Mobile Networks
Amphenol is a leading global interconnect solutions provider to the mobile networks market and offers a wide product portfolio, including antennas, connectors and interconnect systems. Our products are used in current and next-generation wireless communications standards, including in 5G networks. We works with service providers around the world to offer an array of antennas and installation-related site solution interconnect products. We provide solutions that span antenna systems, base stations, combiners, filters and amplifiers, core network controllers, distributed antenna systems (DAS), mobile switches, radio links, small cells and wireless routers.
D-Sub High Density Board-Mount Connectors
FCI Basics D-Sub High-Density Board-Mount Connectors, based on the compact-D form factor, complete your board and system designs by providing high-density and high-speed interfaces. The high-speed, power, assembly, and mechanical packaging expertise, aids in getting the signals out of the box at optimal cost and performance, while accommodating up to 78 positions in standard shell sizes.
D-Sub High Performance Board-Mount Connectors
FCI Basics D-Sub High Performance Board-Mount Connectors are designed for severe environment applications in the field of telecommunications, aerospace, military (125°C) class and for particularly severe applications, especially high temperature (+155°C) class. They feature machined contacts and is available in solder bucket, straight spills, angled spills, and wire wrap terminations.
D-Sub Standard Board Mount Connectors
FCI Basics D-Sub Standard Board Mount Connectors are standard density I/O products widely across various market segments. The stamp and rolled contacts complementing the full metal shells are available in solder, straight, and angled versions. They also come with single-shell (Delta-D) and double-shell designs.
Dubox® 2.54mm Crimp to Wire
The Dubox®, connector families offer an extensive range of through-hole and surface-mount part options, including single or double-row in either straight or right-angle orientation from 2 to 50 positions, with a current rating of 3A (maximum) per individual contact. The Dubox® contact has a pre-stressed, dual-beam design to enable low insertion force, 4-wall contact design for signal protection.
EconoStik™ 2.54mm
EconoStik™ 2.54mm is an economical range of 2.54mm unshrouded header. It is available in single-row and double-row with vertical through-hole, right-angle through-hole, and vertical SMT terminations. EconoStik™ 2.54mm is a standard 0.64mm square header with high-temperature resin and 1μ" gold plating in contact and tail. It supports up to 50 mating cycles.
EMI Gasket Bulkhead Connectors and Adapters
SV Microwave has just released a series of SMA and 2.92mm cable connectors and adapters with built-in electromagnetic interference (EMI) shielding. These interconnects feature a gasket that improves EMI shielding over similar products, resulting in minimal to no electromagnetic interference.
E-Series Total Front Access Panels
E-Series features tray-based, total front access fiber distribution panels. E-Series gives cost-effective patch, patch/splice, and splice-only capabilities in an industry-standard ETSI footprint. The series can host up to 144 terminations in a standard configuration that fits existing frame layouts and new builds.
ExpressPort® QSFP+
Amphenol's ExpressPort® QSFP+ interconnect system is comprised of a 38 position 0.8mm pitch SMT connector, & a press-fit cage. With four channels of data in one pluggable, the system interface is capable of transferring data up to 16Gb/s per Channel, & replacing up to 4 standard SFP+ receptacles. These features result in greater port density & overall cost savings over traditional SFP+ products.
Extremeport-Flash
Amphenol’s Extremeport-Flash is an extreme low mating height, easy-to-release high-speed cable solution. We designed 95ohm Flash mainly to support near chip (under heat sink) to IO application, and the mating height is lower than 5mm. Flash can support 56G PAM4, and scalable to 112G PAM4 application, and plug is with pull tab design feature for easy release.
Extremeport-MCIO(Mini Cooledge IO)
Amphenol's Mini Cooledge IO(MCIO) is a high-speed, small mechanical size cable solution. Amphenol MCIO product is now being specified in the SFF group and the project number is SFF-TA-1016. MCIO cable can support PCIe Gen5, and is scalable to PCIe Gen6 and 112G PAM4. We developed 85ohm and 95ohm solutions to support different applications.
Extremeport-Swift
Amphenol’s Extremeport-Swift is an extreme low profile(mating height<9mm), robust mechanical, and excellent SI performance cable solution. The cable assembly and connector can support PCIe Gen5, and the SI performance is scalable to PCIe Gen6 and 112G PAM4. We can provide straight, right angle, and side exit plug types with 38pin, 74pin, and 124pin to support customers to optimize system layout.
ExtremePort™ Flash Connector
Amphenol introduces the next-generation OverPass™ solution - ExtremePort™ Flash. The 0.60mm pitch connector comes with an extremely low profile design capable of transmitting a high-speed signal up to 56G PAM4, and allows much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.
ExtremePort™ QSFP DD 112G Connectors
Amphenol's ExtremePort™ QSFP DD 112G interconnect system is comprised of a 76 position, 0.8mm pitch connector built for use in high-speed serial applications. Each port supports up to 800Gb/s in aggregate over an 8 x 112Gb/s electrical interface. The cage and connector design provides backward compatibility to QSFP56...
ExtremePort™ Swift Connectors
Amphenol has developed the ExtremePort™ Swift connector which is used in the application of PCIe® Gen5 signal NRZ 32GT/s, UPI 2.0 24GT/s, 24Gb/s SAS signal. With 0.6mm contact pitch, ExtremePort™ Swift solutions are smaller than mainstream connectors in the current market to save space in the end device.
ExtremePort™ Z-Link
Amphenol introduces the SFF-TA-1002 standard solution - ExtremePort™ Z-Link, which is a 0.60mm pitch connector that comes with a slim form factor design, capable of transmitting a high-speed signal up to 56G PAM4, and allowing much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.
Extremeport-Z-Link(Gen Z)
Amphenol’s Extremeport Z-Link(Gen Z ) Connector is a scalable connector and connector interface compliant to SNIA: SFF-TA-1002. Z-Link can support PCIe Gen5, and is scalable to PCIe Gen6 and 112G PAM4. Z-Link can support high speed and power in one connector, and we developed 1C, 2C, 4C, and 4C+ connectors to support customers' different applications.
F-143 Connector
Building on the legacy of MIL-PRF-28876, the F-143 incorporates the latest technologies in fiber optic interconnect design. The backshells feature the Quickloc™ captivation system, developed by AFSI, that is easy to install, easy to remove the captivated aramid yarn of the cable, and recapture without cutting back the cable.
F2X Fiber Optic Building Entry Point
The building entry point (BEP) enables easy connection of buildings to your fiber optic network. The BEP can accommodate different numbers of fibers according to your needs. With the patented F2X® solution you are able to connect and measure FTTX installations faster.
FFC/FPC Connectors with Autolock Mechanism - F308/F332 Series (0.50mm pitch)
F308/F332 series is a 0.50mm pitch right angle Non-ZIF flex connector with an auto-lock mechanism and surface mount termination. It features a height of 2.45mm and comes in 6 to 68 contacts. This series features a cable thickness of 0.33mm and provides the durability of 20 mating cycles. Its robust connector design makes it suitable for robotic operations, supporting Industry 4.0.
Fiber Demarcation Box Gen 3 (FD3)
The FD3 offers a lightweight aluminum housing with enhancements to cable ports, tie-down brackets and seals, layered fiber routing, various connector port types, and increased capacity, as well as door lock options. Splice trays are configurable to accommodate discrete passive components, such as splitters and WDM filters, as well as High-Density optical modules.