi-Source Agreement for Ethernet and other applications. Rated for 25Gb/s per channel with resonance dampening for improved signal integrity, CFP2 has up to 60% lower power consumption versus CFP.
CFP4
Amphenol's CFP4 series offers a 56 position, 0.6mm pitch connector, and is used in multi-hundred Gb/s systems. Rated for 25Gb/s per channel with resonance dampening for improved signal integrity, CFP4 has up to 60% lower power consumption versus CFP. The CFP4 series includes a plug connector on the mating interface to improve accuracy and aid in delivering high-speed performance.
CFP8
Amphenol's CFP8 interconnect system has 124 contacts per port, with a 0.5mm contact pitch and 16 high-speed channels. It is rated for 28Gb/s per channel with resonance dampening for improved signal integrity. It is comprised of insert molding assemblies for top side contacts and Press-Fit cage assemblies.
Chameleon®
With performance speeds up to 25 Gbps+, Chameleon meets the demand for faster, smaller, and more compact connector solutions. With stack heights from 6mm to 10mm in 1mm increments, pin counts from 40 to 500+, and pair counts from 16 to 160, Chameleon provides you with a ready platform to easily change and adapt to your design requirement.
cLGA® Chip-to-Board Socket
HIGH PERFORMANCE, LOW COST CHIP-TO-BOARD APPLICATION
The Amphenol cLGA® land grid array socket system was designed to bring conventional connector material construction to high performance, low cost chip-to-board applications. Gold over nickel-plated copper alloy spring contacts guarantee long-term connector performance, contact retention and ruggedness.
Coaxial Fixed Attenuators
Amphenol RF attenuators are designed to offer flat attenuation over the designated frequency range and feature a microwave grade resistor that consistently reduces power. Hex flats on the body allow this attenuator to be easily torqued to the mating connector.
Coaxial Inserts
Size 8 coaxial inserts for DIN and D-Sub applications. Available for common flexible coaxial cables.
Combo-D
Positronic Combo-D connectors are a combination of signal and power and are part of the D-sub family. Combo-D connectors are used in military, communications, space, industrial, and medical applications. These connectors are available in various performance levels for the best cost/performance ratio.
ComboStak® 0.50mm & PowerStak® 2.00mm Board-to-Board Connector
HYBRID AND HIGH SPEED SOLUTION
The ComboStak® 0.50 mm BTB connectors are compact, hybrid (signal and power) board-to-board connectors. ComboStak® 0.50 mm combines existing, BergStak® 0.5mm pitch HS signal pins with 2.00mm pitch power blades. ComboStak® 0.50 mm provides high signal and current density with a wide range of stack heights.
ComboStak® 0.80mm & PowerStak® 2.00mm Board-to-Board Connectors
HYBRID AND MEDIUM POWER SOLUTION
ComboStak® and PowerStak® are compact, hybrid (signal and power) and power board-to-board connectors. ComboStak® combines existing, BergStak® 0.8mm pitch signal pins with 2.00mm pitch power blades. PowerStak® is the power only version. Both ComboStak® and PowerStak® provide high signal and current density with a wide range of stack heights.
COM-HPC 0.635mm pitch 400 pin Open-Pin-Field Array
400POS 0.635MM PITCH COM-HPC
Amphenol has developed a pair of 400pos 0.635mm COM-HPC which support 5mm and 10mm stack heights.
COM-HPC is a PICMG sponsored open standard for a family of high performance computer modules targeting the embedded computer space. We have developed a pair of 400pos 0.635mm COM-HPC which support 5mm and 10mm stack heights.
Cool Edge 0.80mm Hybrid Power & Signal Connectors
Cool Edge Hybrid Power and Signal connectors provide a one-piece high speed and high power card-edge package. These versatile solutions address multiple standards like PCIe, SAS, SATA, and offer multiple BTB configurations such as mezzanine, coplanar, and midplane/backplane. Moreover, the connectors are designed as Open Pin Field and are hot-plug capable.
CoolPower® HD Right-Angle Cable-to-Board Connector
Amphenol's CoolPower® HD Right-Angle Connector is a 90-degree, versatile pin-and-socket solution designed to deliver highdensity power output in a compact, low-profile housing. This makes it an ideal solution for addressing the increasing demands of modern power consumption. The CoolPower® HD series supports a wide range of pin diameters, including 5.7mm, 6.0mm, 8.0mm, and 9.1mm, and ....
CoolPower® HD Vertical Cable-to-Board Connector
Amphenol's CoolPower® HD Vertical Connector Series is a versatile pin-and-socket solution that delivers high-density power output in a compact, low-profile housing. This makes it an ideal solution for addressing the increasing demands of modern power consumption. The CoolPower® HD series supports a wide range of pin diameters, including 5.7mm, 6.0mm, 8.0mm, and 9.1mm, and offers exceptional ...
Crossbow™
Crossbow allows designers to take advantage of all the benefits associated with orthogonal mid-plane architectures as the differential pairs on each side of the mid-plane share vias creating a straight pass-through connection. This shared via approach combined with the Crossbow footprint, eliminates most electrical problems associated with the typical backplane via stub.
Cryo-Seal Hermetic Connector Series
The Cryo-Seal Hermetic connector series is designed for extreme low-temperature environments. They are built to retain contact-to-contact sealing in temperatures as low as -319 °F (-195° C).
Temperatures falling below -85 °F (-65 °C) typically leaves one at risk of losing the pin-to-pin environmental seal and/or having cracked elastomeric components leading to electrical shorting.
CSG/CSL/CSF Cable Glands
Amphenol LTW's Cable Glands are applied in conjunction with cable or wiring for power or electrical purpose. The Cable Glands are attached to the end equipment and act as a sealing of the terminating housing to ensure the protection of electrical equipment and enclosures. Available in different sizes, materials【Quick guide: https://amphenolltw.com/down.php?supp_download=90】
cStack™ 25Gb/s Compression-mount Mezzanine Interposer
The Amphenol cStack™ high speed solder-less interconnect solution provides limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications when terminated to a flex circuit. With offerings in 1mm to 5mm housing heights and multiple sizes, Amphenol's cStack™ connector provides a solution for any application where space is tight and speed and...
cStack™ Flex Cables
Amphenol's cStack™ flexible circuit assemblies are designed for applications where flexibility, space, weight, and performance are critical. They are available in standard and custom flex circuit and connector designs. cStack™ Flex is a compression-based interconnect utilizing Amphenol's cStack™ interposer terminated to a multi-layer impedance-controlled flexible circuit in a compact footprint.