IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
Visit our global sites to learn more: Amphenol Communications Solutions
OSFP-XD Copper Cable Assemblies
Amphenol is at the forefront of OSFP-XD (Octal Small Form Factor Pluggable eXtra Dense) cable development, setting new industry standards with our innovative designs. Our advanced OSFP-XD cable assemblies are designed to meet the rigorous demands of both PCIe® Gen 5 and Ethernet protocols, providing a future-proof solution with unparalleled bandwidth capabilities.
Outside Plant Passives (OSP)
Optical passives ranging from 4 to 40 channel counts. They can be configured with optional express, upgrade, and test ports to support a variety of applications. The packaging comes in two forms, the HiDT (channel counts 8 or less) and the OSP AOM (channel counts 12 and higher), both providing stable optical performance across a wide operating temperature range for OSP deployment.
OverPass™ Cable System
Amphenol's OverPass™ cable system offers a broad range of capabilities that allow our customers to efficiently transmit high-speed signals from near an ASIC to anywhere in their system.
Paladin® 112Gb/s Backplane Cable
Cable Backplane Systems is part of Amphenol's Highspeed Backplane Product business, dedicated to developing and manufacturing cabled backplane solutions for next-generation system architectures. Our customers are leading providers of data center switches and routers, enterprise servers, and high-performance computers.
Paladin® 112Gb/s Backplane Connector
AMPHENOL'S GAME-CHANGING 112Gb/s BACKPLANE INTERCONNECT TECHNOLOGY.
Paladin's® revolutionary architecture sets the benchmark for signal integrity performance in backplane interconnects. Exhibiting smooth linear transmission beyond 40GHz, the lowest crosstalk in the market, and consistent SI performance over its entire mating range.
Paladin® HD 224Gb/s Backplane Interconnect System
INDUSTRY LEADING DENSITY AND PERFORMANCE – YOUR PATH TO 224GB/S
The Paladin® HD interconnect system provides world class bandwidth from 112Gb/s to 224Gb/s with industry leading density, supporting up to 144 differential pairs orthogonally within 1U spacing. Paladin® HD's unique mating interface allows for consistent performance in a de-mated condition, critical for next generation systems.
PanelMate™ Family
Amphenol Sine Systems’ PanelMate™ Family of receptacles are engineered with a one-piece, sealed, flanged design for rapid and secure mounting. Their durable, high-temperature, silicone, facial seal provides a barrier of protection from lubricating oils, hydraulic fluids and fossil fuels to withstand the challenges and complexities of harsh environment applications.
PCBA (Customised)
Amphenol BSI (ABSI) is providing customised PCBA solutions to the market leaders in the Automotive, Medical, Mobile Device, and IT Datacom sectors. With investments in SMT and Visual/Electrical Test equipment, ABSI operations can facilitate volumes from 10k per year up to 1.5m on a single part number. Passive Assemblies Examples: Display & I/O Boards,
PCI
The Compact Power connector series was developed with the PCI Industrial Computer Manufacturers Group (PICMG) as the power interface for plug-in power supplies or other chassis mount applications. It delivers high current through a small package and three levels of sequential mating.
PCIe Over Optics- Linear Pluggable Optics (LPO)
QSFP-DD Linear Pluggable Optics. Type II QSFP-DD Form Factor. PCIe Gen 5.0 protocol. 8 Channel full-duplex transceiver. Lengths up to 50m OM4.
Power dissipation < 5W
PCIe® Gen 4 M.2 1A Card Edge Connectors
Amphenol's PCIe® Gen 4 M.2 1A connectors provide 67 contacts on 0.50mm pitch and signal transmission speed of 16Gb/s. It occupies less board space, offers more connector height options. It is designed for PCIe® 4.0 1A applications, making it suitable for tablets, laptops and low profile storage and server applications.
PCIe® Gen 6 Mini Cool Edge 0.60mm Card Edge Connectors
Mini Cool Edge is a 0.60mm high-density, high-speed card edge connector for new-generation small form factor systems. This fine-pitch solution offers multiple BTB applications like right-angle, mezzanine, and coplanar connectors. Cable options are available for a complete interconnect solution.
PCIe® Gen 6 Mini Cool Edge IO Connector
Amphenol introduces the next-generation OverPass™ solution - Mini Cool Edge IO. The 0.60mm pitch connector comes with a slim form factor design, capable of transmitting high-speed signals up to 64G PAM4/PCIe® Gen 6 and allowing much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.
PCIe® Gen 7 Mini Cool Edge IO Connector
Amphenol introduces the next-generation OverPass™ solution: the Mini Cool Edge IO. This connector features a 0.60mm pitch and a slim form factor design, and is capable of transmitting high-speed signals of up to 128G PAM4/PCIe® Gen 7. It allows for significantly longer signal path lengths while maintaining superior signal integrity (SI) performance compared to traditional PCB routing methods.
PCIe® M.2 Gen 3 and Gen 4 Card Edge Connectors
Amphenol's PCIe® M.2 Gen 3 and Gen 4 connectors provide 67 contacts on 0.50mm pitch. It occupies less board space, offers more connector height options, and supports higher data rates compared to PCIe® Mini Card connector. It is designed for PCIe® 3.0, USB 3.0, and SATA 3.0 applications, making it suitable for tablets, laptops, and low-profile storage and server applications.
PCIe® M.2 Gen 5 Card Edge Connectors
Amphenol's PCIe® M.2 Gen 5 Connectors provide 67 contacts on 0.50mm pitch. It occupies less board space, offers more connector height options, and supports higher data rates compared to PCIe® Mini Card connector. It is designed for PCIe® Gen 5, making it suitable for tablets, laptops, and low-profile storage and server applications.
PCI Express® DirectAttached™ CEM Card Edge Connectors
Amphenol's 1.0mm pitch DirectAttached™ CEM (DA CEM) is a hybrid card edge solution with high-speed signal pins designed to directly attach to the cable to eliminate PCB trace loss and press-fit termination type power pins for better rework. Amphenol has tooled Gen 5 DA CEM with configurations available for X8 and X16, at 32GT/s data rate to meet PCIe® Gen 5.
PCI Express® Flip CEM Card Edge Connectors
The PCIe® Gen 5 Flip CEM is a new 1.0mm pitch vertical card edge connector that follows PCIe® standard mating interface. It is designed with a different footprint because the contacts are “JJ” type or “LL” contacts which provide maximum savings of up to 19.5% in keepout area. The current Flip CEM supports 32GT/s (Gen 5) and the mating side supports backward compatibility with PCIe® 4/3/2/1 card.
PCI Express® Gen 3 Card Edge Connectors
Amphenol's 1.00mm pitch, vertical card edge connectors enable PCI Express® (PCIe®) signaling from 2.5Gb/s (Gen 1) and 5Gb/s (Gen 2) up to 8Gb/s (Gen 3) per differential signal pair. A modular design of these connectors allows standard pin counts like 36, 64, 98, 164, and 280.
PCI Express® Gen 4 and Gen 5 Card Edge Connectors
PCIe® Gen 4 and Gen 5 connectors outperform industry-standard PCIe® 4.0 and 5.0 (Proposed) requiring higher speed performance. The optimized series supports backward mating and is footprint compatible with PCIe 3/2/1. Amphenol's expansive range of vertical PCIe® Gen 4 and Gen 5 connectors will include options for SMT, through-hole solder, press-fit (PF), and straddle mount terminations.