With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
Amphenol's D-Sub Pin-in-Paste Connectors are now available in Pin-in-Paste (Through Hole Reflow) versions in standard and compact form factors.
Pin-in-Paste technology (PiP) allows the use of Through Hole product in SMT manufacturing processes. The connectors use high temperature thermoplastic that can withstand reflow soldering temperatures up to 260°C to facilitate PiP soldering.
Amphenol's D-Sub Power Board-Mount Connectors features full power and mixed power versions specifically developed for power applications in industrial and telecom market segment. Board connectors feature preloaded power contacts from 10A to 40A with up to 8 contacts in full power versions. Cable crimp and solder power contacts features colour code plastic clips for easy wire gauge identification.
Amphenol FCI offers Standard density and Mixed power connectors in press fit termination. In SMT (Surface Mount Technology) manufacturing process, this Press-fit series connectors help to save the cost of an additional wave soldering. The "eye of the needle" termination combined with a special flat rock design (easy application by pressure on insulator) make this product line very attractive.
ULTRA SLIM D-SUB CONNECTORS
Amphenol has expanded the D-Sub connectors with a modified ultra slim body with contact alignment in a single row. These are available both in SMT termination suitable for reflow soldering and solder tail version for standard wave soldering. These connectors also feature solderable retention pegs that absorb vibration.
D-Sub connectors are now available with Surface Mount Termination (SMT) in standard form factors. The connectors use high-temperature thermoplastic that can withstand reflow soldering temperatures up to 260°C to facilitate SMT soldering. The products are UL recognized and lead-free.
The standard density D-Subminiature series are widely used for numerous applications in many market segments. Amphenol offers Delta-D (single shell design) and Frugal-D (two shell design) under this category. Standard density D-subminiature PCB mount connectors available in straight and angled version. They come with a large number of mounting options.
STANDARD DENSITY D-SUBMINIATURE CONNECTORS
Current rating for stamped and formed signal pin is 3A and 7.5A for machined signal pin
Dip and PF board termination, and various cable termination such as IDC, wire wrap, solder cup, wire screwed and crimping
Tray standard packing and tube is per request
Contact resistance less than 20mOhm
High reliability machined and commercial stamped contacts are avail
Amphenol's NFD17 D-Subminiature connectors complement our extensive I/O connector product line. This line of connectors offers many superior features, high performance level and low installation cost. These proven D-Subminiature connectors are one of the most popular Input/Output interconnects, addressing a wide variety of applications in Telecommunications, Data, Consumer Industrial, Instrumentation and Me
The Dubox®, connector family offers an extensive range of through-hole and surface-mount part options. It is available in single or double-row in both straight and right angle orientations from 2 to 50 positions, with a maximum current rating of 3A per individual contact. This cost-efficient solution offers high reliability in electrical performance.
The Dubox®, connector families offer an extensive range of through-hole and surface-mount part options, including single or double-row in either straight or right-angle orientation from 2 to 50 positions, with a current rating of 3A (maximum) per individual contact. The Dubox® contact has a pre-stressed, dual-beam design to enable low insertion force, 4-wall contact design for signal protection.
HIGHLY DURABLE SWAPPABLE DOCKING CONNECTOR
The swappable custom battery connector solutions with cable assemblies are offered in 2 power & 6 signal configurations. These connectors can carry a continuous current up to 100A with 10,000 mating cycles. They are IP67-rated in mated condition and can be mated in two directions (bi-directional mating).
HIGHLY DURABLE SWAPPABLE DOCKING CONNECTOR
The swappable custom battery connector solutions with cable assemblies are offered in 2 power & 6 signal configurations. These connectors can carry a continuous current of 15A-70A with 10,000 mating cycles and IP67 rated in mated and unmated condition
Available in a variety of shell sizes and insert arrangements for Power, Mixed Power/Signal, Coax, and RJ45 layouts. Amphenol Sine Systems’ ecomate® Aquarius Waterproof Connectors provide an IP67/69K waterproof rating when in a mated condition for industrial applications and incorporates the latest technology in high impact thermoplastic design, offering many advantages.
EconoStik™ 2.54mm is an economical range of 2.54mm unshrouded header. It is available in single-row and double-row with vertical through-hole, right-angle through-hole, and vertical SMT terminations. EconoStik™ 2.54mm is a standard 0.64mm square header with high-temperature resin and 1μ" gold plating in contact and tail. It supports up to 50 mating cycles.
Amphenol introduces the next-generation OverPass™ solution - EDSFF Board Site Connector. The 0.60mm pitch connector comes with a slim form factor design, capable of transmitting a highspeed signal up to PCIe® Gen 5 and PCIe® Gen 6 and allowing much greater signal path lengths while maintaining SI performance compared to conventional PCB routing methods.
EDSFF ORTHOGONAL CABLE ASSEMBLY WITH DIFFERENTIAL SIGNALING TO 32GT/S NRZ FOR NEXT-GENERATION SYSTEMS
Amphenol's EDSFF E1/E3 high-speed cable assembly transmits power and high-speed signals via a cable that directly connects to the main PC board supporting EDSFF E1/E3 SSD and CXL or other modules.
CLASSIC HPCE® WITH ENHANCED PERFORMANCE
eHPCE® connector offers a 15% increase in power density with the same footprint as classic HPCE®. The all-new power contact design offers lower contact resistance and higher current carrying capacity compared to classic HPCE® connectors. eHPCE® connectors are designed to extend the life of power supplies using card edge output power connectors.
ULTRA-HIGH DENSITY BACKPLANE INTERCONNECT SOLUTION
Ultra-High density 56+ Gbp/s PAM4 interconnect platform utilizing proven press-fit technology and a single wafer design optimized for traditional backplane, direct orthogonal, and cable design solutions.
SV Microwave streamlines this with our innovative Embedded Phase Tuner. This component allows customers to independently adjust the phase of cable assemblies without external vendor involvement. The Embedded Phase Tuner operates by adjusting the transmission line length using a threaded coupling nut, simplifying the process.
Amphenol's EMC Shields are widely used in applications that require electromagnetic isolation of board-level components. They are provided in a wide variety of profiles and sizes to accommodate mother/daughter board configurations. Amphenol EMC Shields also commonly known as EMI shields and RFI shields, is a popular solution for minimizing crosstalk and susceptibility.