All Products

Available in 8 Shell Sizes / 27 Insert Arrangements. The ecomate® RSSM (Rugged Superior Seal Metal) Series of circular, metal connectors provides an IP69K rating (in mated condition) for industrial applications. With a bayonet coupling system and a maximum current rating range of 7A to 45A/600V, the ecomate® RSSM Series is perfect for indoor/Outdoor applications.

EconoStik™ 2.54mm is an economical range of 2.54mm unshrouded header. It is available in single-row and double-row with vertical through-hole, right-angle through-hole, and vertical SMT terminations. EconoStik™ 2.54mm is a standard 0.64mm square header with high-temperature resin and 1μ" gold plating in contact and tail. It supports up to 50 mating cycles.

The ECTA 133 metal connector with a push-pull locking system is used wherever it is necessary to insert it safely and blindly. It is particularly suitable for indoor use, in industry, in railways, in apparatus and vehicle construction and diagnostics. Increased mating cycles, pressure-tight sockets, fiber optic contacts are available in many polar patterns.

The ECTA 544 plastic connector with a push-pull locking system can be used everywhere where one must connect securely and blindly. It is especially suitable for indoor areas, industry, diagnostics, and laboratories. Available in black, gray, and yellow colors.

SV Microwave’s new Edge-Lock PCB connector series is designed to pull the connector's contact lane into the edge of the PCB. The result is a fixture-less connector that is primed for reflow without any unnecessary custom fixtures to hold the connector in place. The secure fit between the connector and the PCB edge ensures optimal RF performance throughout the connector's full frequency range.

Amphenol introduces the next-generation OverPass™ solution - EDSFF Board Site Connector. The 0.60mm pitch connector comes with a slim form factor design, capable of transmitting a highspeed signal up to PCIe® Gen 5 and PCIe® Gen 6 and allowing much greater signal path lengths while maintaining SI performance compared to conventional PCB routing methods.

EDSFF ORTHOGONAL CABLE ASSEMBLY WITH DIFFERENTIAL SIGNALING TO 32GT/S NRZ FOR NEXT-GENERATION SYSTEMS Amphenol's EDSFF E1/E3 high-speed cable assembly transmits power and high-speed signals via a cable that directly connects to the main PC board supporting EDSFF E1/E3 SSD and CXL or other modules.

The EFP series has a similar modular design to the HDS series but is designed and certified for use in EX hazardous locations such as drilling rigs and oil refineries. CSA C22.2 No. 182.3-1987, CSA C22.2 No. 30-1986, CSA C22.2 No. 60079-0 – 2007, CSA C22.2 No. 60079-1 - 2007, UL 1977 2nd edition, ISA/ANSI 60079-0 -2009, ISA/ANSI 60079-1-2009, UL1203 4th edition, IEC 6007-0, IEC 60079-1

CLASSIC HPCE® WITH ENHANCED PERFORMANCE eHPCE® connector offers a 15% increase in power density with the same footprint as classic HPCE®. The all-new power contact design offers lower contact resistance and higher current carrying capacity compared to classic HPCE® connectors. eHPCE® connectors are designed to extend the life of power supplies using card edge output power connectors.

Electrically conductive seals for frequency ranges from 15 kHz to 4 GHz: Seals for square flange sockets for installation type: Front wall and back wall, seals for sockets with single hole mounts, seals for protective caps, seals for D-SUB connectors.

Our product range is approved according to the standard VG96940-6 and includes all its variants: Seals for square flange sockets for installation type: Front wall and back wall, seals for sockets with single hole mounts, seals for protective caps, seals for D-SUB connectors.

Electrical plates for busses, electrobusses, trolleybusses, railway vehicles, including fuses, circuit breakers, relays, and ECUs connected by wire harnesses.

Full integration, in-house LRU capabilities include aluminum enclosures, rigid, flex, and panel circuit card assemblies, internal/external cable assemblies, integration, and final assembly, and fully functional testing and environmental stress screening (ESS) in order to support our customers with full turnkey solutions.

Capabilities include automated select solder, press-fit, and hand solder for through hold, single and double-sided BGA's and uBGA's, high-density packages, chip on board, lead-free, and conformal coating (UR, UL, Parylene). Process validation capabilities: 3D Solder Paste Inspection (SPI), Pre and Post-Reflow Automated Optical Inspection (AOI), 3D X-ray, and aqueous and non-aqueous cleaning.

ECUs allow for monitoring and controlling of critical applications such as Flight Controls, Avionic suites, Instrumentation, and Sensors. Electronic circuits are segregated and incorporate Front Face Panel, FPGA, MicroProcessors, and Software. We hold Part21G and PART145 certificates for production and maintenance.

Bernd Richter GmbH offers highly flexible catheter cables designed for sensitive cardiology applications such as electrophysiology. These cables combine exceptional durability with extra-small bending radii, low-noise performance to minimize interference, and materials that meet strict biocompatibility and cleanliness standards—ensuring reliable function in critical clinical environments.

ULTRA-HIGH DENSITY BACKPLANE INTERCONNECT SOLUTION Ultra-High density 56+ Gbp/s PAM4 interconnect platform utilizing proven press-fit technology and a single wafer design optimized for traditional backplane, direct orthogonal, and cable design solutions.

Any type of antenna that is surface mounted on the PCB. Most common antenna types are ceramic chip antennas, composite material chip antennas and sheet metal antennas. The antenna design is often monopole, loop, IFA or PIFA antennas.

SV Microwave streamlines this with our innovative Embedded Phase Tuner. This component allows customers to independently adjust the phase of cable assemblies without external vendor involvement. The Embedded Phase Tuner operates by adjusting the transmission line length using a threaded coupling nut, simplifying the process.

Embedded chip antennas are compact and integrated antennas designed to be directly mounted on a printed circuit board (PCB) or embedded within electronic devices. These antennas are often used in wireless communication applications, such as Wi-Fi, Bluetooth, GPS, and IoT devices, due to their small size and ease of integration.