With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
Amphenol is at the forefront of OSFP-XD (Octal Small Form Factor Pluggable eXtra Dense) cable development, setting new industry standards with our innovative designs. Our advanced OSFP-XD cable assemblies are designed to meet the rigorous demands of both PCIe® Gen 5 and Ethernet protocols, providing a future-proof solution with unparalleled bandwidth capabilities.
Optical passives ranging from 4 to 40 channel counts. They can be configured with optional express, upgrade, and test ports to support a variety of applications. The packaging comes in two forms, the HiDT (channel counts 8 or less) and the OSP AOM (channel counts 12 and higher), both providing stable optical performance across a wide operating temperature range for OSP deployment.
Amphenol's OverPass™ cable system offers a broad range of capabilities that allow our customers to efficiently transmit high-speed signals from near an ASIC to anywhere in their system.
Cable Backplane Systems is part of Amphenol's Highspeed Backplane Product business, dedicated to developing and manufacturing cabled backplane solutions for next-generation system architectures. Our customers are leading providers of data center switches and routers, enterprise servers, and high-performance computers.
AMPHENOL'S GAME-CHANGING 112Gb/s BACKPLANE INTERCONNECT TECHNOLOGY.
Paladin's® revolutionary architecture sets the benchmark for signal integrity performance in backplane interconnects. Exhibiting smooth linear transmission beyond 40GHz, the lowest crosstalk in the market, and consistent SI performance over its entire mating range.
INDUSTRY LEADING DENSITY AND PERFORMANCE – YOUR PATH TO 224GB/S
The Paladin® HD interconnect system provides world class bandwidth from 112Gb/s to 224Gb/s with industry leading density, supporting up to 144 differential pairs orthogonally within 1U spacing. Paladin® HD's unique mating interface allows for consistent performance in a de-mated condition, critical for next generation systems.
Amphenol Sine Systems’ PanelMate™ Family of receptacles are engineered with a one-piece, sealed, flanged design for rapid and secure mounting. Their durable, high-temperature, silicone, facial seal provides a barrier of protection from lubricating oils, hydraulic fluids and fossil fuels to withstand the challenges and complexities of harsh environment applications.
Amphenol BSI (ABSI) is providing customised PCBA solutions to the market leaders in the Automotive, Medical, Mobile Device, and IT Datacom sectors. With investments in SMT and Visual/Electrical Test equipment, ABSI operations can facilitate volumes from 10k per year up to 1.5m on a single part number. Passive Assemblies Examples: Display & I/O Boards,
The Compact Power connector series was developed with the PCI Industrial Computer Manufacturers Group (PICMG) as the power interface for plug-in power supplies or other chassis mount applications. It delivers high current through a small package and three levels of sequential mating.
QSFP-DD Linear Pluggable Optics. Type II QSFP-DD Form Factor. PCIe Gen 5.0 protocol. 8 Channel full-duplex transceiver. Lengths up to 50m OM4.
Power dissipation < 5W