With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
AgilLink™ 1.50mm Wire-to-Board G886 series is the most common solution for transferring power and signal. This series can carry a maximum current rating of 2.5A. Amphenol offers a comprehensive range of these headers including, vertical and right-angle DIP, and vertical and right angle SMT, to meet various customer requirements. It comes with customizable pin length, latch, or location post...
AgilLink™ 2.54mm wire-to-board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 3A. Amphenol offers a comprehensive range of these headers including V/T DIP, V/T SMT, R/A DIP, R/A SMT to meet various customer requirements. It comes with customizable pin length, latch or location post, which makes it an ideal choice for several applications
AgilLink™ 3.96mm wire-to-board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 6A. Amphenol offers a comprehensive range of these headers including V/T DIP, V/T SMT, R/A DIP, R/A SMT to meet various customer requirements. It comes with customizable pin length which makes it an ideal choice for several applications and specific designs.
AirMax VS2® connectors provide a migration path from AirMax VS® for speeds up to 20Gb/s, providing a margin of safety for typical 802.3ap system performance with the flexibility of an open pin field design. The connectors leverage AirMax VS® and VSe® design features and technology to achieve improved signal integrity and mechanical attributes compared to AirMax VS® connectors.
HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE WITH ENHANCED PERFORMANCE
AirMax VSe® connectors address the industry needs for high bandwidth applications requiring a scalable migration path to 25Gb/s data rate. AirMax® technology delivers signal densities up to 63.5 differential pairs per inch when using a 5-pair connector system.
HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE SUPPORTING INTEL® QPI
AirMax VS® 85Ohms connectors are optimized to minimize impedance discontinuities and signal loss in 85Ohms channels. The connectors' mating interfaces also satisfy demands for backward compatibility to legacy 100 Ohms product interfaces ensuring a smooth transition to next-generation designs.
AirMax VS® Connectors for CompactPCI® Serial System
AirMax® high speed signal connectors meet the dimensional and electrical requirements described in CompactPCI® Serial (PICMG CPCI-S.0) specification. It moves CompactPCI® architecture to high speed serial interconnects to add greater support for serial point to point fabrics like PCI Express®, SATA, Ethernet and USB in the classic CompactPCI® form factor with mechanics fully compliant to IEC 1101.
AirMax VS® coplanar connectors permit mating 2 boards in the same plane. This is very useful for many applications, one base card can mate to many IO cards to cost effectively offer different system IO options. ATCA systems, Zone 3 connectors directly connect front and rear cards, bypassing the backplane, effectively doubling the electronic capabilities of each slot within the system.
AirMax VS® connectors use innovative edge-coupling and air dielectric between adjacent conductors to deliver insertion loss and crosstalk. The AirMax VS® connectors address a broad range of system architectures, including backplane, mid-plane, coplanar, mid-plane orthogonal, cabled backplane, and mezzanine applications.
AirMax VS® Orthogonal mid-plane interface features two back-to-back AirMax VS® headers oriented at 90 degrees to each other. The headers connect 16 differential signal pairs through shared vias in the mid-plane, providing a direct, high-speed connection while eliminating traces on the mid-plane. The AirMax VS® Orthogonal mid-plane interconnects can support differential signaling at up to 20Gb/s.
AirMax VS® high-speed signal connectors, guide modules, and power connectors meet the dimensional and electrical requirements for the Storage Bridge Bay Mid-plane Interface (SBBMI) to connect bridge/controller cards to the mid-plane in a drive enclosure. It comes with high-speed serial data rates that can scale from 2.5Gb/s to 12.5Gb/s without requiring the redesign of a basic platform.
Amphenol's AirMax VSX® connectors are high speed, high density, 2.00mm pitch connectors that support 56Gb/s PAM4 performance. Innovative design reduces crosstalk and reaches excellent SI performance. AirMax VSX provides a migration path to 56Gb/s PAM4 with backward mating compatibility with traditional AirMax VS®, AirMax VS2® and AirMax VSe® series. Industry leading robustness with field proved components.
Alternative to M12 - Ultra High-Density X-Lok Push-Lock Connector
Amphenol LTW’s 33-pin Ultra High-Density (UHD) X-Lok Metal Mini Size push-lock connector boasts a compact design and high contact density, providing space efficiency and enhanced data transmission. This connector serves as an excellent alternative to traditional M12 solutions【Video: https://www.youtube.com/watch?v=7gU_zye2zIw】【Quck guide: https://amphenolltw.com/down.php?supp_download=112】
This series, utilizing RADSOK® socket contact technology, is a general duty, touch-proof, thermoplastic rectangular with integrated latch push-pull coupling high power connector. Two poles per connector and up to 120 amps possible with a standard operating temperature from -55°C to +125°C.
Amphe-Phase is a High Current Single pin connector with a smart design to keep performance and safety as a top priority keeping the solution price competitive. Finger Proof Protection against electric shock (IP2X) on both sides of Source and Drain and have a bayonet mechanical locking system requiring a key to unlock for additional safety.
This series, utilizing RADSOK® socket contact technology, is an IP67 rated, thermoplastic reverse bayonet coupling, high power connector. With over six insert arrangements ranging from 3 to 5 contacts per connector and up to 70 amps possible with a standard operating temperature from -40°C to +100°C.
The APC 8010 is the perfect machine for every fiber optic production. High reproducibility with all connector geometries ensures high productivity during production. This is made possible by a permanent pressure control, which is adjusted to the connector type and quantity.
Amphenol LTW's waterproof USB connectors are IP67 / IP68 rated and designed with standard Type A/B interfaces in various product configurations -- plastic/metal, screw/bayonet locking, receptacle, receptacle with cables, overmolded cable, and field-installable demands for industrial applications【Quick Guide: https://amphenolltw.com/down.php?supp_download=111】
HIGH POWER OCP-COMPATIBLE CABLE ASSEMBLY COMPLIANT WITH OPEN COMPUTE POWER DISTRIBUTION ARCHITECTURE
Amphenol's BarKlip® BK1000 HD I/O power cable assemblies feature an OCP-compatible design, compliant with ORv3 power distribution architecture standards. Barklip® BK1000 HD IO can distribute up to 1000A per contact, load and return, and up to 2000A total. Designed similarly to other ORv3 busbar connectors