Amphenol designs and manufactures an extensive range of interconnect products, antennas and electromechanical components found in a wide array of mobile computing devices. Amphenol’s capability for high-volume production of these technically demanding, miniaturized products, combined with our speed of new product introduction, are critical drivers of our long-term success in this market. Our solutions address consumer electronics, e-readers, laptops, mobile phones, mobile phone accessories, mobile computing devices, smartphones, tablets, ultrabooks and wearable and hearable devices.
Amphenol has in-house capabilities to create application-specific mobile phone acrylic sheet lenses to fit our customer's precise needs. The sheet lenses are available as plastic or glass. Amphenol has over 10 years of acrylic sheet lens experience. Our lens capacity is over 12 million per month.
AgilBrick™ 1.27mm Board-to-Board Header G802 Series offers a cost-effective solution with a flexible structure and 1 to 4 A current rating. These headers from Amphenol ICC can be customized to meet various customer requirements. It comes in customizable pin length, including contact pin and solder tail, which makes it an ideal choice for several applications and specific designs.
AgilBrick™ 2.00mm Board-to-Board Header G825 Series offers a cost-effective solution with a flexible structure and 1 to 4 A current rating. These headers from Amphenol ICC can be customized to meet various customer requirements. It comes in customizable pin length, including contact pin and solder tail, which makes it an ideal choice for several applications and specific designs.
AgilBrick™ 2.54mm Board-to-Board Header G800 Series offers a cost-effective solution with a flexible structure and 1 to 4 A current rating. These headers from Amphenol ICC can be customized to meet various customer requirements. It comes in customizable pin length, including contact pin and solder tail, which makes it an ideal choice for several applications and specific designs.
AgilLink™ 2.00mm Wire-to-Board Header G823 Series is the most common solution for transferring power and signal. It can mate with both wire-to-board and board-to-board applications. This series can carry a maximum current rating of 4A. Amphenol ICC offers a comprehensive range of these headers including, V/T DIP, V/T SMT, R/A DIP to meet various customer requirements.
Amphenol's Audio Jacks are widely used in mobile phone applications. These connectors are available in different configurations, e.g. compressed type or for SMT solderable versions, and fully customized to the application requirements.
Amphenol’s comprehensive offering of battery connectors for mobile phones comes in single and multi-contact versions with straight and right-angle mountings. They feature stamp and form contacts with additional solder tags for high reliability and conductivity. Amphenol offers right angle and direct compression type, Wire to Board, board to board, blade type and float, or SMT versions.
BergStak+™ 0.80mm is designed to be the next generation PCIe 4.0 compliant mezzanine connector system. It is compatible with the existing BergStak® 0.80mm product recommended by the OCP. It guarantees to support up to 16Gb/s performance. Customers can upgrade its board-to-board performance from PCIe 3.0 to PCIe 4.0 while leveraging BergStak+™'s backward compatibility and same footprint feature.
The BergStak® product range is expanded to include 0.5mm mezzanine connectors. Available in 3mm to 6mm stack height options in 0.5mm increments, this connector is offered in 10 to 60 positions in 10 position increments. Designed with scoop-proof housing the terminals are protected from damage when parts are mated.
FCI Basics BergStak® product range is expanded to include a 0.50 mm BergStak® FX10 board-to-board connector known for its fast data transmission and high signal quality. This connector is offered in 144 positions and is available in 4.30mm and 6.00mm stack height options.
BergStak® FX10 supports speed performance up to 15Gb/s+ and is available in vertical SMT configuration.
Amphenol's BergStak® Lite 0.8mm is a comprehensive, versatile, and flexible solution designed for high speed and high density, parallel board-to-board connector system with 16 PCB stack heights in 4 sizes up to 100 positions. This is an economical version that uses Gold Flash plating that can meet up to 50 mating cycles while extending the mechanical advantage of the standard BergStak® 0.80mm.
Board-to-Board Connectors - B401/B402 Series (0.80mm pitch)
HIGH DENSITY VERTICAL BOARD-TO-BOARD CONNECTORS
Amphenol's B401/B402 series is 0.80mm pitch board-to-board connectors designed for high-density applications. They support stack heights up to 10mm and 100 positions. These connectors feature surface mount terminations and are available in a comprehensive range to satisfy different customer requirements.
FCI Basics Boltrack™ connector promotes signal and PoE++ transmission over Cat 5e and 6 cables in a wide range of datacom and industrial applications. It offers lightning protection, EMI shielding, and is field-installable. Boltrack™ connector comes in a 4-pair right-angle board receptacle and cable plug mating combination. The connector can resist voltages up to 2,500V.
The BTFW Series is a floating board-to-board connector system consisting of plugs and receptacles with two rows of staggered contacts on 1.00mm (0.039in.) centerlines. This connector system is designed for applications that require high density, and high reliability interconnects with higher pin counts and surface mount termination, such as audio-video (AV) and navigation systems in automobiles.
Amphenol's cable assemblies are widespread in the market for wearable products. These cable assemblies are used for data transfer and power charging. Amphenol's Charger Cable Solutions provide highly flexible customized connection solutions from standard USB 2.0/3.0 to the device side with Pogo pins or Spring. The connection mechanisms include magnetic, buckling, clamping, cradle, etc.
Amphenol has developed an extensive range of SIM and micro SD card readers which come in several different configurations including Simlocks, wing and bridge blocks, standard sim and SD blocks, with options of shielding protection, integrated detect switch, float, or SMT mounting.
The Amphenol ICC cLGA® land grid array socket system was designed to bring conventional connector material construction to high-performance, low-cost chip-to-board applications. cLGA® sockets are used in applications ranging from handheld computer products to supercomputer systems. The cLGA® socket is fully qualified under Telcordia GR-1217-CORE specifications.