With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
Amphenol's CXP passive copper cable assemblies are designed to meet the high bandwidth capacity demands being requested by data centers and high-performance computing applications. The CXP copper cables are a high-density cabling interconnect system capable of delivering aggregate data bandwidths of 120Gb/s and 168 Gb/s.
DDR2 SO-DIMM sockets are designed to accept modules that conform to JEDEC MO-224. The sockets come with a small form factor which allows fitting into smaller chassis, aiding the development of smaller & lighter notebooks. It comes in two voltage options with different key-ID to prevent incorrect mating. It operates at a higher speed & bandwidth lowers power consumption.
DDR3 vertical DIMM sockets are designed to accept 240 position DDR3 memory modules that conform to JEDEC M0-269. Low-resistance contacts support the use of RDIMM (registered DIMM), which helps to further reduce power consumption in data center hardware.
Vertical DDR4 DIMM sockets from Amphenol provide 288 contacts on 0.85mm pitch and are designed to accept DDR4 memory modules that conform to JEDEC MO-309. The DDR4 series complies with the new interface standard JEDEC POD12. It allows a module seating plane of 2.40mm and supports module variants in UDIMM, RDIMM, and LRDIMM.
HIGH-SPEED HIGH-DENSITY SO-DIMM SOCKETS
DDR4 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. Different key positions aid alignment and prevent mismating. 260 position SO-DIMM connectors are available in 4.00mm, 5.20mm, 8.00mm, 9.20mm height, in standard or reverse options.
DDR4 Ultra Low Profile (ULP) vertical DIMM sockets provide 288 contacts on 0.85mm pitch. It facilitates convenient memory expansion in servers, workstations, desktop PCs, and embedded applications in communications and industrial equipment. With an ultra-low module seating height of 1.1mm and connector height of 13.1mm, it reduces the overall profile of the connector.
COMPLIES TO NEW INTERFACE STANDARD JEDEC SO-023
Vertical DDR5 DIMM sockets from Amphenol provide 288 contacts on 0.85mm pitch and are designed to accept DDR5 memory modules that conform to JEDEC MO-329. The sockets facilitate convenient memory expansion in servers, workstations, desktop PCs, and embedded applications in communications and industrial equipment.
HIGH-SPEED HIGH-DENSITY SO-DIMM SOCKETS
DDR5 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. 262 positions SO-DIMM connector is available in 4.00mm height with the standard option. Sketching design of DDR5 SO-DIMM 8.00mm height with the standard option now.
Amphenol's DensiShield® I/O system is designed to support the transmission of high-speed, serial differential signals while taking customers' equipment packaging requirements into consideration. Combining high density, mechanical robustness, and ease of PCB assembly with excellent shielding and signal integrity performance means that system designers no longer have to compromise.
FCI Basics DIN 41612 connector systems are the most popular backplane interconnect systems in IEC 603-2 specifications due to the widespread standard adoption, easy availability, cost-effectiveness, and durability. The product design for Board-to-Board and I/O solutions involve both standard mount and reverse mount mating combination.
FCI Basics DIN IDC cable connectors are available in 4 connector sizes as 96, 42, 21, and 9 positions. Available in wire sizes 30AWG to 24AWG, their unique insulation displacement design grants the lowest installed cost for users. Standard accessories are also offered to make up a fully modular system.
HIGH-PERFORMANCE DIGITAL AUDIO/VIDEO INTERCONNECT SOLUTION
Amphenol DisplayPort connector system is a scalable solution that transmits 1, 2, or 4 lanes of High-Definition video at 2.7Gb/s per lane up to a maximum of 10.8Gb/s. DisplayPort also allows flexible allocation of available bandwidth between audio and video.
Double Density Cool Edge 0.80mm Connectors and Cable Assemblies
The 0.80mm pitch DDCE connectors and cable assemblies offer a compact design with 2 rows of contacts. This highly configurable single-piece connector can accommodate both high-speed and low-speed signal and power. This hybrid connector reduces more than half of the PCB footprint when compared to 1.00mm PCIe Cool Edge. It supports PCIe Gen 5 and is designed for multiple Add-In- Card thicknesses.
DSFP SMT Connectors offer dual high-speed lanes operating at 28Gb/s NRZ and 56Gb/s PAM-4 for a 50G & 100G aggregated bandwidth solution. It has additional 2 pins compared to the SFP/SFP+ family, which enables it to have a second high-speed channel with an identical connector form factor. The DSFP shares the same unique mating interface and EMI cage dimensions as the whole range of SFP/SFP+ cages.
FCI Basics D-Sub Accessories complement FCI Basics D-sub offering by accounting for the moderate to severe mechanical stresses encountered, and preventing risks like pulling up and accidental mismating. The range of derived accessories includes plastic or metalized plastic hoods, EMI/RFI shielded two-part metal hoods, various cable clamps, locking devices, dust caps, and brackets.
In addition to a wide variety of D-Sub connectors, we offer a large assortment of Backshells, Locking Systems and Mounting Hardware. We also offer blind mate options, EMI covers, Sealing Options, and custom options to fit many different application requirements.
FCI Basics D-Sub Cable Connectors span across signal and power applications in computer equipment, cash register, and high-end industrial cabinets. Signal connectors are available as removable crimp contacts, and power connectors in crimp, solder bucket, and wire wrap terminations.
DSUB CONNECTORS FOR CUSTOM APPLICATIONS
Amphenol has proven capability to work with customers and develop special product extensions to meet their custom applications. This can be to meet special polarization requirements, fitment to their special panel cabinets, extra standoff to meet the height requirements, assemblies for cable application, etc.
Amphenol ICC's D-Subminiature product line offers a wide range of termination options for board and cable ends, bringing down the overall cost of cable assembly and connectors significantly. The terminations include Straight, Right Angle, SMT, Press Fit, and Slim Sunk for board side, and Solder Cup, Crimping, IDC Ribbon, Solderless Wire Wrap, and Screw Termination for cable side.