Connectors
Amphenol has been designing and manufacturing electrical and electronic connectors since the company’s inception in 1932. For nearly a century, we’ve been helping customers transmit power, data and signal in the harshest environments, from subsea applications to the outer reaches of space and everywhere in between. Our wide array of electrical and electronic connectors come in multiple form factors and are designed to meet the latest market needs including high power, high speeds, size and weight reduction, EMI shielding, hermeticity, high pressure and improved board retention. Amphenol also offers a broad portfolio of contact styles, termination types, mating styles, connector geometries and environmentally-friendly RoHS plating.
View our businesses providing Connector solutions.
CHD
Presenting our ruggedized heavy-duty connector, meticulously crafted for electric vehicles, ensuring steadfast reliability
in challenging conditions.
Our durable designs are tailored to excel in extreme settings, capable of withstanding strong vibrations and repelling
water and dust.
CHD10: 10mm contact size, 1500VDC, 250A Max.
CHD14: 14mm contact size, 1500VDC, 500A Max.
Circular Multiport Connection System
This product combines SMPM/SMPS connectors into a single multiport, reducing its footprint as compared to an equivalent amount of threaded single port connectors. This unique multiport has a keying feature that properly aligns connectors to their mating halves.
This reduces mating error, the time necessary to make multiple connections and the amount of tooling needed.
Class L Connectors
Heavy-duty cylindrical connector for higher Amperage requirements suitable for Military & Industrial application, The rigid configuration & control assures correct interconnection of an electrical circuit for maximum safety & reliability. Connectors are QPL qualified & meet the requirement of the MIL-DTL-22992 military standard.
Class L Connectors, MIL-DTL-22992
MIL-DTL-22992 Class L heavy-duty connectors are the largest size mil-spec cylindrical connectors. Current range from 40 to 200 amperes. Direct current or single/three-phase, 60/400 Hertz alternating current. Resistance to the operating environments of heat, moisture, vibration, high impact, and immersion. Automatic grounding for safety.
cLGA® Chip-to-Board Socket
HIGH PERFORMANCE, LOW COST CHIP-TO-BOARD APPLICATION
The Amphenol cLGA® land grid array socket system was designed to bring conventional connector material construction to high performance, low cost chip-to-board applications. Gold over nickel-plated copper alloy spring contacts guarantee long-term connector performance, contact retention and ruggedness.
Clincher™ Flex Connectors
Amphenol's FCI Basics Clincher™ 2.54mm pitch connector family include single-row pin-and-receptacle connectors designed for termination to flat flexible circuitry.
Contacts are pre-loaded to connector housings enabling mass termination to unprepared cable. The "clinch" cable termination provides gas-tight, contamination-free four contact points to each conductor.
Clip
DIFFERENT OPENINGS FOR DIFFERENT THICKNESS AND CABLE SIZES
Amphenol Aorora clip products can be provided by different openings for different thickness and cable sizes, they are widely used in automotive market, especially the infotainment. The opening from 0.1mm to 1.0mm, the material can be stainless steel and copper alloy, and provide gold, tin or nickel plating as an option.
CMB
This series, a commercial MIL-DTL-26482, Series 1 solder contact, general duty or ruggedized harsh environment, metal bayonet coupling, power, and signal connector. With over 60 insert arrangements ranging from 1 to 61 contacts per connector and up to 23 amps possible with a standard operating temperature from -55°C to +125°C.
Coaxial Inserts
Size 8 coaxial inserts for DIN and D-Sub applications. Available for common flexible coaxial cables.
µCom 10 Gb+
µCom-10Gb+ Series connector is designed to meet the latest market trends of the industry: miniaturization and high speed. µCom-10Gb+ design of 4 twisted data pairs insulated throughout the entire connector results in a performance that exceeds IEEE 802.3an-2006 specifications for 10GBASE-T Ethernet and TIA/EIA-568-C.2 Cat6 standards.
Combo-D
Positronic Combo-D connectors are a combination of signal and power and are part of the D-sub family. Combo-D connectors are used in military, communications, space, industrial, and medical applications. These connectors are available in various performance levels for the best cost/performance ratio.
ComboLock® Wire-to-Board Connector System
ComboLock® is a compact, hybrid wire-to-board connector system that saves space, allows for simpler assembly and simpler cable management. The connector system offers a hybrid 1.00mm pitch signal and 3.00mm pitch power configuration with an active latching feature.
The connector has nominal current carrying capacity of 10A/pin max. for power and 1.5A/pin max. for signal.
ComboNET™ Automotive Modular Connector
SCALABLE, VERSATILE, MODULAR AUTOMOTIVE-GRADE CONNECTOR. The ComboNET™ Automotive Modular Connector is a versatile, scalable, space-efficient solution, allowing standard modules such as Ve-NET™, Mini-Fakra, and power and signal pins to be combined and interchanged freely to suit specific application requirements. It supports high-speed differential and coaxial data transmission as well as signal and power..
ComboStak® 0.50mm & PowerStak® 2.00mm Board-to-Board Connector
HYBRID AND HIGH SPEED SOLUTION
The ComboStak® 0.50 mm BTB connectors are compact, hybrid (signal and power) board-to-board connectors. ComboStak® 0.50 mm combines existing, BergStak® 0.5mm pitch HS signal pins with 2.00mm pitch power blades. ComboStak® 0.50 mm provides high signal and current density with a wide range of stack heights.
ComboStak® 0.80mm & PowerStak® 2.00mm Board-to-Board Connectors
HYBRID AND MEDIUM POWER SOLUTION
ComboStak® and PowerStak® are compact, hybrid (signal and power) and power board-to-board connectors. ComboStak® combines existing, BergStak® 0.8mm pitch signal pins with 2.00mm pitch power blades. PowerStak® is the power only version. Both ComboStak® and PowerStak® provide high signal and current density with a wide range of stack heights.
COM-HPC 0.635mm pitch 400 pin Open-Pin-Field Array
400POS 0.635MM PITCH COM-HPC
Amphenol has developed a pair of 400pos 0.635mm COM-HPC which support 5mm and 10mm stack heights.
COM-HPC is a PICMG sponsored open standard for a family of high performance computer modules targeting the embedded computer space. We have developed a pair of 400pos 0.635mm COM-HPC which support 5mm and 10mm stack heights.
Compact Combo Connectors
SIGNAL & HYBRID SOLUTIONS FOR BTB, WTW, AND WTB
Solutions offer optimized space, high reliability with adequate creepage and clearance distances for power and allows easy to mate/crimp and cable management. The connector system offers hybrid solutions choice of signal and power loading with an active latching feature.
Compact PCI Serial 3U 6-Slot Backplane
Amphenol-BSI’s range of PICMG compliant backplanes includes CompactPCI Serial which modernizes CompactPCI to include high-speed serial Ethernet, PCIe, SATA and USBinterconnects. These high-speed serial interconnects are capable of data rates up to 12Gb/s.
Compression Connectors
SINGLE-PIECE COMPRESSION TYPE SURFACE MOUNT CONNECTORS
Amphenol Communications Solutions offers compression-type surface mount connectors to provide power and signal connection between either two PCB modules or one PCB and an electrical module. The single-piece small footprint solution brings cost and space savings to the design of smaller and more economical consumer electronic devices.
μCom USB3.0
Miniature multi-pin USB3.0 connectors for harsh environments.
Conan® 1.00mm Connector
Amphenol's Conan® 1.00mm is a mezzanine connector designed for industrial applications and harsh environments. Conan® 1.00mm provides a mechanically secure, high-density electrical interface between parallel printed circuit boards.
Its unique design with an audible 'click' sound enhances the security and ease of use. The polarization ensures proper alignment during blind mating.