Amphenol is a technology leader in the design, manufacture and supply of high-performance interconnect systems, sensors and antennas for a broad range of industrial applications. Our core competencies include application-specific industrial interconnect solutions utilizing integrated assemblies. Our primary end applications for industrial include agriculture equipment, alternative and traditional energy generation, batteries and hybrid drive systems, entertainment, factory automation, heavy equipment, instrumentation, internet of things (IoT), LED lighting, marine, medical equipment, oil and gas, power distribution, public safety, rail mass transit, smart manufacturing (IIoT), and transportation.
600V Trex-Onics® Individually Shielded Multi-Pair Control Cables
Trex-Onics® Individually Shielded Multi-Pair Control Cable is designed for industrial cat tracks, reeling, drop pendants, and robotics and shows superior resistance against abrasion, tearing, oil, UV, and most chemicals. This control and instrumentation cable features Ultra-Shield construction, tinned copper braid, foil shield, and tinned drain wire providing 100%
Amphenol LTW's 7/8" Mini connectors are designed according to IEC standards and are ideal to fulfill watertight, vibration resistant, and EMC protection in industrial harsh applications. Developed in receptacle, field installable, and over-molded cable to satisfy industrial connector demand.
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This series, meeting applicable requirements of SAE AS50151 is a Pre-Earth/First Mate Last Break, IP67 protected, metal, threaded coupling, power, and signal connector. With 12 insert arrangements ranging from 3 to 9 contacts per connector and up to 80 amps possible with a standard operating temperature from -55°C to +125°C.
The USB 3.0 Type A to Type C adapter is designed to integrate modern USB-C devices into existing USB-A infrastructures, ensuring high-speed data transfer and robust performance in demanding environments.
Dedicated interface between backplanes and boards capable of providing dual redundant power, system management and high voltage auxiliary circuits to each slot within the platform. The connector’s outstanding blind mating capability can be used to align the board during insertion.
AgilLink™ 0.8mm wire-to-board connector is the most common solution for transferring low power and signal. This series can carry a maximum current rating of 1A. Amphenol offers a comprehensive range of these headers including, V/T SMT, and R/A SMT to meet various customer requirements. The compactness of the connectors allows for extensive usage in consumer applications.
AgilLink™ 1.0mm Wire-to-Board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 1A. Amphenol offers a comprehensive range of these headers including Single Row V/T SMT, R/A SMT and Dual Row V/T SMT, R/A SMT to meet various customer requirements. It comes in customizable for Low profile or latch feature, which makes it an ideal choice for several
AgilLink™ 1.20mm Wire-to-Board G823H series is the most common solution for transferring power and signal. This series can carry a maximum current rating of 1A. Amphenol I offers a comprehensive range of these headers including V/T SMT and vertical and R/A right angle SMT to meet various customer requirements. It is offered in customizable for high current ratings, which makes it an ideal c...
AgilLink™ 1.25mm Wire-to-Board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 1A. Amphenol offers a comprehensive range of these headers including V/T DIP, V/T SMT, R/A DIP, R/A SMT to meet various customer requirements. It comes in customizable for pin length, latch or location post, which makes it an ideal choice for several applications
AgilLink™ 1.50mm Wire-to-Board G886 series is the most common solution for transferring power and signal. This series can carry a maximum current rating of 2.5A. Amphenol offers a comprehensive range of these headers including, vertical and right-angle DIP, and vertical and right angle SMT, to meet various customer requirements. It comes with customizable pin length, latch, or location post...
AgilLink™ 2.50mm Wire-to-Board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 1.25A to3A. Amphenol offers a comprehensive range of these headers including, vertical DIP, right-angle DIP, vertical SMT, and right angle SMT to meet various customer requirements.
AgilLink™ 2.54mm wire-to-board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 3A. Amphenol offers a comprehensive range of these headers including V/T DIP, V/T SMT, R/A DIP, R/A SMT to meet various customer requirements. It comes with customizable pin length, latch or location post, which makes it an ideal choice for several applications
AgilLink™ 3.96mm wire-to-board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 6A. Amphenol offers a comprehensive range of these headers including V/T DIP, V/T SMT, R/A DIP, R/A SMT to meet various customer requirements. It comes with customizable pin length which makes it an ideal choice for several applications and specific designs.
Hard Metric High Power connectors are a perfect complement to Amphenol's ExaMAX®, AirMax®, ZipLine®, and Millipacs® signal connectors. These power connectors mount alongside their signal counterparts and are used in applications where bulk current is delivered by backplane or midplane to power-consuming components on a mating daughter card.
AirMax VS2® connectors provide a migration path from AirMax VS® for speeds up to 20Gb/s, providing a margin of safety for typical 802.3ap system performance with the flexibility of an open pin field design. The connectors leverage AirMax VS® and VSe® design features and technology to achieve improved signal integrity and mechanical attributes compared to AirMax VS® connectors.
HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE WITH ENHANCED PERFORMANCE
AirMax VSe® connectors address the industry needs for high bandwidth applications requiring a scalable migration path to 25Gb/s data rate. AirMax® technology delivers signal densities up to 63.5 differential pairs per inch when using a 5-pair connector system.
AirMax VS® Connectors for CompactPCI® Serial System
AirMax® high speed signal connectors meet the dimensional and electrical requirements described in CompactPCI® Serial (PICMG CPCI-S.0) specification. It moves CompactPCI® architecture to high speed serial interconnects to add greater support for serial point to point fabrics like PCI Express®, SATA, Ethernet and USB in the classic CompactPCI® form factor with mechanics fully compliant to IEC 1101.
AirMax VS® coplanar connectors permit mating 2 boards in the same plane. This is very useful for many applications, one base card can mate to many IO cards to cost effectively offer different system IO options. ATCA systems, Zone 3 connectors directly connect front and rear cards, bypassing the backplane, effectively doubling the electronic capabilities of each slot within the system.
AirMax VS® connectors use innovative edge-coupling and air dielectric between adjacent conductors to deliver insertion loss and crosstalk. The AirMax VS® connectors address a broad range of system architectures, including backplane, mid-plane, coplanar, mid-plane orthogonal, cabled backplane, and mezzanine applications.
AirMax VS® Orthogonal mid-plane interface features two back-to-back AirMax VS® headers oriented at 90 degrees to each other. The headers connect 16 differential signal pairs through shared vias in the mid-plane, providing a direct, high-speed connection while eliminating traces on the mid-plane. The AirMax VS® Orthogonal mid-plane interconnects can support differential signaling at up to 20Gb/s.