Board-Level Connectors

FLEXIBLE SOLUTION FOR HIGH-SPEED APPLICATION FCI Basics BergStak HS™ connector family is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. BergStak HS™ 0.80mm connector family with 0.80mm pitch enables high-speed data applications with up to PCIe® Gen 5 32Gb/s.

BergStak+™ 0.80mm is designed to be the next generation PCIe 4.0 compliant mezzanine connector system. It is compatible with the existing BergStak® 0.80mm product recommended by the OCP. It guarantees to support up to 16Gb/s performance. Customers can upgrade its board-to-board performance from PCIe 3.0 to PCIe 4.0 while leveraging BergStak+™'s backward compatibility and same footprint feature.

The BergStak® 0.40mm board-to-board connectors are in 0.4mm pitch with double row contacts, the family now supports stack height of 1.50/2.0/3.0/3.5/4.0mm and position ranges in 10-100 positions (10/20/24/30/34/40/50/60/70/80/90/100). The lock feature on contacts works together with shock-absorbing ribs on the housing to make it suitable for high-vibration applications and friendly for FPC applications.

FCI Basics BergStak® 0.40mm self-alignment connectors come with a stack height of 3.50mm and 30 positions extendable up to 10 to 60 positions with 10 positions incremental. It has a unique self-alignment feature that supports blind mating, ensuring a reliable connection. The USCAR-2 compliant connector is also ideal for the automotive market.

Amphenol's BergStak® 0.5mm is a comprehensive and versatile board-to-board solution designed for reliable and high-density applications. The unique design of scoop-proof housing ensures terminals are not damaged during mating.

FINE PITCH SOLUTION WITH SELF-ALIGNMENT FEATURE FCI Basics BergStak® 0.50mm self-alignment connectors come with a stack height of 3mm and 50 positions extendable across 20 to 60 positions in increments of 10. It has a unique self-alignment feature that supports blind mating.

MICRO PITCH LOW PROFILE HIGH SPEED BOARD-TO-BOARD CONNECTOR BergStak® 0.635mm pitch is a compact board-to-board connector with low stack height of 3.00mm. Available in 80 and 140 positions it support applications which require high pin counts and low profile connection. BergStak® 0.635mm supports signal speeds up to 8Gb/s with an open-pin-field, providing design flexibility.

FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS Amphenol's BergStak® 0.8 mm is a flexible solution designed for high-speed and high-density, parallel board-to-board connector systems with 16 PCB stack heights in 10 sizes up to 200 positions.

FCI Basics BergStak® 0.80mm connector family is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. Bergstak® shielded connector with 0.80mm pitch supports high-speed data applications up to 10Gb/s.

FCI Basics BergStak® product range is expanded to include 0.50mm BergStak® FX10 board-to-board connector known for its fast data transmission and high signal quality. This connector is offered in 144 positions and is available in 4.30mm and 6.00mm stack height options. Position is extendable up to 168 positions. BergStak® FX10 supports speed performance up to 15Gb/s+ and is available in vertical SMT