Cable Assemblies
Amphenol’s cable assemblies include simple point-to-point cables, custom high-power and high-speed data cable assemblies and complex multi-branch harness assembly for large systems across a broad range of end markets. Our cable assemblies include the latest industry innovations in radio frequency (RF), fiber optics, high-power requirements and high-speed data transfer for the newest systems and applications. In addition, our broad portfolio of cable connectors and accessories can be used in our cable assemblies to provide a complete solution.
View our businesses providing Cable Assemblies solutions.
Non-Magnetic RF Cable Assemblies
SV Microwave’s latest addition to its Non-Magnetic product family introduces high-performance cable assemblies engineered for magnetically sensitive environments. These compact 6" assemblies pair trusted SMA and SMPM interfaces with Ø.047" or Ø.085" flexible cables to deliver low-loss, high-frequency performance in a ready-to-use format. Ideal for applications in quantum computing, test and measurement.
OCP ORv3
Designed based on three decades of experience developing power connectors for specific applications. For use in power shelves, servers, or any other aspect of OCP power management. Extended efforts include offering turn-key AC whip cable assemblies to ORV3 specifications.
OCTIS™ - Hybrid Connectors and Cable Assemblies
OCTIS™ I/O connectors and cable assemblies on a hybrid interface promote bother signal and power transmission over Cat 5e cable in outdoor and harsh environments like Remote Radio Units and small/macro cells. It offers lightning protection, EMI shielding, and is field-installable.
OCTIS™ - Optical Solutions
OCTIS offers a range of optical solutions meeting ever increasing bandwidth requirements. SFP version is interoperable with all types of SFP/SFP+ ports and suitable for high data rate applications over long lengths. QSFP version offers enhanced bandwidth (4X SFP/SFP+).
OCTIS™ - Power Connectors and Cable Assemblies
OCTIS™ I/O connectors and cable assemblies using Amphenol's PwrProfile® interface promote high power transmission in outdoor and harsh environments like Remote Radio Units and small/macro cells. It offers lightning protection, EMI shielding, and is field-installable. The transceiver is held outside the telecom box helping to save on board space and bettering the thermal distribution prospects.
OCTIS™ - RJ45 Connectors and Cable Assemblies
OCTIS™ I/O connectors and cable assemblies using the RJ45 standard interface promote Ethernet-friendly signal transmission in outdoor and harsh environments like Remote Radio Units and small/macro cells. It offers lightning protection, EMI shielding, and is field-installable.
OCTIS™ - Signal Connectors and Cable Assemblies (Metral® HDXS)
OCTIS™ I/O connectors and cable assemblies using Amphenol's Metral® HDXS interface promote signal and PoE++ transmission over Cat 5e and 6 cables in outdoor and harsh environments like Broadband Wireless Access. It offers lightning protection, EMI shielding, and is field-installable.
Omni-Path Copper Cable Assemblies 100G
The Omni-Path verified DAC copper cables, are offered to address the needs of the majority of the inter-cabinet & short-reach intra-cabinet cable connections while minimizing cable bulk & cable routing issues, up to 4 meters using 30AWG cable. Longer-length cables up to 6 meters also maximize the length of copper. These longer cables use 26AWG high-performance bulk cable.
OSFP Cable Assemblies
mphenol is leading the industry in OSFP cable development. Our Electronics Products ʻProduct of the Yearʼ award-winning OSFP (Octal Small Form Factor Pluggable) cable assemblies are compatible with 25G/lane channel NRZ up to 224G/lane channel PAM4 signaling protocols that allow the cables to deliver aggregate bandwidths of 200G, 400G, 800G, and 1.6T per cable assembly.
OSFP OverPass™ Assemblies
DIRECT HIGH SPEED CONNECTION FROM CHIP SITE TO IO PORT
OSFP OverPass™ products remove high speed signaling from the PCB and create an eight channel direct lower loss interconnection between the ASIC site and the external OSFP IO port by overpassing the PCB. This helps to enable 56G and 112G hardware system designs and a technology for future 224G systems.