IT Datacom

With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.

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Product Blind Mate - X-Lok Push-Lock Connector
Blind Mate - X-Lok Push-Lock Connector
Amphenol LTW’s X-Lok Connectors are presented in various sizes for power, signal and hybrid applications for fast, simple and reliable connections. Featuring a push lock mechanism for intuitive mating with audible and tactile feedback. The X-Lok provides less mating failure & quicker installation than traditional threaded solutions【Quick guide: https://amphenolltw.com/down.php?supp_download=112】

Product BMB RF Interconnects
BMB RF Interconnects
SV Microwave’s latest product line offers a comprehensive range of RF interconnects, including standard and bulkhead cable connectors for a variety of cable types and PCB connectors ideal for use in board-to-board solutions, with connectors in both Full Detent and Smooth Bore options, as well as a bullet. This product line is rated to work up to 22 GHz, ensuring reliable and high-performance RF solutions.

Product Board-to-Board RF Connectors
Board-to-Board RF Connectors
Amphenol RF offers a variety of board-to-board solutions engineered to maximize radial and axial float, eliminating the need for cables between the boards and simplifying designs to eliminate assembly errors.

Product Board-to-Board Solutions
Board-to-Board Solutions
Amphenol CDI offers reliable, high‑performance board‑to‑board interconnect solutions engineered for secure PCB‑to‑PCB connections in demanding applications. Built with precision and durability in mind, these connectors support stable signal integrity, robust mechanical alignment, and long‑term performance across aerospace, defense, industrial, and communication systems.

Product Boltrack™ Connector
Boltrack™ Connector
FCI Basics Boltrack™ connector promotes signal and PoE++ transmission over Cat 5e and 6 cables in a wide range of datacom and industrial applications. It offers lightning protection, EMI shielding, and is field-installable. Boltrack™ connector comes in a 4-pair right-angle board receptacle and cable plug mating combination. The connector can resist voltages up to 2,500V.

Product Breathable Vent
Breathable Vent
Amphenol LTW provides a comprehensive product range of Breathable Vent. The Vents help control pressure release within safe operating limits, specifically designed to balance internal and external pressures. Range: M6, M8, M10, Fit-In Plastic/Metal (Oil Filtration), M12, M14, M24, M32 & Rectangular【Quick Guide: https://amphenolltw.com/down.php?supp_download=103】Video: https://youtu.be/dke5JH_B2A0

Product C2E High Density Fiber Distribution Panel
C2E High Density Fiber Distribution Panel
The C2E chassis provides a Data Center solution that is dense, modular and tray based. It is offered as either a dedicated Base-8 solution using the C2 Base-8 modules for MPO or MTP breakout modules, or a dedicated Base-12 version.

Product C2Storage: Bulk Fiber Storage Tray
C2Storage: Bulk Fiber Storage Tray
Fiber cable entry and exit gates have a front-facing door that opens to make it easier to get fibers in and out of the tray. The gates are several times larger than those in legacy slack storage trays, producing an industry-leading 96 1.6mm fiber cable capacity. The routing arcs within the tray have movable fingers, which greatly facilitates accessing the fibers during and after installation.

Product C2X Fiber Distribution Panel
C2X Fiber Distribution Panel
The C2X chassis' supports multiple patch, patch/splice, and pre-terminated fiber configurations available in either bulkhead or cassette solutions. C2X tray-based option accepts C2 AOMs (Advanced Optical Modules) for patch, patch/splice, as well as splitters, MPO breakouts, and WDMs. C2X is available in 1, 2, 3, or 4RU and supports vast fiber counts.

Product Cable Joiner & FICX Connectors
Cable Joiner & FICX Connectors
Amphenol LTW’s Cable Joiner was designed and developed for simple, quick and reliable cable interconnections. It is available in several options to meet various cable O.D. and wire sizes. It also meets the latest requirements for locking protection【Quick guide: https://amphenolltw.com/down.php?supp_download=91】

Product Candlestick Panel Connectors
Candlestick Panel Connectors
Engineered with precision machining and high-quality materials, these connectors ensure superior shielding, low insertion loss, and resistance to harsh environmental conditions. The candlestick design allows for optimized connectivity and easy integration into panel-mounted RF applications, making them ideal for mission-critical systems.

Product Cascade 1RU Bulkhead Panel
Cascade 1RU Bulkhead Panel
The Cascade Panel is a 1RU chassis with spaces for 4x custom patch plates at a total density of 96 LCs in a single rack unit. The Cascade Panel has a sliding tray that brings the adapters forward, allowing for easier access when performing moves, adds, or changes. Its simple, streamlined design provides a balance of density and usability when connecting multiple LC or MPO connections.

Product CDFP Cable Assemblies
CDFP Cable Assemblies
Amphenol CDFP cable assemblies are designed to meet emerging data center and high-performance computing application needs for high density cabling interconnect systems capable of delivering 32GT/s per lane (Gen 5.0). CDFP has 16 lanes, capable to deliver 64Gbps. This interconnect system is fully compliant with existing industry standard specifications SFF-TA-1032.

Product Ceramic Injection Molding
Ceramic Injection Molding
Amphenol's CIM process uses ceramic zirconium to provide a scratch and wear-resistant surface to components such as mobile phone camera decoration and side keys. The CIM material provides additional durability and strength to your products. We have applied our Metal Injection Molding (MIM) experience of large volume runs to CIM to create a hi-tech material process.

Product Ceres Circular Connector
Ceres Circular Connector
Amphenol LTW Ceres Connectors are environmentally sealed, up to IP68, rugged, and cost-effective, available in plastic and metal. Our Ceres provides a comprehensive size range and variety of mating styles such as screw, lock bayonet, and push-lock to meet various harsh environments and are suitable for power and data applications【Quick guide: https://amphenolltw.com/down.php?supp_download=92】.

Product CFP2
CFP2
Amphenol's CFP2 series offers a 104 position, 0.6mm pitch connector designed to be compatible with 100Gb/s Form Factor Pluggable (CFP) Multi-Source Agreement for Ethernet and other applications. Rated for 25Gb/s per channel with resonance dampening for improved signal integrity, CFP2 has up to 60% lower power consumption versus CFP.

Product CFP4
CFP4
Amphenol's CFP4 series offers a 56 position, 0.6mm pitch connector, and is used in multi-hundred Gb/s systems. Rated for 25Gb/s per channel with resonance dampening for improved signal integrity, CFP4 has up to 60% lower power consumption versus CFP. The CFP4 series includes a plug connector on the mating interface to improve accuracy and aid in delivering high-speed performance.

Product CFP8
CFP8
Amphenol's CFP8 interconnect system has 124 contacts per port, with a 0.5mm contact pitch and 16 high-speed channels. It is rated for 28Gb/s per channel with resonance dampening for improved signal integrity. It is comprised of insert molding assemblies for top side contacts and Press-Fit cage assemblies.

Product Chameleon®
Chameleon®
With performance speeds up to 25 Gbps+, Chameleon meets the demand for faster, smaller, and more compact connector solutions. With stack heights from 6mm to 10mm in 1mm increments, pin counts from 40 to 500+, and pair counts from 16 to 160, Chameleon provides you with a ready platform to easily change and adapt to your design requirement.

Product cLGA® Chip-to-Board Socket
cLGA® Chip-to-Board Socket
HIGH PERFORMANCE, LOW COST CHIP-TO-BOARD APPLICATION The Amphenol cLGA® land grid array socket system was designed to bring conventional connector material construction to high performance, low cost chip-to-board applications. Gold over nickel-plated copper alloy spring contacts guarantee long-term connector performance, contact retention and ruggedness.

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