IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
Visit our global sites to learn more: Amphenol Communications Solutions
AirMax VS2® High-Speed Backplane Connector
AirMax VS2® connectors provide a migration path from AirMax VS® for speeds up to 20Gb/s, providing a margin of safety for typical 802.3ap system performance with the flexibility of an open pin field design. The connectors leverage AirMax VS® and VSe® design features and technology to achieve improved signal integrity and mechanical attributes compared to AirMax VS® connectors.
AirMax VSe® High-Speed Backplane Connector
Next-generation AirMax VSe® connectors provide a migration path for up to 25Gb/s per differential pair with the flexibility of an open pin field design. The connectors also feature backward mating-compatible interfaces to existing AirMax VS® connectors with minimal changes to connector footprints.
AirMax VS® Orthogonal High-Speed Backplane Connector
AirMax VS® Orthogonal mid-plane interface features two back-to-back AirMax VS® headers oriented at 90 degrees to each other. The headers connect 16 differential signal pairs through shared vias in the mid-plane, providing a direct, high-speed connection while eliminating traces on the mid-plane. The AirMax VS® Orthogonal mid-plane interconnects can support differential signaling at up to 20Gb/s.
AirMax VS® SBB High-Speed Backplane Connector
AirMax VS® high-speed signal connectors, guide modules, and power connectors meet the dimensional and electrical requirements for the Storage Bridge Bay Mid-plane Interface (SBBMI) to connect bridge/controller cards to the mid-plane in a drive enclosure. It comes with high-speed serial data rates that can scale from 2.5Gb/s to 12.5Gb/s without requiring the redesign of a basic platform.
Amphe-309 Pin and Sleeve
Pin & Sleeve IEC 60309 UL listed. The Amphe-309 consists of both IP44 (splash-proof) and IP67 (Water Proof) devices from 16 A up to 125 A, from a simple plug to customer-specified combination units. The series range covers all clock positions in use for low profile, watertight, and Heavy Duty solutions. EC 603 09-1 & 2, EN 60 309-1 & 2, BS 4343-2 1992, and UL 1682 & 1686.
Amphe-PD™
This series, utilizing RADSOK® socket contact technology, is a general duty, touch-proof, thermoplastic rectangular with integrated latch push-pull coupling high power connector. Two poles per connector and up to 120 amps possible with a standard operating temperature from -55°C to +125°C.
Amphe-PRB
This series, utilizing RADSOK® socket contact technology, is an IP67 rated, thermoplastic reverse bayonet coupling, high power connector. With over six insert arrangements ranging from 3 to 5 contacts per connector and up to 70 amps possible with a standard operating temperature from -40°C to +100°C.
APC 8010
The APC 8010 is the perfect machine for every fiber optic production. High reproducibility with all connector geometries ensures high productivity during production. This is made possible by a permanent pressure control, which is adjusted to the connector type and quantity.
Aptera™
The Aptera™ connector meets difficult electronic packaging challenges with a high-speed interconnect designed specifically for space-constrained areas without impeding airflow. Aptera's™ pin assignments are not predetermined, providing more flexibility when it comes to PCB routing design. It features low crosstalk that supports 6.25Gb/s data rates.
BarKlip® BK100 I/O
BarKlip® BK100 I/O provides a convenient method of distributing up to 100A between busbars, cables and circuit boards. It features 12 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases the efficiency and reliability of current transition.
BarKlip® BK300 Connector
The BarKlip® BK300 connector features 14 independent conducting beams that maintain contact with the mating busbar. BK300's contacts are plated with Amphenol's proprietary silver-based AGT® plating technology to further reduce contact resistance and eliminate fretting corrosion commonly found in tin-plated connectors.
BarKlip® XP Connectors
HIGH POWER AND LOW RESISTANCE BUSBAR CONNECTOR
Amphenol's BarKlip® XP connectors feature independent points of contact that provide overall lower resistance and greater overall efficiency. BarKlip® XP series is capable of distributing anywhere from 150 to 1000A of power to busbar power distribution applications.
Barrier Terminal Blocks
EBY offers a complete selection of industry standard terminal blocks and barrier strips - which may be customized to your needs - support a broad range of wire-to-board and wire-to-wire configurations.
For bare or terminated wires
Wire-to-board or wire-to-wire feed-through styles
No special tools required for installation
Easy field termination
Flexible design options - contact us!
BergStak® 0.50mm Self-Alignment Board-to-Board Connector
FINE PITCH SOLUTION WITH SELF-ALIGNMENT FEATURE
FCI Basics BergStak® 0.50mm self-alignment connectors come with a stack height of 3mm and 50 positions extendable across 20 to 60 positions in increments of 10. It has a unique self-alignment feature that supports blind mating.
BergStak® FX10 0.50mm Board-to-Board Connector
FCI Basics BergStak® product range is expanded to include a 0.50 mm BergStak® FX10 board-to-board connector known for its fast data transmission and high signal quality. This connector is offered in 144 positions and is available in 4.30mm and 6.00mm stack height options.
BergStak® FX10 supports speed performance up to 15Gb/s+ and is available in vertical SMT configuration.
BergStik® 2.54mm
BergStik® FCI Basics 2.54mm unshrouded headers are available in SMT, THT, press-fit, stacking, and PIP versions. Designed in single and double row, they are available in straight or right angle options, from 2 to 72 positions.
Featuring a "breakaway" design, each connector can be cut or broken into lengths to suit the application profile with a maximum current rating of 3A per contact.
Board-to-Board 85Ω (0.60mm pitch)
Amphenol high-speed BTB connectors provide high contact force reliability ensuring strong connectivity, forced insertions, and removals. A broad range of stacking heights & pin counts is offered to provide maximum design flexibility. With superior signal integrity (SI) performance, this 0.60mm pitch connector design is suitable for high-performance applications & meets PCIe Gen 3, 8GT/s.
Board-to-Board 85Ω (0.80mm pitch)
Amphenol high-speed BTB connectors provide high contact force reliability ensuring strong connectivity, forced insertions, and removals. A broad range of stacking heights & pin counts is offered to provide maximum design flexibility. With superior signal integrity (SI) performance, this 0.80mm pitch connector design is suitable for high-performance applications & meets PCIe Gen 3, 8GT/s.
Board-to-Board Connectors (0.50mm pitch)
0.50MM PITCH, 85Ω BOARD-TO-BOARD SOLUTION
Amphenol high-speed board-to-board connectors provide high contact force reliability ensuring strong connectivity, forced insertions, and removals. A broad range of stacking heights and pin counts are offered to provide maximum design flexibility. Amphenol 0.50mm pitch connector design is suitable for high-performance applications.
Board-to-Board Connectors - B401/B402 Series (0.80mm pitch)
HIGH DENSITY VERTICAL BOARD-TO-BOARD CONNECTORS
Amphenol's B401/B402 series is 0.80mm pitch board-to-board connectors designed for high-density applications. They support stack heights up to 10mm and 100 positions. These connectors feature surface mount terminations and are available in a comprehensive range to satisfy different customer requirements.