High Speed Connectors
HD Express®
PCIE® GEN 6 BACKPLANE INTERCONNECT SYSTEM
The HD Express® is a high-density, high-performance interconnect system designed to meet and exceed PCIe® Gen 6 electrical and mechanical requirements for high-end 85Ω architectures.
HSC Connector System
HSC connector system is a fully shielded interconnect system that supports data rates up to 1Gb/s and more. With 0.50mm square terminals, it allows a lighter and smaller connector design. The comprehensive shielding of these connectors provides enhanced EMI performance. It is designed for automotive applications like LVDS, camera, USB, and IEEE 1394.
HSD (High Speed Data) Connector System
HSD connector system is a fully shielded interconnect system that can be used with shielded twisted quad cables. It has a high-performance digital system for low-voltage differential signals which prevents interference from crosstalk and external sources. It has the minimum size to satisfy global automotive requirements such as LVDS camera, USB, and IEEE 1394 applications.
ICFP (IC Footprint Probe)
Amphenol's ICFP offers 50 Ohms access to IC contact pads and signal paths on an IC circuit footprint. This solution is simple to manipulate, cost-effective, and time-saving alternative to expensive X-Y tables and fragile planar probes for Engineers who may need to probe multiple signals at once.
InfinX® 25G+ High Density BGA Mezzanine Connector
The InfinX® high-speed mezzanine connector solution is designed to meet the needs of 25+Gb/s applications. Available in 4- and 6-Pair configurations, InfinX is your best choice for high-speed board-to-board applications. InfinX supports from 10mm to 42mm stack heights and provides unparalleled reliability and signal integrity with its patented Resonance Dampening Technology.
Leap-AHRD
The 300Gb/s Leap-AHRD High-Speed Optical Module is faster, smaller, more cost, and power-efficient than most conventional data center interconnects. The on-board transceiver rugged device is capable of speeds up to 25Gbps and distances up to 100 meters. The optical cable can be routed above and around other components in the integrated heat-sink design.
Lynx™ 25Gb/s Low Profile, High Density Open-Pin-Field Connector
The Lynx™ connector is a flexible 0.6mm pitch solution designed for high speed and density differential or single-ended signaling BTB applications. Lynx™ has a robust contact design tolerant of misalignment, enables a reliable connection, and supports blind mating. This connector provides designers with a readily available 85Ω solution to meet a wide variety of application needs, including PCI.
Lynx™ QD 56Gb/s PCIe® Gen 5 Differential Signaling Connector
Optimized for differential pair signaling, Lynx™ QD sets a new standard for density and flexibility that offers an innovative, high-performance interconnect with PCIe® Gen 5 support. Lynx™ QD supports data rates of 56 Gb/s PAM4 and provides a 4-row differential signaling structure, in a compact 2-row footprint.
Micro Cool Edge NF1/NGSFF 0.50mm Connectors
Micro Cool Edge NF1/NGSFF 0.50mm is a new small form factor card edge connector designed for enterprise and data center SSD (Solid State Drive) servers. It supports NF1/NGSFF (Next Generation Small Form Factor) which can double storage capacity and enable front side service within server systems compared to the M.2 standard.
Mini Cool Edge IO
Amphenol introduces the next-generation OverPass™ solution - Mini Cool Edge IO. The 0.60mm pitch connector come with a slim form factor design, capable of transmitting high-speed signal up to 64G PAM4/PCIe® Gen 4/PCIe® Gen 5/PCIe® Gen 6, and allowing much greater signal path lengths while maintaining SI performance when compared to conventional pcb routing methods.
Mini-SAS Connectors
Amphenol's external mini-SAS / SATA connector, cage, and cable assembly system solution addresses the storage industry's demand for more compact, high-speed serial I/O interfaces that also support evolving signal speed requirements.
Mini-SAS HD
The SAS 2.1 standard meets SAS-3 next generation speed and density requirements that provides faster data transmission and more bandwidth for end users. The lowprofile system provides 4X and 8X cable-plug options, and the external I/O connectors include eight sideband signals per 4X port, 1x4 configuration for up to 192Gb/s of total bandwidth.
Mini-SAS HD Internal
NEXT-GENERATION SAS STORAGE INTERFACE
Amphenol Mini-SAS High-Density connector system is the next-generation SAS system that provides faster data rates and more bandwidth. It provides double the port density of current Mini-SAS connectors with 1x1, 1x2, and 1x4 port options.
MRC (Multi-Media Ruggedized Connectors)
Micro-miniature solution ideal for communications systems running Gigabit Ethernet, USB 2.0/USB 3.0, HDMI, and 10 Gigabit Ethernet when specified and designated to a specific configuration.
M-Series™ 112Gb/s PAM4 BGA Mezzanine Connector
56GB/S-112GB/S HIGH-SPEED MEZZANINE BGA CONNECTOR SYSTEM
Leveraging well-established technologies, including an industry-leading Ball Grid Array (BGA) design, this connector offers a superior self-aligning and self-leveling solution. It incorporates a next-generation differential pair contact design, enabling exceptional performance of up to 56Gb/s NRZ and 112Gb/s PAM4.
M-Series™ VR 56Gb/s PAM4 BGA Mezzanine Connector
Leveraging proven technologies, including an industry-leading BGA design, this connector system offers a solution that provides superior self-aligning and self-leveling capabilities. This product incorporates a next-generation differential pair contact design, enabling impressive performance of up to 56Gb/s for both PAM4 and NRZ applications.
Multi-Trak™
Amphenol introduces the next-generation product - Multi-Trak™. The 0.60mm pitch connector come with a slim form factor design, capable of transmitting high-speed signal up to 56G PAM4 PCIe® Gen 5 and target to meet 64G PAM4 PCIe® Gen 6 and allowing much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.
NeXLev® 12.5Gb/s High Density BGA Mezzanine Connector
Amphenol's NeXLev® is an established and proven high-density parallel board-to-board connector solution to meet current bandwidth demands in many mezzanine applications. NeXLev delivers a robust, market-proven connector in a small footprint. NeXLev connectors contain either 10, 20, or 30 wafers, with each wafer containing 10 real signal contacts. NeXLev features data rates up to 12.5Gb/s.
OCS - Oval Contact System Connectors
High-speed data transmission up to 10 Gbps per pair. MIL-DTL-38999 shell styles are available from size 9 to 25. A wide variety of insert arrangements is available. Patterns range from (1) to (21), 100 Ohm differential pairs capable of delivering data transfer speeds of 10Gbps per pair. PCB Tails contacts available, sockets only, epoxy backfilled.
Octonet Contacts
Size 8 Octonet Contacts for MIL-DTL-38999 Series III connectors. Available in size 8 crimp termination style, including PC tails. Can be installed in existing size 8 Quadrax cavities. Meets performance specifications of CAT-6A cable. Overall higher bandwidth than standard CAT5E Quadrax-supports up to 4.0 Gbps per pair. 10G Ethernet compliant.
OneG Series RJ45 High-Speed Connectors - RJE7H
The RJE7H series of 1x1 Tab Down CAT5e jack connectors is one of the top-selling OneG series connectors from Amphenol. With a low profile, no-shield, and no-LED the connector aims to extend the application capability to suit a wide range of Communications, Storage, Consumer, Home, Industrial, and Medical markets.
OSFP
Amphenol's OSFP interconnect system has 60 contacts per port, with a 0.6mm contact pitch and 8 high-speed channels. The OSFP footprint is optimized for signal integrity performance and built for use in high-speed serial applications. The connector is enhanced for low crosstalk and has ground commoning for resonance dampening. It is also designed for 1U applications.
Paladin® 112Gb/s Backplane Cable
Cable Backplane Systems is part of Amphenol's Highspeed Backplane Product business, dedicated to developing and manufacturing cabled backplane solutions for next-generation system architectures. Our customers are leading providers of data center switches and routers, enterprise servers, and high-performance computers.
Paladin® 112Gb/s Backplane Connector
AMPHENOL'S GAME-CHANGING 112Gb/s BACKPLANE INTERCONNECT TECHNOLOGY.
Paladin's® revolutionary architecture sets the benchmark for signal integrity performance in backplane interconnects. Exhibiting smooth linear transmission beyond 40GHz, the lowest crosstalk in the market, and consistent SI performance over its entire mating range.
Paladin® HD 224Gb/s Backplane Interconnect System
INDUSTRY LEADING DENSITY AND PERFORMANCE – YOUR PATH TO 224GB/S
The Paladin® HD interconnect system provides world class bandwidth from 112Gb/s to 224Gb/s with industry leading density, supporting up to 144 differential pairs orthogonally within 1U spacing. Paladin® HD's unique mating interface allows for consistent performance in a de-mated condition, critical for next generation systems.
PCIe Over Optics- Linear Pluggable Optics (LPO)
QSFP-DD Linear Pluggable Optics. Type II QSFP-DD Form Factor. PCIe Gen 5.0 protocol. 8 Channel full-duplex transceiver. Lengths up to 50m OM4.
Power dissipation < 5W
PCIe® Gen 6 Mini Cool Edge IO Connector
Amphenol introduces the next-generation OverPass™ solution - Mini Cool Edge IO. The 0.60mm pitch connector comes with a slim form factor design, capable of transmitting high-speed signals up to 64G PAM4/PCIe® Gen 6 and allowing much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.
PCIe® Gen 7 Mini Cool Edge IO Connector
Amphenol introduces the next-generation OverPass™ solution: the Mini Cool Edge IO. This connector features a 0.60mm pitch and a slim form factor design, and is capable of transmitting high-speed signals of up to 128G PAM4/PCIe® Gen 7. It allows for significantly longer signal path lengths while maintaining superior signal integrity (SI) performance compared to traditional PCB routing methods.
QSFP DD
Amphenol's QSFP DD interconnect system is comprised of a 76 position, 0.8mm pitch connector built for use in high speed serial applications. Each port supports up to 400Gb/s in aggregate over an 8 x 50Gb/s electrical interface. The cage and connector design provides backwards compatibility to QSFP28 modules which can be inserted into a QSFP DD port and connected to 4 of the 8 electrical channels.
Rectangular Connectors with High Speed Contacts
Offer several advantages for high data transfer rates, low power consumption, and excellent EMI compatibility. Variety of plated, aluminum shell styles available. Quadrax, Split Pair Quadrax, or Differential Twinax available. Board Level connectors can incorporate straight or PCB Tails right angle, or straight compliant tail contacts.
RJF 544
RJF 544 allows you to use an Ethernet Class D / Cat 5e connection for 10 BaseT, 100 BaseTX, or 1000 BaseT networks in harsh environments. With the patented RJStop® system you can use a standard RJ45 cordset in a protective composite plug which will protect it from shocks, dust, and fluids. No hazardous on-field cabling and grounding!
RJF Cat5e, Cat6, Cat6A (New Cat6A version)
RJF Cat6A allows you to use an Ethernet Class Ea / Cat. 6A connection for 10 BaseT, 100 BaseTx, 1000 BaseT, or 10 G BaseT up to 500 MHz networks in harsh environments. With the patented RJStop system you can use a standard RJ45 cordset in a metallic plug that will protect it from shocks, dust, and fluids. No hazardous on-field cabling and grounding!
RJF RB
Ethernet RJ45 connection system for industrial harsh environment.
RJF TV ATEX Zone 2 versions
Explosion-proof Ethernet solutions for Zone 2 that are low-power non-sparking connectors.
RJF TV Cat5e, Cat6, Cat6A – Reduced flange receptacle
Derived from standard RJF TV, Reduced Flange RJF TV is ideal for applications where small dimensions and lower weight are critical in harsh environments. RJFTV Reduced flange receptacle is available in Cat5.e, Cat.6 and Cat6A. With the patented RJStop system you can use a standard RJ45 cordset in a metallic plug that will protect it from shocks, dust, and fluids.
Rugged SCFF Optical Transceiver (1TRx)
Embedded solderable optical transceiver compatible with duplex LC optical cavities. Its 12pin electrical interface complies with specifications SFF-8431 for high-speed interfaces.
R-VPX
R-VPX is a ruggedized, high-speed, board-to-board interconnect system capable of data rates in excess of 10 Gbps, meeting and exceeding VITA 46 standards. This connector system gives users modularity and flexibility by utilizing PCB wafer construction with customized wafer-loading patterns.
R-VPX Evolution
R-VPX High-Speed Evolution Modules are capable of 16+ Gbps data rate transfer performance. Evolution meets the performance requirements of VITA 46 & 47 while still intermateable with existing VITA 46 backplane connectors. This connector system is optimized for speed and ruggedized to handle harsh environment requirements in military applications across the board.
R-VPX Evolution 2.0
R-VPX Evolution 2.0 is the next generation of high-speed ruggedized backplane connectors. Evolution 2.0 series connectors are designed, optimized and qualified to data rates in excess of 32Gb/s making these connectors the fastest VITA 46.30 connectors in the world. They are tested to VITA levels and are backward intermateable with R-VPX, R-VPX EVO 1, and VITA 46 qualified connectors.
SFP
Amphenol's SFP product family supports applications for up to 6 Gbps per channel. The connector accepts multiple transceivers per INF-8074i and combines, transmits, and receives functions in a low-cost, compact format. The assemblies are designed to maximize valuable space on the PCB.
SJT Data Connector
Data connector according to VG96912, shielded, in size 12 including backshell for High-Speed and Ethernet applications up to CAT6A (10Gbit/s according to DIN EN 50173-1, up to 500 MHz).
SK Series Chip-to-Board Socket
Amphenol's patented compression mount contact technology utilizes industry-leading alloys to make cost effective and electrically robust socket solutions that offer high performance. With designs supporting pitches down to 0.4mm and speeds up to 40GHz, the SK series sockets are being used in cutting edge BGA, LGA and other small form factor IC applications.
Slim Cool Edge 0.65mm Hybrid Power & Signal Connectors
Slim Cool Edge Hybrid Power & Signal connectors provide a one-piece high speed and high power card-edge package. These connectors offer cost-competitive and high-density solutions. These versatile solutions based on a 0.65mm signal pitch design offer multiple BTB configurations like right angle, mezzanine, and coplanar. The connectors are designed as Open Pin Field & are hot-plug capable.
SlimSAS™
PROVEN, HIGH SPEED, NEXT-GENERATION SAS-4 INTERFACE
SlimSAS™ connectors address issues in next-generation storage devices such as bulk cable form factor restrictions and the introduction of multi-lane storage devices. SlimSAS™ connector is a 0.60mm pitch interconnect system that offers superior signal integrity performance over standard Mini-SAS solutions.
SlimSAS™ Low Profile Connectors - U10 Series
In order to provide higher speed and smaller size solution on networking equipment and server, Amphenol has developed SlimSAS™ low profile connector which is used in application of UPI1.0, 11.2GT/s, 24Gb/s SAS signal or 16GT/s PCIe® signal. With 0.60mm contact pitch, Low Profile (LP) SlimSAS™ solutions are smaller than mainstream connectors in current market to save space in end devices.
TVµCom 10 Gb+
TVµCom-10Gb+ combines 10 Gb/s Ethernet speed of the classic µCom-10Gb+ with the ruggedness of 38999 Series III shell. TVµCom-10Gb+ exceeds 10Gb/s according to the IEEE 802.3an-2006, 10GBase-T standard, and the 38999 series III size 11 shell provides environmental resistance similar to MIL-DTL-38999 Series III.
UltraPort™ QSFP+
Amphenol's UltraPort™ QSFP+ interconnect system comprises a 38-position, 0.8mm pitch connector built for use in high-speed serial applications. Each port offers 4 channels to increase port density which allows more board real estate and cost-optimized solutions. The UltraPort™ QSFP+ connector supports next-generation 100G+ applications and transmits up to 28 Gb/s per channel.
UltraPort™ SFP+
Amphenol's UltraPort™ SFP+ interconnect system comprises of a 20-position hot-swappable I/O connector enclosed in a metal cage mounted to a host PCB. It supports 28Gb/s applications with backward compatibility for next-generation Ethernet and Fibre Channel applications. UltraPort™ SFP+ connector shares the same unique mating interface and EMI cage dimensions as the SFP+ form factor.
VHDM-HSD™
VHDM-HSD™ is a shielded, high-density, high-speed press-fit connector system optimized for differential pair architectures. The flexible, modular design of the product allows for the differential performance of our VHDM-HSD™ connector to be combined on the same rear organizer as the VHDM® connector which is a single-ended solution.
VHDM®
Amphenol's VHDM® connector's modular format and breadth of components provide unmatched design flexibility. VHDM® can be combined with VHDM-HSD™ to incorporate both single-ended and differential signaling within the same connector. VHDM® derivatives provide an upgrade path to 25 Gb/s with backward mate compatibility to allow for scale as needed.