With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
224G CONNECTION DIRECTLY FROM CHIP SITE TO EXTERNAL PORTS
UltraPass™ enables arrayed connector layouts for near-chip and on-package IO solutions, providing the highest differential pair count interconnect offering in the market.
Amphenol LP SlimSAS is a high-speed cable solution with low mating height, and it's a qualified cable solution by UPI1.0. LP SlimSAS can support PCIe Gen5, and its footprint is compatible with standard SlimSAS. Amphenol developed 38pin, 74pin and 124pin LP SlimSAS with straight, right-angle, and side exit plug types to provide customers a flexible system layout.
Amphenol's SlimSAS is a high-speed and robust cable assembly solution, and supports multiple industry applications such as PCIe, SAS, OpenCAPI, UPI1.0, OCP, NVME, and Ethernet. Amphenol has developed a scoop-proof connector solution with a pull tab. Amphenol develops a 38pin and 74pin solution and has been specified in the SFF group(SFF-8654).
Amphenol's UltraPort™ QSFP+ interconnect system comprises a 38-position, 0.8mm pitch connector built for use in high-speed serial applications. Each port offers 4 channels to increase port density which allows more board real estate and cost-optimized solutions. The UltraPort™ QSFP+ connector supports next-generation 100G+ applications and transmits up to 28 Gb/s per channel.
Amphenol's UltraPort™ SFP+ interconnect system comprises of a 20-position hot-swappable I/O connector enclosed in a metal cage mounted to a host PCB. It supports 28Gb/s applications with backward compatibility for next-generation Ethernet and Fibre Channel applications. UltraPort™ SFP+ connector shares the same unique mating interface and EMI cage dimensions as the SFP+ form factor.
Amphenol LTW is a proud OCP Solution Provider. Our SnapQDB (UQDB) connectors are listed on the Open Compute Marketplace, offering reliable, meets and exceeds OCP UQDB requirements, drip-free quick disconnects for high-performance liquid cooling connectivity【Quick Guide: https://amphenolltw.com/down.php?supp_download=116】
Amphenol LTW is a proud OCP Solution Provider. Our SnapQD G-Thread connectors are listed on the Open Compute Marketplace, offering reliable, meets and exceeds OCP UQD requirements, drip-free quick disconnects for high-performance liquid cooling connectivity【Quick Guide: https://amphenolltw.com/down.php?supp_download=116】
Amphenol LTW is a proud OCP Solution Provider. Our SnapQD connectors are listed on the Open Compute Marketplace, offering reliable, meets and exceeds OCP UQD requirements, drip-free quick disconnects for high-performance liquid cooling connectivity【Quick Guide: https://amphenolltw.com/down.php?supp_download=116】
SuperSpeed USB will deliver 10x the data transfer rate of Hi-Speed USB, as well as improved power efficiency. With 5Gb/s signally rate, SuperSpeed USB 3.1 has a Sync-N-Go technology that minimizes user wait time. No device polling and lower active and idle power requirements are other significant features of these connectors. SuperSpeed USB is backward compatible with USB 2.0.
COMPLIANT TO USB 3.1 SPECIFICATIONS; IDEAL FOR SERVER APPLICATIONS
Amphenol USB 3.1 Gen 2 Connector operates with full-duplex signaling over two differential pairs, improving host-directed simultaneous bidirectional communication. It supports scalable power delivery up to 100W and performance speed up to 10Gb/s.
VHDM-HSD™ is a shielded, high-density, high-speed press-fit connector system optimized for differential pair architectures. The flexible, modular design of the product allows for the differential performance of our VHDM-HSD™ connector to be combined on the same rear organizer as the VHDM® connector which is a single-ended solution.
SV’s newest fixed-length RF cable assemblies allow you to expand the use of the standard D38999 circular connector to incorporate microwave transmission lines. These assemblies are available in VITA 67.3 SMPM, SMPS, and NanoRF series and terminate into various D38999 BMB, SMPM, and SMPS interfaces and their respective size 8, 12, and 16 contacts.
Amphenol SV Microwave offers a wide range of IP67 and IP68 waterproof interconnect products designed to withstand rigorous environments and harsh elements. SV's waterproof adapters include hermetically sealed connectors to 1 x 10-8 cc/sec, making them ideal for high-pressure, vacuum applications, and the prevention of liquid or gas leakage.
Amphenol's Waterproof Micro USB 2.0 comes with full shielding that protects against Electromagnetic Interference (EMI), Radio-Frequency Interference (RFI), and Electromagnetic Discharge (ESD). The USB connector supports fast charging with 1.8A power contacts and is capable to support up to 3A for customized needs. These halogen-free connectors meet IPX4 industry ratings.
WaveTrax®, the Amphenol Network Solutions fiber raceway system, is designed to help engineers deliver reliable fiber optic network performance. Reduce your cost of ownership with the full line of WaveTrax products, including troughs, elbows, cross and T sections, off-ramps, and articulating links - easily installed so you are up and running quickly!
Amphenol's wire-to-board fan connectors come with Blind-Mate Interface. The 1.25mm pitch wire-to-board connectors meet a maximum of 2.8A/pin current carrying capacity, whereas the 2.00mm pitch wire-to-board connectors meet a maximum of 5.3A/pin and the 2.54mm pitch wire-to-board connectors meet a current-carrying capacity of maximum 5.5A/pin. These connectors come with a cable side terminal crimping
XCede® HD product leverages the same core technologies as standard XCede® series. Providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. XCede® HD product family includes XCede® HD, XCede® HD Plus and XCede® HD2 supporting various data rate up to 56Gb/s with backward compatibility.