Connectors
Amphenol has been designing and manufacturing electrical and electronic connectors since the company’s inception in 1932. For nearly a century, we’ve been helping customers transmit power, data and signal in the harshest environments, from subsea applications to the outer reaches of space and everywhere in between. Our wide array of electrical and electronic connectors come in multiple form factors and are designed to meet the latest market needs including high power, high speeds, size and weight reduction, EMI shielding, hermeticity, high pressure and improved board retention. Amphenol also offers a broad portfolio of contact styles, termination types, mating styles, connector geometries and environmentally-friendly RoHS plating.
View our businesses providing Connector solutions.
D38999 Connectors with Coaxial, Concentric Twinax, and Triax Contacts
MIL-DTL-38999 connectors are ideally suited for shielded contacts for high-performance, high-speed interconnection applications. Insert arrangements can incorporate: coax (sizes 8, 12, and 16); twinax (sizes 8 and 12); and triax contacts (sizes 8, 10, and 12).
D38999 Connectors with Quadrax, Differential Twinax Contacts
D38999 Series III Connectors are ideally suited for the incorporation of shielded contacts for high-performance, high-speed interconnection applications. Uses size 8 high-speed Quadrax and Differential Twinax contacts. A wide selection of connector shell styles and sizes are available. Transition adapters can be used to attach connectors with Quadrax or Differential Twinax contacts to PCBs.
D38999 Power
For high power transmissions.
DDR2 SO-DIMM Memory Module Sockets
DDR2 SO-DIMM sockets are designed to accept modules that conform to JEDEC MO-224. The sockets come with a small form factor which allows fitting into smaller chassis, aiding the development of smaller & lighter notebooks. It comes in two voltage options with different key-ID to prevent incorrect mating. It operates at a higher speed & bandwidth lowers power consumption.
DDR3 Memory Module Sockets
DDR3 vertical DIMM sockets are designed to accept 240 position DDR3 memory modules that conform to JEDEC M0-269. Low-resistance contacts support the use of RDIMM (registered DIMM), which helps to further reduce power consumption in data center hardware.
DDR4 Memory Module Sockets
Vertical DDR4 DIMM sockets from Amphenol provide 288 contacts on 0.85mm pitch and are designed to accept DDR4 memory modules that conform to JEDEC MO-309. The DDR4 series complies with the new interface standard JEDEC POD12. It allows a module seating plane of 2.40mm and supports module variants in UDIMM, RDIMM, and LRDIMM.
DDR4 SO-DIMM Memory Module Sockets
HIGH-SPEED HIGH-DENSITY SO-DIMM SOCKETS
DDR4 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. Different key positions aid alignment and prevent mismating. 260 position SO-DIMM connectors are available in 4.00mm, 5.20mm, 8.00mm, 9.20mm height, in standard or reverse options.
DDR4 Ultra Low Profile Memory Module Sockets
DDR4 Ultra Low Profile (ULP) vertical DIMM sockets provide 288 contacts on 0.85mm pitch. It facilitates convenient memory expansion in servers, workstations, desktop PCs, and embedded applications in communications and industrial equipment. With an ultra-low module seating height of 1.1mm and connector height of 13.1mm, it reduces the overall profile of the connector.
DDR5/LPDDR5 CAMM2 Connector
COMPLIES TO JEDEC SO-032 SPEC
The DDR5/LPDDR5 CAMM2 connector follows JEDEC standards with 644 pins/666 pins, has a pitch of 1.00x1.38mm, and a connector height of 1.0mm. It provides dual channel memory which could support higher bandwidth and can catch up all DDR5 capacities needed. This connector is developed to support lower-power DDR5 memory and does not require ground shielding.
DDR5 Memory Module Sockets (SMT)
COMPLIES TO NEW INTERFACE STANDARD JEDEC SO-023D AND JEDEC SO-023
The new DDR5 connector with only 287 terminals addresses the resonance from the floating RFU pin 220 which resulted in a margin delta. Both RDIMM and UDIMM versions of the new DDR5 socket are tooled and available.
DDR5 SOCAMM Connector
LATEST MEMORY FORM FACTOR FOR AI SERVERS
The LP DDR5 Small Outline Compression Attached Memory Module (SOCAMM) is designed specifically for server and data center applications. It utilizes a compression connector interface and offers all the advantages of LPCAMM DDR5 in a more optimized form factor, making it ideal for high-performance computing (HPC) and artificial intelligence (AI) servers.
DDR5 SO-DIMM Connectors
HIGH SPEED HIGH DENSITY SO-DIMM SOCKETS
DDR5 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. 262 positions SO-DIMM connector are available in various height options.
Deep Space 38999
The Deep Space 38999 Connector series is designed for extreme cold environments. They are built to retain a grommet-to-wire and contact-to-contact seal in temperatures beyond -85 °F (-65 °C), with inserts that have been cycle tested between -148 °F (-100 °C) to 392 °F (200 °C)
DeepTronica Underwater Connector
Amphenol LTW's DeepTronica Underwater Connectors (up to 11,000m depth). The series offers Circular Mini Size and Circular Micro Size and contact density up to 12. These dry mate connectors solve the common issues met in deep sea applications such as poor sealing and corroded contacts due to low pressure cycle【Quick Guide: https://amphenolltw.com/down.php?supp_download=109】
DensiLink® OverPass™ Assemblies
112G DOUBLE ENDED HIGH PERFORMANCE CABLING INTERCONNECT
DensiLink® OverPass™ products remove high speed signaling from the PCB and create a double ended, high performance cabling interconnect. These cables support 56G and 112G signaling in hardware system designs as well as technology for future 224G signaling systems.
DensiMate™ 1.25mm Double Row
Ideal for miniature applications, the DensiMate™ connector system provides highly reliable performance, which meets industrial automation and IT/Datacom challenges.
With wire gauge range from 30AWG-26AWG, these connectors are available in double row, vertical SMT, and right angle SMT configurations. DensiMate™ comes with an active latch to provide enhanced contact reliability.
DensiStak™ 1034 pin Open-Pin-Field Board-to-Board Connector
HIGH DENSITY / HIGH SPEED / DUAL-BEAM CONTACT / USCAR-2 COMPLIANT BOARD-TO-BOARD CONNECTOR
Amphenol FCI Basics DensiStak™ connector is designed with its 11 rows 1000+ high density pin count, high speed up to PCIe® Gen 4 with 16Gb/s. Reliable dual-beam contact system, compact size with pitch 0.80mm x 1.25mm, USCAR-2 compliant, and optional shields
DHR Downhole Rotatable
DHR (Down-hole Rotatable ) is made from high-temperature material (200°C operations) with gold-plated BeCu contact bands. Our process enables the creation of 1-piece contacts, from the ring- through the back end. 4, 8, and 10 Contacts available. These solid connectors have eliminated solder and laser-weld failure points within the connector, and have increased the strength and life.
(Digital Visual Interface) DVI Connectors
Amphenol LTW DVI Connectors feature a 1.5A current rating, a ≤20mΩ contact resistance, and a ≥1000MΩ @ 500VDC insulation resistance rating. The DVI has a copper alloy, gold-plated contacts and steel, nickel-plated shell. It offers the durability of 100 cycles and an IP68 rating. Operate in the -20°C to +80°C temperature range【Quick Guide: https://amphenolltw.com/down.php?supp_download=94】
DIN 41612 Headers and Receptacles
DIN 41612 connector systems are the most popular backplane interconnect systems in IEC 603-2 specifications due to the widespread standard adoption, easy availability, cost-effectiveness, and durability.
The product design for Board-to-Board and I/O solutions involve both standard mount and reverse mount mating combination.