Amphenol is a technology leader in the design, manufacture and supply of high-performance interconnect systems, sensors and antennas for a broad range of industrial applications. Our core competencies include application-specific industrial interconnect solutions utilizing integrated assemblies. Our primary end applications for industrial include agriculture equipment, alternative and traditional energy generation, batteries and hybrid drive systems, entertainment, factory automation, heavy equipment, instrumentation, internet of things (IoT), LED lighting, marine, medical equipment, oil and gas, power distribution, public safety, rail mass transit, smart manufacturing (IIoT), and transportation.
AgilLink™ 1.50mm Wire-to-Board G886 series is the most common solution for transferring power and signal. This series can carry a maximum current rating of 2.5A. Amphenol offers a comprehensive range of these headers including, vertical and right-angle DIP, and vertical and right angle SMT, to meet various customer requirements. It comes with customizable pin length, latch, or location post...
AgilLink™ 2.00mm Wire-to-Board Header G823 Series is the most common solution for transferring power and signal. It can mate with both wire-to-board and board-to-board applications. This series can carry a maximum current rating of 4A. Amphenol offers a comprehensive range of these headers including, V/T DIP, V/T SMT, R/A DIP to meet various customer requirements.
AgilLink™ 2.50mm Wire-to-Board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 1.25A to3A. Amphenol offers a comprehensive range of these headers including, vertical DIP, right-angle DIP, vertical SMT, and right angle SMT to meet various customer requirements.
AgilLink™ 2.54mm wire-to-board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 3A. Amphenol offers a comprehensive range of these headers including V/T DIP, V/T SMT, R/A DIP, R/A SMT to meet various customer requirements. It comes with customizable pin length, latch or location post, which makes it an ideal choice for several applications
AgilLink™ 3.96mm wire-to-board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 6A. Amphenol offers a comprehensive range of these headers including V/T DIP, V/T SMT, R/A DIP, R/A SMT to meet various customer requirements. It comes with customizable pin length which makes it an ideal choice for several applications and specific designs.
Available in 6 and 9 Position
AHD Series™ Connectors were designed specifically as a cost-conscious, reliable alternative, intermateable to industry standard 6 and 9 pin connectors, the AHD Series™ is ideal for any situation where either controlled and/or uncontrolled environmental conditions exist.
General Relay highly adapts to conditions with high temperature and vibration. Miniature size with low power consumption. Halogen-Free series are available.
With over 20 years of experience, Piezo Technologies is the premier designer and manufacturer of smart ultrasonic air bubble detectors for the medical infusion industry and enteral nutrition delivery. Industry-leading piezoceramics and in-house transducer engineering ensure custom ultrasonic air-in-line sensors meet the highest standards for quality, performance, and reliability. ISO 13485 certified.
Hard Metric High Power connectors are a perfect complement to Amphenol's ExaMAX®, AirMax®, ZipLine®, and Millipacs® signal connectors. These power connectors mount alongside their signal counterparts and are used in applications where bulk current is delivered by backplane or midplane to power-consuming components on a mating daughter card.
AirMax VS2® connectors provide a migration path from AirMax VS® for speeds up to 20Gb/s, providing a margin of safety for typical 802.3ap system performance with the flexibility of an open pin field design. The connectors leverage AirMax VS® and VSe® design features and technology to achieve improved signal integrity and mechanical attributes compared to AirMax VS® connectors.
HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE WITH ENHANCED PERFORMANCE
AirMax VSe® connectors address the industry needs for high bandwidth applications requiring a scalable migration path to 25Gb/s data rate. AirMax® technology delivers signal densities up to 63.5 differential pairs per inch when using a 5-pair connector system.
AirMax VS® Connectors for CompactPCI® Serial System
AirMax® high speed signal connectors meet the dimensional and electrical requirements described in CompactPCI® Serial (PICMG CPCI-S.0) specification. It moves CompactPCI® architecture to high speed serial interconnects to add greater support for serial point to point fabrics like PCI Express®, SATA, Ethernet and USB in the classic CompactPCI® form factor with mechanics fully compliant to IEC 1101.
AirMax VS® coplanar connectors permit mating 2 boards in the same plane. This is very useful for many applications, one base card can mate to many IO cards to cost effectively offer different system IO options. ATCA systems, Zone 3 connectors directly connect front and rear cards, bypassing the backplane, effectively doubling the electronic capabilities of each slot within the system.
AirMax VS® connectors use innovative edge-coupling and air dielectric between adjacent conductors to deliver insertion loss and crosstalk. The AirMax VS® connectors address a broad range of system architectures, including backplane, mid-plane, coplanar, mid-plane orthogonal, cabled backplane, and mezzanine applications.
AirMax VS® Orthogonal mid-plane interface features two back-to-back AirMax VS® headers oriented at 90 degrees to each other. The headers connect 16 differential signal pairs through shared vias in the mid-plane, providing a direct, high-speed connection while eliminating traces on the mid-plane. The AirMax VS® Orthogonal mid-plane interconnects can support differential signaling at up to 20Gb/s.
AirMax VS® high-speed signal connectors, guide modules, and power connectors meet the dimensional and electrical requirements for the Storage Bridge Bay Mid-plane Interface (SBBMI) to connect bridge/controller cards to the mid-plane in a drive enclosure. It comes with high-speed serial data rates that can scale from 2.5Gb/s to 12.5Gb/s without requiring the redesign of a basic platform.
Alternative to M12 - Ultra High-Density X-Lok Push-Lock Connector
Amphenol LTW’s 33-pin Ultra High-Density (UHD) X-Lok Metal Mini Size push-lock connector boasts a compact design and high contact density, providing space efficiency and enhanced data transmission. This connector serves as an excellent alternative to traditional M12 solutions【Video: https://www.youtube.com/watch?v=7gU_zye2zIw】【Quck guide: https://amphenolltw.com/down.php?supp_download=112】
AL & AM is available in a variety of contact forms and load specifications, and LED lights indicate the operational status of coil on or off. It is suitable for debugging personnel to test the circuit manually.
Amphenol “AMHTC” high tension connector series for railway vehicle installable power distribution systems, offers the ultimate in safety and reliability under the most severe operating conditions.
The AMHTC series connectors allow the user to connect electrical equipment quickly with ultimate safety.