All Products

Specialty piezoceramics and custom ultrasonic transducers for challenging NDT applications: inspecting aircraft components like wings, fuselage, and engines; inspecting Oil & Gas pipelines, pressure vessels, and storage tanks; detecting cracks and fissures in tracks on railway systems; detecting wear, corrosion, cracks, and defects in power generation systems; manufacturing quality control.

Amphenol's CXP passive copper cable assemblies are designed to meet the high bandwidth capacity demands being requested by data centers and high-performance computing applications. The CXP copper cables are a high-density cabling interconnect system capable of delivering aggregate data bandwidths of 120Gb/s and 168 Gb/s.

MIL-DTL-38999 connectors are ideally suited for shielded contacts for high-performance, high-speed interconnection applications. Insert arrangements can incorporate: coax (sizes 8, 12, and 16); twinax (sizes 8 and 12); and triax contacts (sizes 8, 10, and 12).

D38999 Series III Connectors are ideally suited for the incorporation of shielded contacts for high-performance, high-speed interconnection applications. Uses size 8 high-speed Quadrax and Differential Twinax contacts. A wide selection of connector shell styles and sizes are available. Transition adapters can be used to attach connectors with Quadrax or Differential Twinax contacts to PCBs.

Amphenol SV Microwave offers high-frequency BMA and SMPM D38999 cabled RF contacts (size 8, 12 & 16) to SMA male connectors on Ø.085 and Ø.141 cable types that populate standard D38999 circular connectors. These fixed-length cable assemblies allow you to expand the use of the standard D38999 circular connector to incorporate microwave transmission lines.

SV Microwave has released a line of D38999 pin and socket contacts that are aligned to the latest specification set forth by SOSA™. These coaxial contacts fit both standard and series III housing and are offered in BMB size 8 and SMPM size 12. These contacts are ideal in an embedded system that transitions from the chassis to an out-of-the-box application.

For high power transmissions.

Cable and Harness assemblies for vehicle data communication including HSD, Low, and High Speed Ethernet, FAKRA and MiniFAKRA

Media conversion products that concentrate data and simplify system cabling and architectures.

Inverter modules provide in-vehicle power from 400W to greater than 2kW to the consumer; enabling "at home" consumer use of laptops, household appliances, or equipment in vehicle.

Modules to provide power management and voltage conversion for 12V, 24V, and 48V vehicle architectures

Amphenol Broadband Solutions delivers reliable, high-quality solutions to power, protect, and monitor today’s network servers and equipment. With a variety of power distribution unit (PDU) solutions, including fuse panels and circuit breaker panels, current capacities up to 1000 amp inputs and 400 amp outputs, and nrgSMART™ power monitoring solutions.

DDR2 SO-DIMM sockets are designed to accept modules that conform to JEDEC MO-224. The sockets come with a small form factor which allows fitting into smaller chassis, aiding the development of smaller & lighter notebooks. It comes in two voltage options with different key-ID to prevent incorrect mating. It operates at a higher speed & bandwidth lowers power consumption.

DDR3 vertical DIMM sockets are designed to accept 240 position DDR3 memory modules that conform to JEDEC M0-269. Low-resistance contacts support the use of RDIMM (registered DIMM), which helps to further reduce power consumption in data center hardware.

Vertical DDR4 DIMM sockets from Amphenol provide 288 contacts on 0.85mm pitch and are designed to accept DDR4 memory modules that conform to JEDEC MO-309. The DDR4 series complies with the new interface standard JEDEC POD12. It allows a module seating plane of 2.40mm and supports module variants in UDIMM, RDIMM, and LRDIMM.

HIGH-SPEED HIGH-DENSITY SO-DIMM SOCKETS DDR4 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. Different key positions aid alignment and prevent mismating. 260 position SO-DIMM connectors are available in 4.00mm, 5.20mm, 8.00mm, 9.20mm height, in standard or reverse options.

DDR4 Ultra Low Profile (ULP) vertical DIMM sockets provide 288 contacts on 0.85mm pitch. It facilitates convenient memory expansion in servers, workstations, desktop PCs, and embedded applications in communications and industrial equipment. With an ultra-low module seating height of 1.1mm and connector height of 13.1mm, it reduces the overall profile of the connector.

COMPLIES TO JEDEC SO-032 SPEC The DDR5/LPDDR5 CAMM2 connector follows JEDEC standards with 644 pins/666 pins, has a pitch of 1.00x1.38mm, and a connector height of 1.0mm. It provides dual channel memory which could support higher bandwidth and can catch up all DDR5 capacities needed. This connector is developed to support lower-power DDR5 memory and does not require ground shielding.

COMPLIES TO NEW INTERFACE STANDARD JEDEC SO-023D AND JEDEC SO-023 The new DDR5 connector with only 287 terminals addresses the resonance from the floating RFU pin 220 which resulted in a margin delta. Both RDIMM and UDIMM versions of the new DDR5 socket are tooled and available.

LATEST MEMORY FORM FACTOR FOR AI SERVERS The LP DDR5 Small Outline Compression Attached Memory Module (SOCAMM) is designed specifically for server and data center applications. It utilizes a compression connector interface and offers all the advantages of LPCAMM DDR5 in a more optimized form factor, making it ideal for high-performance computing (HPC) and artificial intelligence (AI) servers.