IT Datacom

With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.

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Product QSFP DD Cable Assemblies
QSFP DD Cable Assemblies
200G / 400G / 800G SOLUTIONS Amphenol's QSFP DD (Double Density) copper cable assemblies double the number of channels from 4 to 8 lanes when compared to the existing QSFP cabling systems, enabling more bandwidth within the same mechanical envelope.

Product QSFP DD OverPass™ Assemblies
QSFP DD OverPass™ Assemblies
56G AND 112G DIRECT HIGH SPEED CONNECTION FROM CHIP SITE TO IO PORT QSFP DD OverPass™ products remove high speed signaling from the PCB and create an eight channel direct lower loss interconnection between the ASIC site and the external QSFP DD IO port by overpassing the PCB. This helps to enable 56G and 112G hardware system designs and a technology for future 224G systems.

Product QSFP OverPass™ Assemblies
QSFP OverPass™ Assemblies
28G AND 56G DIRECT HIGH SPEED CONNECTION FROM CHIP SITE TO IO PORT QSFP OverPass™ products remove the high speed signaling from the PCB and create a four channel direct lower loss interconnection from the ASIC site to the external IO port by overpassing the PCB. This helps to enable 28G and 56G hardware system designs.

Product QSFP+ Cable Assemblies
QSFP+ Cable Assemblies
Amphenol's QSFP (Quad Small Form-factor Pluggable) connector, cage and cable assemblies are designed to meet emerging data center and high performance computing application needs for a high density cabling interconnect system capable of delivering aggregate data bandwidths of 40Gb/s & 56 Gb/s & 112 Gb/s.

Product Quickie® IDC Cable-to-Board Connector System
Quickie® IDC Cable-to-Board Connector System
FCI Basics Quickie® is a complete solution for flat cable-to-board connections using 2.54mm pitch IDC technology. The highly durable and cost-saving connectors come with specialized features in polarization, plating, and structure. Headers are low profile and come in shrouded versions with or without eject latches. Receptacles have strain relief covers for precise alignment.

Product (Radio Frequency Connectors) RF Connectors
(Radio Frequency Connectors) RF Connectors
Amphenol LTW's RF connector (radio frequency connector) is an electrical connector designed to work at radio frequencies in the multi-megahertz range. RF connectors are typically used with coaxial cables and are designed to maintain the shielding that the coaxial design offers. Available in SMA【Quick guide: https://amphenolltw.com/down.php?supp_download=105】

Product RADSOK® PGY™
RADSOK® PGY™
This series, utilizing RADSOK® socket contact technology for right angle power-to-board application, compact footprint, metal square, press-fit high power connector. With five sizes ranging from 2.4mm, 3.0mm, 3.6mm, 4.8mm, and 5.7mm contact sizes and up to 120 amps possible with a standard operating temperature from -40°C to +125°C.

Product RADSOK® PowerBlok™
RADSOK® PowerBlok™
This series, utilizing RADSOK® socket contact technology for power-to-board backplane application, compact footprint, thermoplastic square, press-fit high power connector. With three sizes ranging from 2.4mm, 3.0mm, and 3.6mm contact sizes and up to 70 amps possible with a standard operating temperature from -40°C to +125°C.

Product RADSOK® PowerBlok™ WTB
RADSOK® PowerBlok™ WTB
This series, utilizing RADSOK® socket contact technology for power-to-board two-point contact terminals application, low profile compact footprint, metal square, press-fit high power connector. With two sizes, 2.4mm and 3.6mm contacts and up to 70 amps possible with a standard operating temperature from -40°C to +105°C.

Product RADSOK® SMT RADSERT™
RADSOK® SMT RADSERT™
This series, utilizing RADSOK® socket contact technology for board-to-board mezzanine application, compact footprint, metal circular, press-fit high power connector. With five sizes ranging from 2.4mm, 3.0mm, 3.6mm, 4.8mm, and 6.0mm contact sizes and up to 120 amps possible with a standard operating temperature from -40°C to +125°C.

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