IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
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D-Sub Economy Range Board-Mount Connectors
Amphenol's D-Sub Economy Range Board-Mount Connectors are proven solutions designed to meet less demanding applications while meeting all their design requirements. These connectors have a guaranteed durability of 50 mating cycles. Board connectors are available in straight and right angle versions, while cable connectors are available in solder bucket and crimp styles.
D-Sub High Density Board-Mount Connectors
Amphenol's D-Sub High Density Board-Mount Connectors, based on the compact-D form factor, complete your board and system designs by providing high-density and high-speed interfaces. The high-speed, power, assembly and mechanical packaging expertise, aids in getting the signals out of the box at optimal cost and performance, while accommodating up to 78 positions in standard shell sizes.
D-Sub MicroTCA Connectors
Amphenol's D-Sub MicroTCA Connectors are power module I/O interconnects for 48V applications designed in accordance with TCA specifications. The concept is based on the single-shell Delta D design, and power contacts handle up to 24A. PCB connectors are proposed in traditional Solder-to-board and Pin-in-Paste versions for optimized applied cost. The connector's compact footprint allows for more space ...
D-Sub Pin-in-Paste Connectors
Amphenol's D-Sub Pin-in-Paste Connectors are now available in Pin-in-Paste (Through Hole Reflow) versions in standard and compact form factors.
Pin-in-Paste technology (PiP) allows the use of Through Hole product in SMT manufacturing processes. The connectors use high temperature thermoplastic that can withstand reflow soldering temperatures up to 260°C to facilitate PiP soldering.
D-Sub Power Board-Mount Connectors
Amphenol's D-Sub Power Board-Mount Connectors features full power and mixed power versions specifically developed for power applications in industrial and telecom market segment. Board connectors feature preloaded power contacts from 10A to 40A with up to 8 contacts in full power versions. Cable crimp and solder power contacts features colour code plastic clips for easy wire gauge identification.
D-Sub Press-Fit Connectors
Amphenol FCI offers Standard density and Mixed power connectors in press fit termination. In SMT (Surface Mount Technology) manufacturing process, this Press-fit series connectors help to save the cost of an additional wave soldering. The "eye of the needle" termination combined with a special flat rock design (easy application by pressure on insulator) make this product line very attractive.
D-Sub Standard Board Mount Connectors
The standard density D-Subminiature series are widely used for numerous applications in many market segments. Amphenol offers Delta-D (single shell design) and Frugal-D (two shell design) under this category. Standard density D-subminiature PCB mount connectors available in straight and angled version. They come with a large number of mounting options.
D-Sub Standard Density Connectors - NFD17 Series
Amphenol's NFD17 D-Subminiature connectors complement our extensive I/O connector product line. This line of connectors offers many superior features, high performance level and low installation cost. These proven D-Subminiature connectors are one of the most popular Input/Output interconnects, addressing a wide variety of applications in Telecommunications, Data, Consumer Industrial, Instrumentation and Me
EDSFF Board Site Connector
Amphenol introduces the next-generation OverPass™ solution - EDSFF Board Site Connector. The 0.60mm pitch connector comes with a slim form factor design, capable of transmitting a highspeed signal up to PCIe® Gen 5 and PCIe® Gen 6 and allowing much greater signal path lengths while maintaining SI performance compared to conventional PCB routing methods.
Elite®
ULTRA-HIGH DENSITY BACKPLANE INTERCONNECT SOLUTION
Ultra-High density 56+ Gbp/s PAM4 interconnect platform utilizing proven press-fit technology and a single wafer design optimized for traditional backplane, direct orthogonal, and cable design solutions.
eQSFP
The eQSFP interconnect system is comprised of a 38 position 0.8mm pitch SMT connector, and a press-fit cage. With four channels of data in one pluggable, the system interface is capable of transferring data up to 28 Gbps/Channel and replacing up to 4 standard SFP+ receptacles. Supporting standards include Gigabit Ethernet, InfiniBand, and SONET/SDH with different data rate options.
EXAMAX2® 112Gb/s Backplane Cable
EXAMAX2® Cable Backplane Systems offer high density cable assemblies for both internal and external applications that are capable of delivering high speed performance of 112Gb/s per channel. EXAMAX2® cable applications include internal OverPass™ cables, external I/O cables, cabled midplane and cabled backplane
ExaMAX2® 112Gb/s High-Speed Backplane Connector
The ExaMAX2® backplane connector system supports 112Gb/s PAM4 industry specifications. It maintains mating interface compatibility with previous ExaMAX products to allow cost/performance flexibility for designers. The mating interface and connector design are optimized to support the demanding electrical and mechanical requirements of 112G systems. ExaMAX2 delivers industry-leading SI performance.
ExaMAX® 56Gb/s Backplane Cable
The ExaMAX® I/O system offers cable assemblies and I/O connector solutions for both internal and external applications. ExaMAX® I/O products are capable of delivering high-speed performance of 25 Gb/s per channel with a path to 40 Gb/s and higher. The ExaMAX® I/O system delivers superior linear board signal density and meets the performance requirements of the OIF-CEI-25G-LR industry standard.
ExaMAX® 56Gb/s High-Speed Orthogonal Connector
The ExaMAX® high-speed orthogonal connector system is designed to enable superior 25Gb/s electrical performance and provide a path to 56Gb/s in anticipation of further increases in bandwidth requirements. The 6-Pair orthogonal right-angle header connector solution further expands the range of applications supported by the ExaMAX® connector system.
ExaMAX® VS High-Speed Backplane Connector
The ExaMAX® VS backplane system is a scalable, cost-optimized connector system designed for higher bandwidth applications up to 25Gb/s. The high-performance connector system provides both mechanical robustness and superior signal integrity, minimizing channel performance variation for every differential pair.
ExaMEZZ® 56Gb/s High Speed, Hermaphroditic BGA Mezzanine Connector
The ExaMEZZ® connector is designed to enable superior 25Gb/s electrical performance and provide a path to 56Gb/s in anticipation of further increases in bandwidth requirements and high-speed signaling. ExaMEZZ® connectors feature a revolutionary beam-on-beam contact interface that minimizes the residual stub for improved signal integrity performance.
ExpressPort® QSFP+
Amphenol's ExpressPort® QSFP+ interconnect system is comprised of a 38 position 0.8mm pitch SMT connector, & a press-fit cage. With four channels of data in one pluggable, the system interface is capable of transferring data up to 16Gb/s per Channel, & replacing up to 4 standard SFP+ receptacles. These features result in greater port density & overall cost savings over traditional SFP+ products.
ExpressPort® SFP+
Amphenol's ExpressPort® SFP+ interconnect system provides data transfer speeds of up to 16Gb/s. The design of the ExpressPort® SFP+ connector minimizes impedance discontinuities & reflections at high data rates & provides a 10-20dB improvement in Near-End Crosstalk. ExpressPort® SFP+ cage construction features EMI shielding available in the form of metal spring fingers or elastomeric gaskets.
ExtremePort™ Flash Connector
Amphenol introduces the next-generation OverPass™ solution - ExtremePort™ Flash. The 0.60mm pitch connector comes with an extremely low profile design capable of transmitting a high-speed signal up to 56G PAM4, and allows much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.