With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
The ExaMAX® I/O system offers cable assemblies and I/O connector solutions for both internal and external applications. ExaMAX® I/O products are capable of delivering high-speed performance of 25 Gb/s per channel with a path to 40 Gb/s and higher. The ExaMAX® I/O system delivers superior linear board signal density and meets the performance requirements of the OIF-CEI-25G-LR industry standard.
The ExaMAX® VS backplane system is a scalable, cost-optimized connector system designed for higher bandwidth applications up to 25Gb/s. The high-performance connector system provides both mechanical robustness and superior signal integrity, minimizing channel performance variation for every differential pair.
ExaMEZZ® 56Gb/s High Speed, Hermaphroditic BGA Mezzanine Connector
The ExaMEZZ® connector is designed to enable superior 25Gb/s electrical performance and provide a path to 56Gb/s in anticipation of further increases in bandwidth requirements and high-speed signaling. ExaMEZZ® connectors feature a revolutionary beam-on-beam contact interface that minimizes the residual stub for improved signal integrity performance.
Amphenol's ExpressPort® QSFP+ interconnect system is comprised of a 38 position 0.8mm pitch SMT connector, & a press-fit cage. With four channels of data in one pluggable, the system interface is capable of transferring data up to 16Gb/s per Channel, & replacing up to 4 standard SFP+ receptacles. These features result in greater port density & overall cost savings over traditional SFP+ products.
Amphenol's ExpressPort® SFP+ interconnect system provides data transfer speeds of up to 16Gb/s. The design of the ExpressPort® SFP+ connector minimizes impedance discontinuities & reflections at high data rates & provides a 10-20dB improvement in Near-End Crosstalk. ExpressPort® SFP+ cage construction features EMI shielding available in the form of metal spring fingers or elastomeric gaskets.
Amphenol introduces the next-generation OverPass™ solution - ExtremePort™ Flash. The 0.60mm pitch connector comes with an extremely low profile design capable of transmitting a high-speed signal up to 56G PAM4, and allows much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.
EXTREMEPORT™ OSFP 224G INTERCONNECT SYSTEM
Amphenol's ExtremePort™ OSFP 224G interconnect system is comprised of a 60 position, 0.6mm pitch connector built for use in high-speed serial applications. Each port supports up to 1.6Tb/s in aggregate over an 8x224Gb/s electrical interface. The OSFP footprint is optimized for signal integrity performance.
EXTREMEPORT™ OSFP-XD 112G INTERCONNECT SYSTEM
Amphenol's ExtremePort™ OSFP-XD 112G interconnect system is comprised of a 120-position, 0.6mm pitch connector built for use in high-speed serial applications. Each port supports up to 1.6Tb/s in aggregate over a 16 x 112Gb/s electrical interface. The OSFP-XD footprint is optimized for signal integrity performance.
BACKWARDS PLUG COMPATIBLE AND SUPERIOR SIGNAL INTEGRITY
Amphenol's ExtremePort™ QSFP 112G interconnect system is comprised of a 38position, 0.8mm pitch connector built for use in high speed serial applications. Each port offers 4 channels which increases port density, frees up board real estate and delivers a cost optimized solution. The ExtremePort™ QSFP 112G connector supports next generation 400G appli
Amphenol's ExtremePort™ QSFP DD 112G interconnect system is comprised of a 76 position, 0.8mm pitch connector built for use in high-speed serial applications. Each port supports up to 800Gb/s in aggregate over an 8 x 112Gb/s electrical interface. The cage and connector design provides backward compatibility to QSFP56...
EXTREMEPORT™ QSFP-DD 224G INTERCONNECT SYSTEM
Amphenol's ExtremePort™ QSFP-DD 224G interconnect system is comprised of a 76 position, 0.8mm pitch connector built for use in high-speed serial applications. Each port supports up to 1.6Tb/s in aggregate over an 8 x 224Gb/s electrical interface. The cage and connector design provides backwards compatibility to QSFP modules which can be inserted into a QSFP-DD
Amphenol's ExtremePort™ QSFP+ interconnect system is comprised of a 38-position, 0.8mm pitch connector built for use in high-speed serial applications. Each port offers 4 channels to increase port density which allows for more board real estate and cost-optimized solutions. The ExtremePort™ QSFP+ connector supports next-generation 200G+ applications and transmits up to 56Gb/s PAM4 per channel.
Amphenol's ExtremePort™ SFP+ interconnect system is comprised of a 20-position hot-swappable I/O connector enclosed in a metal cage mounted to a host PCB.It supports up to 56Gb/s PAM4 aggregate bandwidth with backward compatibility for next-gen Ethernet & Fibre Channel applications. ExtremePort™ SFP+ connector shares the same unique mating interface & EMI cage dimensions as the SFP+ form factor.
In order to provide higher speed and smaller size solution on networking equipment and server, Amphenol has developed ExtremePort™ Swift connector which is used in application of PCIe® Gen5 signal NRZ 32GT/s, UPI 2.0 24GT/s, 24Gb/s SAS signal. With 0.6mm contact pitch, ExtremePort™ Swift solutions are smaller than mainstream connectors in current market to save space in end device.
Amphenol introduces the SFF-TA-1002 standard solution - ExtremePort™ Z-Link, which is a 0.60mm pitch connector that comes with a slim form factor design, capable of transmitting a high-speed signal up to 56G PAM4, and allowing much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.
The building entry point (BEP) enables easy connection of buildings to your fiber optic network. The BEP can accommodate different numbers of fibers according to your needs. With the patented F2X® solution you are able to connect and measure FTTX installations faster.
CTW (Card-to-Wire) fan module connector comes with a flexible design for card-to-wire power applications used in fan modules. It allows different wire gauges ranging from 28AWG - 22AWG. The connector provides a maximum current rating of 4A/pin.
Amphenol's Flat Flexible Cable (FFC) Jumpers are available in a wide range of standard cable lengths to meet the wide range of flexible interconnect requirements between two PC boards. They are available in 1.00mm pitch (FF5026) and 050mm pitch (FF3025). Type S(same-side) and Type O(opposite-side) contact layouts allow for mirrored contacts in top and bottom-mount.
The FD3 offers a lightweight aluminum housing with enhancements to cable ports, tie-down brackets and seals, layered fiber routing, various connector port types, and increased capacity, as well as door lock options. Splice trays are configurable to accommodate discrete passive components, such as splitters and WDM filters, as well as High-Density optical modules.
The FDE enclosure has a low profile, side-by-side door design that provides an ideal environment for splicing and patching in indoor wall-mount applications. An integrated access door on the customer side of the enclosure provides a generous opening for a cleaning tool to reach the optical connectors, resulting in a more craft-friendly design.