IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
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AirMax VSe® High-Speed Backplane Connector
HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE WITH ENHANCED PERFORMANCE
AirMax VSe® connectors address the industry needs for high bandwidth applications requiring a scalable migration path to 25Gb/s data rate. AirMax® technology delivers signal densities up to 63.5 differential pairs per inch when using a 5-pair connector system.
AirMax VS® 85Ohms High-Speed Backplane Connector
HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE SUPPORTING INTEL® QPI
AirMax VS® 85Ohms connectors are optimized to minimize impedance discontinuities and signal loss in 85Ohms channels. The connectors' mating interfaces also satisfy demands for backward compatibility to legacy 100 Ohms product interfaces ensuring a smooth transition to next-generation designs.
AirMax VS® Connectors for CompactPCI® Serial System
AirMax® high speed signal connectors meet the dimensional and electrical requirements described in CompactPCI® Serial (PICMG CPCI-S.0) specification. It moves CompactPCI® architecture to high speed serial interconnects to add greater support for serial point to point fabrics like PCI Express®, SATA, Ethernet and USB in the classic CompactPCI® form factor with mechanics fully compliant to IEC 1101.
AirMax VS® Coplanar High-Speed Backplane Connector
AirMax VS® coplanar connectors permit mating 2 boards in the same plane. This is very useful for many applications, one base card can mate to many IO cards to cost effectively offer different system IO options. ATCA systems, Zone 3 connectors directly connect front and rear cards, bypassing the backplane, effectively doubling the electronic capabilities of each slot within the system.
AirMax VS® High-Speed Backplane Connector
AirMax VS® connectors use innovative edge-coupling and air dielectric between adjacent conductors to deliver insertion loss and crosstalk. The AirMax VS® connectors address a broad range of system architectures, including backplane, mid-plane, coplanar, mid-plane orthogonal, cabled backplane, and mezzanine applications.
AirMax VS® Orthogonal High-Speed Backplane Connector
AirMax VS® Orthogonal mid-plane interface features two back-to-back AirMax VS® headers oriented at 90 degrees to each other. The headers connect 16 differential signal pairs through shared vias in the mid-plane, providing a direct, high-speed connection while eliminating traces on the mid-plane. The AirMax VS® Orthogonal mid-plane interconnects can support differential signaling at up to 20Gb/s.
AirMax VS® SBB High-Speed Backplane Connector
AirMax VS® high-speed signal connectors, guide modules, and power connectors meet the dimensional and electrical requirements for the Storage Bridge Bay Mid-plane Interface (SBBMI) to connect bridge/controller cards to the mid-plane in a drive enclosure. It comes with high-speed serial data rates that can scale from 2.5Gb/s to 12.5Gb/s without requiring the redesign of a basic platform.
AirMax VSX®
Amphenol's AirMax VSX® connectors are high speed, high density, 2.00mm pitch connectors that support 56Gb/s PAM4 performance. Innovative design reduces crosstalk and reaches excellent SI performance. AirMax VSX provides a migration path to 56Gb/s PAM4 with backward mating compatibility with traditional AirMax VS®, AirMax VS2® and AirMax VSe® series. Industry leading robustness with field proved components.
Alternative to M12 - Ultra High-Density X-Lok Push-Lock Connector
Amphenol LTW’s 33-pin Ultra High-Density (UHD) X-Lok Metal Mini Size push-lock connector boasts a compact design and high contact density, providing space efficiency and enhanced data transmission. This connector serves as an excellent alternative to traditional M12 solutions【Video: https://www.youtube.com/watch?v=7gU_zye2zIw】【Quck guide: https://amphenolltw.com/down.php?supp_download=112】
Alternative to M8 | X-Lok Push Lock Micro Size Connector
Amphenol LTW’s X-Lok Micro Size connectors compatible with the M8 panel cutout, offer an advanced secure solution for signal, and data transmission. Featuring a spring-loaded push lock mechanism, ensure intuitive, fast, reliable connections with audible feedback, minimizes mating failures【Video: https://youtu.be/63FoeMHT9mM】【Quick Guide: https://amphenolltw.com/down.php?cn=news_content&id=151】
Amphe-PD™
This series, utilizing RADSOK® socket contact technology, is a general duty, touch-proof, thermoplastic rectangular with integrated latch push-pull coupling high power connector. Two poles per connector and up to 120 amps possible with a standard operating temperature from -55°C to +125°C.
Amphe-PRB
This series, utilizing RADSOK® socket contact technology, is an IP67 rated, thermoplastic reverse bayonet coupling, high power connector. With over six insert arrangements ranging from 3 to 5 contacts per connector and up to 70 amps possible with a standard operating temperature from -40°C to +100°C.
APC 8010
The APC 8010 is the perfect machine for every fiber optic production. High reproducibility with all connector geometries ensures high productivity during production. This is made possible by a permanent pressure control, which is adjusted to the connector type and quantity.
A-Type & B-Type USB Connectors
Amphenol LTW's waterproof USB connectors are IP67 / IP68 rated and designed with standard Type A/B interfaces in various product configurations -- plastic/metal, screw/bayonet locking, receptacle, receptacle with cables, overmolded cable, and field-installable demands for industrial applications【Quick Guide: https://amphenolltw.com/down.php?supp_download=111】
Automotive Grade PCI Express® Gen 5 Card Edge Connectors
EXTEND DIFFERENTIAL SIGNALING TO 32GT/S FOR NEXT-GENERATION SYSTEMS
PCIe® Gen 5 straddle mount connectors outperform the industry standards with higher speed along with complying to USCAR. The optimized series supports backwards mating and is footprint compatible with PCIe® 4/3/2/1.
BarKlip® BK1000 HD I/O 1OU Cable Connector
HIGH POWER OCP-COMPATIBLE CABLE ASSEMBLY COMPLIANT WITH OPEN COMPUTE POWER DISTRIBUTION ARCHITECTURE
Amphenol's BarKlip® BK1000 HD I/O power cable assemblies feature an OCP-compatible design, compliant with ORv3 power distribution architecture standards. Barklip® BK1000 HD IO can distribute up to 1000A per contact, load and return, and up to 2000A total. Designed similarly to other ORv3 busbar connectors
BarKlip® BK100 I/O
Amphenol's BarKlip® BK100 I/O provides a convenient method of distributing up to 100A between busbars, cables and circuit boards. It features 12 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases the efficiency and reliability of current transition
BarKlip® BK1200 HD I/O 1OU Cable Connector
HIGH POWER OCP-COMPATIBLE CABLE ASSEMBLY COMPLIANT WITH OPEN COMPUTE POWER DISTRIBUTION ARCHITECTURE
Amphenol's BarKlip® BK1200 HD I/O power cable assemblies feature an OCP-compatible design, compliant with ORv3 power distribution architecture standards. Barklip® BK1200 HD I/O can distribute up to 1250A per contact, load and return, and up to 2500A total.
BarKlip® BK150 Connector
The BarKlip® BK150 connector features 10 independent conducting beams that maintain contact with the mating busbar in common misaligned positions, therefore significantly lowering overall resistance.
BarKlip® BK150's contacts include a stainless- steel helper spring to ensure that proper mating force is maintained and contact resistance is minimized throughout the life of the connection.
BarKlip® BK200 I/O
BarKlip®BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables and circuit boards. It features 14 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases the efficiency and reliability of current transition.