With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
Amphenol's BarKlip® BK100 I/O provides a convenient method of distributing up to 100A between busbars, cables and circuit boards. It features 12 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases the efficiency and reliability of current transition
HIGH POWER OCP-COMPATIBLE CABLE ASSEMBLY COMPLIANT WITH OPEN COMPUTE POWER DISTRIBUTION ARCHITECTURE
Amphenol's BarKlip® BK1200 HD I/O power cable assemblies feature an OCP-compatible design, compliant with ORv3 power distribution architecture standards. Barklip® BK1200 HD I/O can distribute up to 1250A per contact, load and return, and up to 2500A total.
The BarKlip® BK150 connector features 10 independent conducting beams that maintain contact with the mating busbar in common misaligned positions, therefore significantly lowering overall resistance.
BarKlip® BK150's contacts include a stainless- steel helper spring to ensure that proper mating force is maintained and contact resistance is minimized throughout the life of the connection.
BarKlip®BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables and circuit boards. It features 14 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases the efficiency and reliability of current transition.
The BarKlip® BK300 connector features 14 independent conducting beams that maintain contact with the mating busbar. BK300's contacts are plated with Amphenol's proprietary silver-based AGT® plating technology to further reduce contact resistance and eliminate fretting corrosion commonly found in tin-plated connectors.
Amphenol's BarKlip® BK450 connector is designed to mate directly with a 3.18mm single pole busbar and provides a convenient method of distributing up to 450A between busbars. The connector system features 36 independent points of gold-plated contact beams ensuring high current carrying capability and low contact resistance.
OCP-COMPATIBLE POWER CABLE ASSEMBLY COMPLIANT WITH OPEN COMPUTE POWER DISTRIBUTION ARCHITECTURE
Amphenol's BarKlip® BK600 I/O power cable assemblies feature an OCP-compatible design compliant with ORv3 power distribution architecture standards. Barklip® BK600 I/O can distribute up to 700A between busbars, cables, and circuit boards.
FLEXIBLE SOLUTION FOR HIGH-SPEED APPLICATIONS
Amphenol's FCI Basics BergStak HS™ connector family is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. BergStak HS™ 0.50mm connector family with 0.50mm pitch enables high-speed data applications with up to PCIe® Gen 5 32Gb/s.
FLEXIBLE SOLUTION FOR HIGH-SPEED APPLICATION
FCI Basics BergStak HS™ connector family is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. BergStak HS™ 0.80mm connector family with 0.80mm pitch enables high-speed data applications with up to PCIe® Gen 5 32Gb/s.
BergStak+™ 0.80mm is designed to be the next generation PCIe 4.0 compliant mezzanine connector system. It is compatible with the existing BergStak® 0.80mm product recommended by the OCP. It guarantees to support up to 16Gb/s performance. Customers can upgrade its board-to-board performance from PCIe 3.0 to PCIe 4.0 while leveraging BergStak+™'s backward compatibility and same footprint feature.
The BergStak® 0.40mm board-to-board connectors are in 0.4mm pitch with double row contacts, the family now supports stack height of 1.50/2.0/3.0/3.5/4.0mm and position ranges in 10-100 positions (10/20/24/30/34/40/50/60/70/80/90/100). The lock feature on contacts works together with shock-absorbing ribs on the housing to make it suitable for high-vibration applications and friendly for FPC applications.
MICRO PITCH LOW PROFILE HIGH SPEED BOARD-TO-BOARD CONNECTOR
BergStak® 0.635mm pitch is a compact board-to-board connector with low stack height of 3.00mm. Available in 80 and 140 positions it support applications which require high pin counts and low profile connection.
BergStak® 0.635mm supports signal speeds up to 8Gb/s with an open-pin-field, providing design flexibility.
FCI Basics BergStak® 0.80mm connector family is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. Bergstak® shielded connector with 0.80mm pitch supports high-speed data applications up to 10Gb/s.
FCI Basics BergStak® product range is expanded to include 0.50mm BergStak® FX10 board-to-board connector known for its fast data transmission and high signal quality. This connector is offered in 144 positions and is available in 4.30mm and 6.00mm stack height options. Position is extendable up to 168 positions.
BergStak® FX10 supports speed performance up to 15Gb/s+ and is available in vertical SMT
The BergStak® Secure connector family contains one-time-use and multi-times-use solutions to support customers' different needs on connection security. The family now contains variants with 3-row and 4-row contacts with 37 columns per row, and it can be extended in both (10)row and (100)column direction based on customer requirements, to fulfill high pin count/high signal density requirements.
Amphenol LTW’s X-Lok Connectors are presented in various sizes for power, signal and hybrid applications for fast, simple and reliable connections. Featuring a push lock mechanism for intuitive mating with audible and tactile feedback. The X-Lok provides less mating failure & quicker installation than traditional threaded solutions【Quick guide: https://amphenolltw.com/down.php?supp_download=112】
Amphenol LTW provides a comprehensive product range of Breathable Vent. The Vents help control pressure release within safe operating limits, specifically designed to balance internal and external pressures. Range: M6, M8, M10, Fit-In Plastic/Metal (Oil Filtration), M12, M14, M24, M32 & Rectangular【Quick Guide: https://amphenolltw.com/down.php?supp_download=103】Video: https://youtu.be/dke5JH_B2A0
Amphenol LTW’s Cable Joiner was designed and developed for simple, quick and reliable cable interconnections.
It is available in several options to meet various cable O.D. and wire sizes. It also meets the latest requirements for locking protection【Quick guide: https://amphenolltw.com/down.php?supp_download=91】
Amphenol CDFP cable assemblies are designed to meet emerging data center and high-performance computing application needs for high density cabling interconnect systems capable of delivering 32GT/s per lane (Gen 5.0). CDFP has 16 lanes, capable to deliver 64Gbps. This interconnect system is fully compliant with existing industry standard specifications SFF-TA-1032.
Amphenol LTW Ceres Connectors are environmentally sealed, up to IP68, rugged, and cost-effective, available in plastic and metal. Our Ceres provides a comprehensive size range and variety of mating styles such as screw, lock bayonet, and push-lock to meet various harsh environments and are suitable for power and data applications【Quick guide: https://amphenolltw.com/down.php?supp_download=92】.