High Speed Connectors

Amphenol's external mini-SAS / SATA connector, cage, and cable assembly system solution addresses the storage industry's demand for more compact, high-speed serial I/O interfaces that also support evolving signal speed requirements.

The SAS 2.1 standard meets SAS-3 next generation speed and density requirements that provides faster data transmission and more bandwidth for end users. The lowprofile system provides 4X and 8X cable-plug options, and the external I/O connectors include eight sideband signals per 4X port, 1x4 configuration for up to 192Gb/s of total bandwidth.

NEXT-GENERATION SAS STORAGE INTERFACE Amphenol Mini-SAS High-Density connector system is the next-generation SAS system that provides faster data rates and more bandwidth. It provides double the port density of current Mini-SAS connectors with 1x1, 1x2, and 1x4 port options.

Micro-miniature solution ideal for communications systems running Gigabit Ethernet, USB 2.0/USB 3.0, HDMI, and 10 Gigabit Ethernet when specified and designated to a specific configuration.

56GB/S-112GB/S HIGH-SPEED MEZZANINE BGA CONNECTOR SYSTEM Leveraging well-established technologies, including an industry-leading Ball Grid Array (BGA) design, this connector offers a superior self-aligning and self-leveling solution. It incorporates a next-generation differential pair contact design, enabling exceptional performance of up to 56Gb/s NRZ and 112Gb/s PAM4.

Leveraging proven technologies, including an industry-leading BGA design, this connector system offers a solution that provides superior self-aligning and self-leveling capabilities. This product incorporates a next-generation differential pair contact design, enabling impressive performance of up to 56Gb/s for both PAM4 and NRZ applications.

Amphenol introduces the next-generation product - Multi-Trak™. The 0.60mm pitch connector come with a slim form factor design, capable of transmitting high-speed signal up to 56G PAM4 PCIe® Gen 5 and target to meet 64G PAM4 PCIe® Gen 6 and allowing much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.

Amphenol's NeXLev® is an established and proven high-density parallel board-to-board connector solution to meet current bandwidth demands in many mezzanine applications. NeXLev delivers a robust, market-proven connector in a small footprint. NeXLev connectors contain either 10, 20, or 30 wafers, with each wafer containing 10 real signal contacts. NeXLev features data rates up to 12.5Gb/s.

High-speed data transmission up to 10 Gbps per pair. MIL-DTL-38999 shell styles are available from size 9 to 25. A wide variety of insert arrangements is available. Patterns range from (1) to (21), 100 Ohm differential pairs capable of delivering data transfer speeds of 10Gbps per pair. PCB Tails contacts available, sockets only, epoxy backfilled.

Size 8 Octonet Contacts for MIL-DTL-38999 Series III connectors. Available in size 8 crimp termination style, including PC tails. Can be installed in existing size 8 Quadrax cavities. Meets performance specifications of CAT-6A cable. Overall higher bandwidth than standard CAT5E Quadrax-supports up to 4.0 Gbps per pair. 10G Ethernet compliant.

The RJE7H series of 1x1 Tab Down CAT5e jack connectors is one of the top-selling OneG series connectors from Amphenol. With a low profile, no-shield, and no-LED the connector aims to extend the application capability to suit a wide range of Communications, Storage, Consumer, Home, Industrial, and Medical markets.

Amphenol's OSFP interconnect system has 60 contacts per port, with a 0.6mm contact pitch and 8 high-speed channels. The OSFP footprint is optimized for signal integrity performance and built for use in high-speed serial applications. The connector is enhanced for low crosstalk and has ground commoning for resonance dampening. It is also designed for 1U applications.

Cable Backplane Systems is part of Amphenol's Highspeed Backplane Product business, dedicated to developing and manufacturing cabled backplane solutions for next-generation system architectures. Our customers are leading providers of data center switches and routers, enterprise servers, and high-performance computers.

AMPHENOL'S GAME-CHANGING 112Gb/s BACKPLANE INTERCONNECT TECHNOLOGY. Paladin's® revolutionary architecture sets the benchmark for signal integrity performance in backplane interconnects. Exhibiting smooth linear transmission beyond 40GHz, the lowest crosstalk in the market, and consistent SI performance over its entire mating range.

INDUSTRY LEADING DENSITY AND PERFORMANCE – YOUR PATH TO 224GB/S The Paladin® HD interconnect system provides world class bandwidth from 112Gb/s to 224Gb/s with industry leading density, supporting up to 144 differential pairs orthogonally within 1U spacing. Paladin® HD's unique mating interface allows for consistent performance in a de-mated condition, critical for next generation systems.

QSFP-DD Linear Pluggable Optics. Type II QSFP-DD Form Factor. PCIe Gen 5.0 protocol. 8 Channel full-duplex transceiver. Lengths up to 50m OM4. Power dissipation < 5W

Amphenol introduces the next-generation OverPass™ solution - Mini Cool Edge IO. The 0.60mm pitch connector comes with a slim form factor design, capable of transmitting high-speed signals up to 64G PAM4/PCIe® Gen 6 and allowing much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.

Amphenol introduces the next-generation OverPass™ solution: the Mini Cool Edge IO. This connector features a 0.60mm pitch and a slim form factor design, and is capable of transmitting high-speed signals of up to 128G PAM4/PCIe® Gen 7. It allows for significantly longer signal path lengths while maintaining superior signal integrity (SI) performance compared to traditional PCB routing methods.

Amphenol's QSFP DD interconnect system is comprised of a 76 position, 0.8mm pitch connector built for use in high speed serial applications. Each port supports up to 400Gb/s in aggregate over an 8 x 50Gb/s electrical interface. The cage and connector design provides backwards compatibility to QSFP28 modules which can be inserted into a QSFP DD port and connected to 4 of the 8 electrical channels.

Offer several advantages for high data transfer rates, low power consumption, and excellent EMI compatibility. Variety of plated, aluminum shell styles available. Quadrax, Split Pair Quadrax, or Differential Twinax available. Board Level connectors can incorporate straight or PCB Tails right angle, or straight compliant tail contacts.