Amphenol is a technology leader in the design, manufacture and supply of high-performance interconnect systems, sensors and antennas for a broad range of industrial applications. Our core competencies include application-specific industrial interconnect solutions utilizing integrated assemblies. Our primary end applications for industrial include agriculture equipment, alternative and traditional energy generation, batteries and hybrid drive systems, entertainment, factory automation, heavy equipment, instrumentation, internet of things (IoT), LED lighting, marine, medical equipment, oil and gas, power distribution, public safety, rail mass transit, smart manufacturing (IIoT), and transportation.
FCI Basics Millipacs® Vertical header and receptacle mating combination offer a range of stack heights between 15mm and 25mm for low speed and 10Gb/s mezzanine applications. Millipacs® connector interfaces provide high reliability and robustness making them suitable for the most demanding applications in aerospace, industrial, and also traditional telecom segments.
Millipacs® Plus 2mm Hardmetric connector offers a choice of data rates ranging from 3 to 25Gb/s with configurable and scalable high speed, low speed signal, guiding, and power modules. Available in vertical header on the backplane mating with right angle receptacle on a daughter card, scalable design is easy to populate on boards and offers flexibility to designers.
FCI Basics Millipacs® is a 2.00mm modular board to board or cable to board Interconnection system in Hardmetric configuration designed in accordance with IEC 917 and IEC 61076-4- 101. FCI Basics offers Millipacs® Hard Metric Hybrid connectors in standard signal modules of type L, M, N, D, E with signal pins, integrated guide pins, and power/coax contacts.
Millipacs® is a 2.00mm modular board to board or cable to board Interconnection system in Hardmetric configuration designed in accordance with IEC 917 and IEC 61076-4-101 and Telcordia GR-1217-CORE standards. Millipacs® Right angle headers features hot plugging application with different mating sequences and are suitable for both Coplanar and Backplane mating.
FCI Basics Millipacs® is a 2.00mm modular, BTB & CTB Interconnection System in Hard Metric (HM) configuration designed in accordance with IEC 917, IEC 61076- 4-101, and Telcordia GR-1217-CORE standards. These connectors are enriched with additional options for higher speed, shielding, High operating temperature (175°C), higher current rating (3A/pin), and low smoke low halogen compatibility.
FCI Basics Millipacs® is a 2.00mm modular BTB or CTB Interconnection system in a hard metric configuration designed in accordance with IEC 917 and IEC 61076-4-101 and Telcordia GR-1217-CORE standards. These connectors are enriched with additional options for higher operating temperature (175°C), current rating (3A+/pin), low smoke low halogen (LSLH) materials, touch-proof / dust-free caps.
Millipacs® HM vertical receptacles are offered in standard 5 and 8 row signal modules and up to maximum of 200 signal contacts. Vertical receptacle module, when mated to a standard straight header are suitable for parallel Board-to-Board applications. Vertical receptacle can also be used in backplane in the place of vertical header and mated with right angle header on the daughter card.
Amphenol's 3.5mm diameter miniature jack connector is a family of connectors used for analog signals, primarily audio. Available in 3 to 5 contacts, the connector comes with an innovative contact design for robustness and high mating cycles. This solution is used for composite video & audio output in consumer electronics devices such as digital cameras, camcorders, and portable DVD players.
The Mini BNC product series offers the high performance and wide compatibility of the original Amphenol 75 Ω BNCs. However, the Mini-BNC has a higher connector density. Specifically, 40% more interconnects in the same area.
The Mini-D product line offers multiport harnessed cable assemblies that integrate SV's smallest interface into a rugged, lightweight aluminum housing. Designed for high-density applications, it features .110" port-to-port spacing to optimize space in compact system designs. Available in both straight and right-angle configurations, the product line also includes a panel mount assembly.