IT Datacom

With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.

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Product PwrBlade® MiniMezz Connector Series
PwrBlade® MiniMezz Connector Series
The PwrBlade® Mini connector series introduces enhanced features to our existing PwrBlade® products in a smaller profile. PwrBlade® MiniMezz is available in stack heights ranging from 8mm - 20mm with options for power & signal contacts. It also has blind-mate guides that allow for ±0.80mm of gatherability for blind-mate applications.

Product PwrBlade® ULTRA Connector System
PwrBlade® ULTRA Connector System
PwrBlade® ULTRA's design offers an overall height reduction of 24% to reduce airflow impedance in high-density power supplies. Three contact choices are available; High Power, Low Power, and Signal. Ultra-high conductivity materials and new highly conductive plating, combine to produce an ultra-low resistance of just 0.4mΩ at end-of-life conditions.

Product PwrBlade® ULTRA HD+ BTB Connector System
PwrBlade® ULTRA HD+ BTB Connector System
HIGH POWER BOARD-TO-BOARD CONNECTOR SYSTEM Amphenol's new, PwrBlade® ULTRA HD+ connector series features an enhanced high-power contact design capable of providing up to 100A per contact (per 4 adjacent contacts) and high-density signal options with up to 6 signal pins per column.

Product PwrBlade® ULTRA HD+ Cable Assembly
PwrBlade® ULTRA HD+ Cable Assembly
HIGH-POWER CABLE-TO-BOARD CONNECTOR SYSTEM Amphenol's PwrBlade® ULTRA HD+ Cable-to-Board serves as a high-power I/O cable configuration in a low-profile design. The connector features an enhanced contact design capable of providing up to 84A per contact (per 4 adjacent contacts) and high-density signal options with up to 6 signal pins per column.

Product Pwr TwinBlade® Cable Assemblies
Pwr TwinBlade® Cable Assemblies
The Pwr TwinBlade® cable system is designed to support applications that demand the supply of high power. The Pwr TwinBlade® connectors employ a proven contact system in a touch-proof design that is capable of supporting currents of up to 100A per contact. The new sensing contacts can be used to eliminate the potential for damage from hot-plug conditions.

Product QMA Connector Series
QMA Connector Series
The QMA connector is a quick disconnect version of the SMA connector and shares the same internal construction, which allows the connector to have excellent performance up to 6 GHz.

Product QN Connectors
QN Connectors
Amphenol RF’s QN connector is a quick disconnect version of the N-Type connector with similar internal construction, which enables fast and easy matings with minimum space requirements.

Product QSFP Cable Assemblies
QSFP Cable Assemblies
Amphenol's QSFP copper cable assemblies are designed to meet data center, networking and high-performance computing application needs for high density cabling interconnect systems capable of data rates from 10G/Lane to 112G/Lane transmission rates.

Product QSFP DD Cable Assemblies
QSFP DD Cable Assemblies
200G / 400G / 800G SOLUTIONS Amphenol's QSFP DD (Double Density) copper cable assemblies double the number of channels from 4 to 8 lanes when compared to the existing QSFP cabling systems, enabling more bandwidth within the same mechanical envelope.

Product QSFP DD OverPass™ Assemblies
QSFP DD OverPass™ Assemblies
56G AND 112G DIRECT HIGH SPEED CONNECTION FROM CHIP SITE TO IO PORT QSFP DD OverPass™ products remove high speed signaling from the PCB and create an eight channel direct lower loss interconnection between the ASIC site and the external QSFP DD IO port by overpassing the PCB. This helps to enable 56G and 112G hardware system designs and a technology for future 224G systems.

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