IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
Visit our global sites to learn more: Amphenol Communications Solutions
Heavy Duty Shielded M20 Connectors
Amphenol LTW’s Heavy Duty Shielded M20 is designed by following IEC standards and offers rugged & reliable solutions in specific markets and applications with signal transmission up to 5A / 250V and power up to 10A/20A & 250V/300V.
Features: IP68, Salt spray 500h, Current rating up to 40A, Shielded design for reliable data transmission, Sealing nut with cable cover to ensure better cable holding
High Density D-Sub
Positronic offers a variety of standard and high-density D-subs, as well as accessories and ComboD-sub connectors. Highly reliable with precision-machined contacts, our connectors meet various industrial and military performance levels for applications from basic power supplies to advanced weapon systems and flight. Explore our design features including package size, contact, and mating variants.
High Density Low Profile Cable Assemblies
SV Microwave redefines tight-space RF routing with our next-generation Low Profile RF Cable Assemblies. In standard coaxial cable assemblies, a common failure point occurs from breakage caused by solder wicking. During assembly, molten solder can escape the primary joint between the connector and the cable. This solder travels up the outer braid via capillary action, where it cools and hardens.
High Performance RF Adapters
SV Microwave has released a line of high-performance adapters capable of excellent signal performance up to 65 GHz. These between-series adapters are configured with a reliable, easily-calibrated, and consistent threaded interface on one end and a convenient high-density push-on interface on the other, making them ideal for various applications.
High Speed Backplane (Customised)
Amphenol BSI (ABSI) are the trusted technology leader for more than 30 years in the Backplane & Midplane business. We design, build and test customised Backplane & Midplane solutions for most of the global leaders in IT Datacom and Telecoms technology systems. We have products performing to 56gb/s today in the production environment with speeds up to 112 Gb/s PAM4 in development.
High Speed Edge Launch PCB Connectors
Amphenol SV Microwave offers a complete line of extreme frequency (DC - 100 GHz) coaxial / RF edge launch PCB connectors that meet the need for high-performing, highly reliable precision connectors. Current RF test connector configurations include single and multiport 2.92 mm, 2.4 mm, 1.85 mm, SMA, SMP, SMPM, and SMPS variations.
HPCE® Board to Board Connector
The HPCE® BTB is a board-to-board high power connector for demanding applications requiring high linear current density and small connector size. It is part of Amphenol's HPCE® series family together with HPCE and HPCE cable assembly. HPCE® BTB is ideal for next-generation 1U/2U servers, storage enclosures, telecommunications equipment, and datacom/ networking equipment.
HPCE® Cable Assembly
The HPCE® cable assembly is a next-generation power cable assembly for demanding applications requiring high linear current density and low power loss. It offers both one-piece (cable to card edge) and two-piece (cable to header) solutions. Both have a low profile height (7.5mm) and are based on very cost-effective and highly reliable stamped-and-formed power contact.
HPCE® High Power Card Edge Connector
The High Power Card Edge (HPCE®) connector is a next-generation power card edge connector for demanding applications requiring high linear current density and low power loss. HPCE offers a low profile height (7.50mm) and is based on very cost-effective and highly reliable stamped-and-formed power contact technology similar to other power solutions from Amphenol.
HPCE® Mezzanine Connector
The HPCE® Mezzanine is a next-generation power board-to-board for demanding applications requiring variable stack heights and high linear current density. It offers both receptacle and recommended PCB Bridge. Both are based on very cost-effective and highly reliable stamped-and-formed power contact technology similar to other power solutions from Amphenol.