With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
HIGH POWER AND LOW RESISTANCE 3.00MM BUSBAR CONNECTOR
Amphenol's BarKlip® XP300 connector is designed to mate directly with 3.00mm single pole busbars and provides a convenient method of distributing up to 300A between vertical and horizontal busbars. The connector features 16 independent points of conducting beams ensuring high reliability and ultra-low contact resistance.
HIGH POWER AND LOW RESISTANCE BUSBAR CONNECTOR
Amphenol's BarKlip® XP connectors feature independent points of contact that provide overall lower resistance and greater overall efficiency. BarKlip® XP series is capable of distributing anywhere from 150 to 1000A of power to busbar power distribution applications.
EBY-Amphenol offers a complete selection of industry-standard barrier strip terminal blocks, customizable to meet your needs. Our barrier strip terminal blocks support a broad range of wire-to-board configurations, ideal for industrial applications, security and alarm systems, and utilities. No special tools required. Contact us now for more information!
Battery Connector for Cordless Power Tools/Vacuum Cleaner
CUSTOMIZABLE HIGH DURABILITY, HIGH CURRENT RATING, CORDLESS POWER TOOLS
The Power Tools Battery connector offers ideal power solution in terms of high current and high durability, better performance in terms of IP protection and overall connector life. The termination for the same can be optimized as per the working requirement.
FLEXIBLE SOLUTION FOR HIGH-SPEED APPLICATIONS
Amphenol's FCI Basics BergStak HS™ connector family is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. BergStak HS™ 0.50mm connector family with 0.50mm pitch enables high-speed data applications with up to PCIe® Gen 5 32Gb/s.
FLEXIBLE SOLUTION FOR HIGH-SPEED APPLICATION
FCI Basics BergStak HS™ connector family is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. BergStak HS™ 0.80mm connector family with 0.80mm pitch enables high-speed data applications with up to PCIe® Gen 5 32Gb/s.
BergStak+™ 0.80mm is designed to be the next generation PCIe 4.0 compliant mezzanine connector system. It is compatible with the existing BergStak® 0.80mm product recommended by the OCP. It guarantees to support up to 16Gb/s performance. Customers can upgrade its board-to-board performance from PCIe 3.0 to PCIe 4.0 while leveraging BergStak+™'s backward compatibility and same footprint feature.
The BergStak® 0.40mm board-to-board connectors are in 0.4mm pitch with double row contacts, the family now supports stack height of 1.50/2.0/3.0/3.5/4.0mm and position ranges in 10-100 positions (10/20/24/30/34/40/50/60/70/80/90/100). The lock feature on contacts works together with shock-absorbing ribs on the housing to make it suitable for high-vibration applications and friendly for FPC applications.
FINE PITCH SOLUTION WITH SELF-ALIGNMENT FEATURE
FCI Basics BergStak® 0.50mm self-alignment connectors come with a stack height of 3mm and 50 positions extendable across 20 to 60 positions in increments of 10. It has a unique self-alignment feature that supports blind mating.
MICRO PITCH LOW PROFILE HIGH SPEED BOARD-TO-BOARD CONNECTOR
BergStak® 0.635mm pitch is a compact board-to-board connector with low stack height of 3.00mm. Available in 80 and 140 positions it support applications which require high pin counts and low profile connection.
BergStak® 0.635mm supports signal speeds up to 8Gb/s with an open-pin-field, providing design flexibility.
FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS
Amphenol's BergStak® 0.8 mm is a flexible solution designed for high-speed and high-density, parallel board-to-board connector systems with 16 PCB stack heights in 10 sizes up to 200 positions.
FCI Basics BergStak® 0.80mm connector family is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. Bergstak® shielded connector with 0.80mm pitch supports high-speed data applications up to 10Gb/s.
FCI Basics BergStak® product range is expanded to include 0.50mm BergStak® FX10 board-to-board connector known for its fast data transmission and high signal quality. This connector is offered in 144 positions and is available in 4.30mm and 6.00mm stack height options. Position is extendable up to 168 positions.
BergStak® FX10 supports speed performance up to 15Gb/s+ and is available in vertical SMT
The BergStak® Secure connector family contains one-time-use and multi-times-use solutions to support customers' different needs on connection security. The family now contains variants with 3-row and 4-row contacts with 37 columns per row, and it can be extended in both (10)row and (100)column direction based on customer requirements, to fulfill high pin count/high signal density requirements.
BergStik® FCI Basics 2.54mm unshrouded headers are available in SMT, THT, press-fit, stacking, and PIP versions. Designed in single and double row, they are available in straight or right angle options, from 2 to 72 positions.
Featuring a "breakaway" design, each connector can be cut or broken into lengths to suit the application profile with a maximum current rating of 3A per contact.
Amphenol's Blind Mate MCIO is designed for high speed and high density. It can support PCIe Gen5, and is scalable to PCIe Gen6. We designed Blind Mate MCIO with a guide pin to prevent damages during plug in and plug out. Blind mate MCIO has a robust mechanical design, and the connector can be fixed by a screw-on panel.
Amphenol LTW’s X-Lok Connectors are presented in various sizes for power, signal and hybrid applications for fast, simple and reliable connections. Featuring a push lock mechanism for intuitive mating with audible and tactile feedback. The X-Lok provides less mating failure & quicker installation than traditional threaded solutions【Quick guide: https://amphenolltw.com/down.php?supp_download=112】
SV Microwave’s latest product line offers a comprehensive range of RF interconnects, including standard and bulkhead cable connectors for a variety of cable types and PCB connectors ideal for use in board-to-board solutions, with connectors in both Full Detent and Smooth Bore options, as well as a bullet. This product line is rated to work up to 22 GHz, ensuring reliable and high-performance RF solutions.
Amphenol RF offers a variety of board-to-board solutions engineered to maximize radial and axial float, eliminating the need for cables between the boards and simplifying designs to eliminate assembly errors.
FCI Basics Boltrack™ connector promotes signal and PoE++ transmission over Cat 5e and 6 cables in a wide range of datacom and industrial applications. It offers lightning protection, EMI shielding, and is field-installable. Boltrack™ connector comes in a 4-pair right-angle board receptacle and cable plug mating combination. The connector can resist voltages up to 2,500V.