IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
Visit our global sites to learn more: Amphenol Communications Solutions
ASGTC-Q
ASGTC-Quadrax is a special circular bayonet coupling connector for data line transmission in RMT application, It's IP67 protection and with a self-locking system specially designed in order to get heavy duty application, Q-contacts with the protection of copper body and multipoints band in female contact to provide to 360º shielding.
BarKlip® BK100 I/O
BarKlip® BK100 I/O provides a convenient method of distributing up to 100A between busbars, cables and circuit boards. It features 12 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases the efficiency and reliability of current transition.
BarKlip® BK150 Connector
LOW RESISTANCE BUSBAR CONNECTOR
The BarKlip® BK150 connector features 10 independent conducting beams that maintain contact with the mating busbar in common misaligned positions, therefore lowering resistance connectors.
BarKlip® BK200 I/O
BarKlip®BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables and circuit boards. It features 14 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases the efficiency and reliability of current transition.
BarKlip® BK300 Connector
The BarKlip® BK300 connector features 14 independent conducting beams that maintain contact with the mating busbar. BK300's contacts are plated with Amphenol's proprietary silver-based AGT® plating technology to further reduce contact resistance and eliminate fretting corrosion commonly found in tin-plated connectors.
BarKlip® XP Connectors
HIGH POWER AND LOW RESISTANCE BUSBAR CONNECTOR
Amphenol's BarKlip® XP connectors feature independent points of contact that provide overall lower resistance and greater overall efficiency. BarKlip® XP series is capable of distributing anywhere from 150 to 1000A of power to busbar power distribution applications.
Barrier Terminal Blocks
EBY offers a complete selection of industry standard terminal blocks and barrier strips - which may be customized to your needs - support a broad range of wire-to-board and wire-to-wire configurations.
For bare or terminated wires
Wire-to-board or wire-to-wire feed-through styles
No special tools required for installation
Easy field termination
Flexible design options - contact us!
BergStak HS™ 0.50mm Mezzanine Connector
FLEXIBLE SOLUTION FOR HIGH-SPEED APPLICATIONS
BergStak HS™ 0.50mm connector is a flexible solution designed for high speed and high density, parallel board-to-board applications with various heights in different sizes.
The BergStak HS™ 0.50mm connector series meets the new 25Gb/s and 32Gb/s performance requirements.
BergStak HS™ 0.80mm Board-to-Board Connector
FLEXIBLE SOLUTION FOR HIGH-SPEED APPLICATION
FCI Basics BergStak HS™ connector family is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. BergStak HS™ 0.80mm connector family with 0.80mm pitch enables high-speed data applications with up to PCIe® Gen 5 32Gb/s.
BergStak+™ 0.80mm Mezzanine Connector
BergStak+™ 0.80mm is designed to be the next generation PCIe 4.0 compliant mezzanine connector system. It is compatible with the existing BergStak® 0.80mm product recommended by the OCP. It guarantees to support up to 16Gb/s performance. Customers can upgrade its board-to-board performance from PCIe 3.0 to PCIe 4.0 while leveraging BergStak+™'s backward compatibility and same footprint feature.