Mobile Devices
Amphenol designs and manufactures an extensive range of interconnect products, antennas and electromechanical components found in a wide array of mobile computing devices. Amphenol’s capability for high-volume production of these technically demanding, miniaturized products, combined with our speed of new product introduction, are critical drivers of our long-term success in this market. Our solutions address consumer electronics, e-readers, laptops, mobile phones, mobile phone accessories, mobile computing devices, smartphones, tablets, ultrabooks and wearable and hearable devices.
Visit our global sites to learn more: Amphenol Mobile Consumer Products
2.2-5 Connector Series
Amphenol RF's line of 2.2-5 connectors is a lightweight and compact version of the 4.3-10 connector series, designed to accommodate various cable types.
4.3-10 Connector Series
Amphenol RF offers a full range of 4.3-10 connectors and adapters, which are engineered for the wireless market and are ideal for applications requiring low passive intermodulation, or PIM.
Acrylic Sheet Lens
Amphenol has in-house capabilities to create application-specific mobile phone acrylic sheet lenses to fit our customer's precise needs. The sheet lenses are available as plastic or glass. Amphenol has over 10 years of acrylic sheet lens experience. Our lens capacity is over 12 million per month.
AgilBrick™ 1.27mm Board-to-Board Header G802
AgilBrick™ 1.27mm Board-to-Board Header G802 Series offers a cost-effective solution with a flexible structure and 1 to 4 A current rating. These headers from Amphenol ICC can be customized to meet various customer requirements. It comes in customizable pin length, including contact pin and solder tail, which makes it an ideal choice for several applications and specific designs.
AgilBrick™ 2.00mm Board-to-Board Header G825
AgilBrick™ 2.00mm Board-to-Board Header G825 Series offers a cost-effective solution with a flexible structure and 1 to 4 A current rating. These headers from Amphenol ICC can be customized to meet various customer requirements. It comes in customizable pin length, including contact pin and solder tail, which makes it an ideal choice for several applications and specific designs.
AgilBrick™ 2.54mm Board-to-Board Header G800
AgilBrick™ 2.54mm Board-to-Board Header G800 Series offers a cost-effective solution with a flexible structure and 1 to 4 A current rating. These headers from Amphenol ICC can be customized to meet various customer requirements. It comes in customizable pin length, including contact pin and solder tail, which makes it an ideal choice for several applications and specific designs.
AgilLink™ 2.00mm Wire-to-Board Header G823
AgilLink™ 2.00mm Wire-to-Board Header G823 Series is the most common solution for transferring power and signal. It can mate with both wire-to-board and board-to-board applications. This series can carry a maximum current rating of 4A. Amphenol ICC offers a comprehensive range of these headers including, V/T DIP, V/T SMT, R/A DIP to meet various customer requirements.
Audio Jacks
Amphenol's Audio Jacks are widely used in mobile phone applications. These connectors are available in different configurations, e.g. compressed type or for SMT solderable versions, and fully customized to the application requirements.
Battery Connectors
Amphenol’s comprehensive offering of battery connectors for mobile phones comes in single and multi-contact versions with straight and right-angle mountings. They feature stamp and form contacts with additional solder tags for high reliability and conductivity. Amphenol offers right angle and direct compression type, Wire to Board, board to board, blade type and float, or SMT versions.
BergStak+™ 0.80mm Mezzanine Connector
BergStak+™ 0.80mm is designed to be the next generation PCIe 4.0 compliant mezzanine connector system. It is compatible with the existing BergStak® 0.80mm product recommended by the OCP. It guarantees to support up to 16Gb/s performance. Customers can upgrade its board-to-board performance from PCIe 3.0 to PCIe 4.0 while leveraging BergStak+™'s backward compatibility and same footprint feature.