Printed Circuits
Amphenol is a leading design engineer and manufacturer to the printed circuit industry across all markets. Our capabilities are among the world’s most advanced, delivering consistent quality and reliability for demanding high-bandwidth systems and mission-critical applications. We custom design printed circuit boards (PCBs), rigid-flex assemblies, flex circuits, radio frequency (RF), backplane assemblies, and many others for high-speed, high-complexity and high-reliability system solutions.
View our businesses providing Printed Circuits solutions.
DOCSIS Passive
Accommodate 8+ STBs, MoCA controllers, and modems without power supplies or amplification. This means no more premises amplifiers and some serious noise reduction. Each DOCSIS Passive provides dramatic cost savings and cleans up the network.
Electronic Assemblies
Capabilities include automated select solder, press-fit, and hand solder for through hold, single and double-sided BGA's and uBGA's, high-density packages, chip on board, lead-free, and conformal coating (UR, UL, Parylene). Process validation capabilities: 3D Solder Paste Inspection (SPI), Pre and Post-Reflow Automated Optical Inspection (AOI), 3D X-ray, and aqueous and non-aqueous cleaning.
Flexible Printed Circuit Assembly
Amphenol's BergStak®, MezzoStak®, Conan®, ComboStak® and PowerStak® are industry proven board-to-board solutions. To enlarge the advantages of these recognized board-to-board solutions, we have expanded our offering with Flexible Printed Circuit (FPC) assemblies, which provide design flexibility to customers.
Flex/Rigid Flex
We provide our customers with mission-critical high reliability, competitively priced printed circuit products (Conventional, RF/Microwave, HDI, Backplanes, Thermal Management, flex, rigid-flex, Backplanes, and assemblies) that are: High Speed, High Complexity, High Mix, High Reliability, High Value.
High Speed Backplanes
We provide our customers with high reliability, competitively priced Backplane and Backplane assemblies.
Low Dk/Df Material
Backdrill
Press-fit (compliant - pin)
Surface mount
Wave / selective solder
60+ Layers
Up to 0.440" Thick PCB
Up to 24" x 54" panels
Automated Optical Inspection (AOI) of connectors / pins
X-Ray inspection
PCBA (Customised)
Amphenol BSI (ABSI) is providing customised PCBA solutions to the market leaders in the Automotive, Medical, Mobile Device, and IT Datacom sectors. With investments in SMT and Visual/Electrical Test equipment, ABSI operations can facilitate volumes from 10k per year up to 1.5m on a single part number. Passive Assemblies Examples: Display & I/O Boards,
PCB Design
APC has a highly skilled applications and design support team available to collaborate with you on new designs, product updates, wire harness conversions and reverse-engineering of legacy products.
APC Designs meet IPC-2221/2223. Support all typical design platforms and use advanced modeling.
Printed Circuit Boards
We provide our customers with mission-critical high reliability, competitively priced printed circuit products (Conventional, RF/Microwave, HDI, Backplanes, Thermal Management, flex, rigid-flex, Backplanes, and assemblies) that are: High Speed, High Complexity, High Mix, High Reliability, High Value.