IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
Visit our global sites to learn more: Amphenol Communications Solutions
Edge Mount PCB Connectors
Amphenol CDI Edge Mount PCB Connectors provide high-performance RF signal transmission with a secure and space-efficient PCB mounting design. Engineered for aerospace, military, space, and industrial applications, these connectors offer low insertion loss, excellent impedance control, and superior shielding to ensure reliable connectivity in high-frequency environments.
EDSFF Board Site Connector
Amphenol introduces the next-generation OverPass™ solution - EDSFF Board Site Connector. The 0.60mm pitch connector comes with a slim form factor design, capable of transmitting a highspeed signal up to PCIe® Gen 5 and PCIe® Gen 6 and allowing much greater signal path lengths while maintaining SI performance compared to conventional PCB routing methods.
EDSFF E1/E3 High-Speed Cable Assembly
EDSFF ORTHOGONAL CABLE ASSEMBLY WITH DIFFERENTIAL SIGNALING TO 32GT/S NRZ FOR NEXT-GENERATION SYSTEMS
Amphenol's EDSFF E1/E3 high-speed cable assembly transmits power and high-speed signals via a cable that directly connects to the main PC board supporting EDSFF E1/E3 SSD and CXL or other modules.
eHPCE® Enhanced High Power Card Edge Connector
CLASSIC HPCE® WITH ENHANCED PERFORMANCE
eHPCE® connector offers a 15% increase in power density with the same footprint as classic HPCE®. The all-new power contact design offers lower contact resistance and higher current carrying capacity compared to classic HPCE® connectors. eHPCE® connectors are designed to extend the life of power supplies using card edge output power connectors.
Elite®
ULTRA-HIGH DENSITY BACKPLANE INTERCONNECT SOLUTION
Ultra-High density 56+ Gbp/s PAM4 interconnect platform utilizing proven press-fit technology and a single wafer design optimized for traditional backplane, direct orthogonal, and cable design solutions.
EMC Shields
Amphenol's EMC Shields are widely used in applications that require electromagnetic isolation of board-level components. They are provided in a wide variety of profiles and sizes to accommodate mother/daughter board configurations. Amphenol EMC Shields also commonly known as EMI shields and RFI shields, is a popular solution for minimizing crosstalk and susceptibility.
eQSFP
The eQSFP interconnect system is comprised of a 38 position 0.8mm pitch SMT connector, and a press-fit cage. With four channels of data in one pluggable, the system interface is capable of transferring data up to 28 Gbps/Channel and replacing up to 4 standard SFP+ receptacles. Supporting standards include Gigabit Ethernet, InfiniBand, and SONET/SDH with different data rate options.
ExaMAX2® 112Gb/s High-Speed Backplane Connector
The ExaMAX2® backplane connector system supports 112Gb/s PAM4 industry specifications. It maintains mating interface compatibility with previous ExaMAX products to allow cost/performance flexibility for designers. The mating interface and connector design are optimized to support the demanding electrical and mechanical requirements of 112G systems. ExaMAX2 delivers industry-leading SI performance.
ExaMAX® 56Gb/s Backplane Cable
The ExaMAX® I/O system offers cable assemblies and I/O connector solutions for both internal and external applications. ExaMAX® I/O products are capable of delivering high-speed performance of 25 Gb/s per channel with a path to 40 Gb/s and higher. The ExaMAX® I/O system delivers superior linear board signal density and meets the performance requirements of the OIF-CEI-25G-LR industry standard.
ExaMAX® VS High-Speed Backplane Connector
The ExaMAX® VS backplane system is a scalable, cost-optimized connector system designed for higher bandwidth applications up to 25Gb/s. The high-performance connector system provides both mechanical robustness and superior signal integrity, minimizing channel performance variation for every differential pair.
ExaMEZZ® 56Gb/s High Speed, Hermaphroditic BGA Mezzanine Connector
The ExaMEZZ® connector is designed to enable superior 25Gb/s electrical performance and provide a path to 56Gb/s in anticipation of further increases in bandwidth requirements and high-speed signaling. ExaMEZZ® connectors feature a revolutionary beam-on-beam contact interface that minimizes the residual stub for improved signal integrity performance.
ExpressPort® QSFP+
Amphenol's ExpressPort® QSFP+ interconnect system is comprised of a 38 position 0.8mm pitch SMT connector, & a press-fit cage. With four channels of data in one pluggable, the system interface is capable of transferring data up to 16Gb/s per Channel, & replacing up to 4 standard SFP+ receptacles. These features result in greater port density & overall cost savings over traditional SFP+ products.
ExpressPort® SFP+
Amphenol's ExpressPort® SFP+ interconnect system provides data transfer speeds of up to 16Gb/s. The design of the ExpressPort® SFP+ connector minimizes impedance discontinuities & reflections at high data rates & provides a 10-20dB improvement in Near-End Crosstalk. ExpressPort® SFP+ cage construction features EMI shielding available in the form of metal spring fingers or elastomeric gaskets.
Extremeport-Flash
Amphenol’s Extremeport-Flash is an extreme low mating height, easy-to-release high-speed cable solution. We designed 95ohm Flash mainly to support near chip (under heat sink) to IO application, and the mating height is lower than 5mm. Flash can support 56G PAM4, and scalable to 112G PAM4 application, and plug is with pull tab design feature for easy release.
Extremeport-MCIO(Mini Cooledge IO)
Amphenol's Mini Cooledge IO(MCIO) is a high-speed, small mechanical size cable solution. Amphenol MCIO product is now being specified in the SFF group and the project number is SFF-TA-1016. MCIO cable can support PCIe Gen5, and is scalable to PCIe Gen6 and 112G PAM4. We developed 85ohm and 95ohm solutions to support different applications.
Extremeport-Swift
Amphenol’s Extremeport-Swift is an extreme low profile(mating height<9mm), robust mechanical, and excellent SI performance cable solution. The cable assembly and connector can support PCIe Gen5, and the SI performance is scalable to PCIe Gen6 and 112G PAM4. We can provide straight, right angle, and side exit plug types with 38pin, 74pin, and 124pin to support customers to optimize system layout.
ExtremePort™ Flash Connector
Amphenol introduces the next-generation OverPass™ solution - ExtremePort™ Flash. The 0.60mm pitch connector comes with an extremely low profile design capable of transmitting a high-speed signal up to 56G PAM4, and allows much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.
ExtremePort™ OSFP 112G Connectors
112GB/S PAM-4 WITH UP TO 800GB/S AGGREGATED BANDWIDTH
Amphenol's ExtremePort™ OSFP 112G interconnect system is comprised of a 60 position, 0.60mm pitch connector designed for high-speed serial applications. Each port supports up to 800Gb/s in aggregate over an 8 x 112Gb/s electrical interface.
The OSFP footprint is optimized for signal integrity performance.
ExtremePort™ OSFP 224G Connectors
EXTREMEPORT™ OSFP 224G INTERCONNECT SYSTEM
Amphenol's ExtremePort™ OSFP 224G interconnect system is comprised of a 60 position, 0.6mm pitch connector built for use in high-speed serial applications. Each port supports up to 1.6Tb/s in aggregate over an 8x224Gb/s electrical interface. The OSFP footprint is optimized for signal integrity performance.
ExtremePort™ OSFP-XD 112G Connectors
EXTREMEPORT™ OSFP-XD 112G INTERCONNECT SYSTEM
Amphenol's ExtremePort™ OSFP-XD 112G interconnect system is comprised of a 120-position, 0.6mm pitch connector built for use in high-speed serial applications. Each port supports up to 1.6Tb/s in aggregate over a 16 x 112Gb/s electrical interface. The OSFP-XD footprint is optimized for signal integrity performance.