IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
Visit our global sites to learn more: Amphenol Communications Solutions
Board-to-Board 100Ω (0.80mm pitch)
Amphenol high-speed BTB connectors provide high contact force reliability ensuring strong connectivity, forced insertions, and removals. A broad range of stacking heights & pin counts is offered to provide maximum design flexibility. With superior signal integrity (SI) performance, this 0.80mm pitch connector design is suitable for high-performance applications & meets SAS 3.0, 12GT/s.
Board-to-Board 85Ω (0.60mm pitch)
Amphenol high-speed BTB connectors provide high contact force reliability ensuring strong connectivity, forced insertions, and removals. A broad range of stacking heights & pin counts is offered to provide maximum design flexibility. With superior signal integrity (SI) performance, this 0.60mm pitch connector design is suitable for high-performance applications & meets PCIe Gen 3, 8GT/s.
Board-to-Board 85Ω (0.80mm pitch)
Amphenol high-speed BTB connectors provide high contact force reliability ensuring strong connectivity, forced insertions, and removals. A broad range of stacking heights & pin counts is offered to provide maximum design flexibility. With superior signal integrity (SI) performance, this 0.80mm pitch connector design is suitable for high-performance applications & meets PCIe Gen 3, 8GT/s.
Board-to-Board Connectors (0.50mm pitch)
0.50MM PITCH, 85Ω BOARD-TO-BOARD SOLUTION
Amphenol high-speed board-to-board connectors provide high contact force reliability ensuring strong connectivity, forced insertions, and removals. A broad range of stacking heights and pin counts are offered to provide maximum design flexibility. Amphenol 0.50mm pitch connector design is suitable for high-performance applications.
Board-to-Board Connectors - B401/B402 Series (0.80mm pitch)
HIGH DENSITY VERTICAL BOARD-TO-BOARD CONNECTORS
Amphenol's B401/B402 series is 0.80mm pitch board-to-board connectors designed for high-density applications. They support stack heights up to 10mm and 100 positions. These connectors feature surface mount terminations and are available in a comprehensive range to satisfy different customer requirements.
Board-to-Board RF Connectors
Amphenol RF offers a variety of board-to-board solutions engineered to maximize radial and axial float, eliminating the need for cables between the boards and simplifying designs to eliminate assembly errors.
C2E High Density Fiber Distribution Panel
The C2E chassis provides a Data Center solution that is dense, modular and tray based. It is offered as either a dedicated Base-8 solution using the C2 Base-8 modules for MPO or MTP breakout modules, or a dedicated Base-12 version.
C2Storage: Bulk Fiber Storage Tray
Fiber cable entry and exit gates have a front-facing door that opens to make it easier to get fibers in and out of the tray. The gates are several times larger than those in legacy slack storage trays, producing an industry-leading 96 1.6mm fiber cable capacity. The routing arcs within the tray have movable fingers, which greatly facilitates accessing the fibers during and after installation.
C2X Fiber Distribution Panel
The C2X chassis' supports multiple patch, patch/splice, and pre-terminated fiber configurations available in either bulkhead or cassette solutions. C2X tray-based option accepts C2 AOMs (Advanced Optical Modules) for patch, patch/splice, as well as splitters, MPO breakouts, and WDMs. C2X is available in 1, 2, 3, or 4RU and supports vast fiber counts.
Cascade 1RU Bulkhead Panel
The Cascade Panel is a 1RU chassis with spaces for 4x custom patch plates at a total density of 96 LCs in a single rack unit. The Cascade Panel has a sliding tray that brings the adapters forward, allowing for easier
access when performing moves, adds, or changes. Its simple,
streamlined design provides a balance of density and usability
when connecting multiple LC or MPO connections.
Ceramic Injection Molding
Amphenol's CIM process uses ceramic zirconium to provide a scratch and wear-resistant surface to components such as mobile phone camera decoration and side keys. The CIM material provides additional durability and strength to your products. We have applied our Metal Injection Molding (MIM) experience of large volume runs to CIM to create a hi-tech material process.
CFP 100G Transceivers
Amphenol 100G CFP/CFP2/CFP4 series optical transceivers support from 10km to 40km reach, adopt LC interface, compatible with IEEE802.3ba, MSA, and other standards. It has the characteristics of low power consumption, dual rate, and high speed. It is widely applied in large data centers, telecom, and other environments.
CFP2
Amphenol's CFP2 series offers a 104 position, 0.6mm pitch connector designed to be compatible with 100Gb/s Form Factor Pluggable (CFP) Multi-Source Agreement for Ethernet and other applications. Rated for 25Gb/s per channel with resonance dampening for improved signal integrity, CFP2 has up to 60% lower power consumption versus CFP.
CFP4
Amphenol's CFP4 series offers a 56 position, 0.6mm pitch connector, and is used in multi-hundred Gb/s systems. Rated for 25Gb/s per channel with resonance dampening for improved signal integrity, CFP4 has up to 60% lower power consumption versus CFP. The CFP4 series includes a plug connector on the mating interface to improve accuracy and aid in delivering high-speed performance.
CFP8
Amphenol's CFP8 interconnect system has 124 contacts per port, with a 0.5mm contact pitch and 16 high-speed channels. It is rated for 28Gb/s per channel with resonance dampening for improved signal integrity. It is comprised of insert molding assemblies for top side contacts and Press-Fit cage assemblies.
Chameleon®
With performance speeds up to 25 Gbps+, Chameleon meets the demand for faster, smaller, and more compact connector solutions. With stack heights from 6mm to 10mm in 1mm increments, pin counts from 40 to 500+, and pair counts from 16 to 160, Chameleon provides you with a ready platform to easily change and adapt to your design requirement.
cLGA®
The Amphenol ICC cLGA® land grid array socket system was designed to bring conventional connector material construction to high-performance, low-cost chip-to-board applications. cLGA® sockets are used in applications ranging from handheld computer products to supercomputer systems. The cLGA® socket is fully qualified under Telcordia GR-1217-CORE specifications.
Coaxial Fixed Attenuators
Amphenol RF attenuators are designed to offer flat attenuation over the designated frequency range and feature a microwave grade resistor that consistently reduces power. Hex flats on the body allow this attenuator to be easily torqued to the mating connector.
Coaxial Inserts
Size 8 coaxial inserts for DIN and D-Sub applications. Available for common flexible coaxial cables.
Combo-D
Positronic Combo-D connectors are a combination of signal and power and are part of the D-sub family. Combo-D connectors are used in military, communications, space, industrial, and medical applications. These connectors are available in various performance levels for the best cost/performance ratio.