All Products
Amphenol is one of the world’s largest providers of high-technology interconnect, sensor and antenna solutions. Our products Enable the Electronics Revolution across virtually every end market including Automotive, Broadband Communications, Commercial Aerospace, Industrial, Information Technology and Data Communications, Military, Mobile Devices and Mobile Networks.
EconoStik™ 2.54mm
EconoStik™ 2.54mm is an economical range of 2.54mm unshrouded header. It is available in single-row and double-row with vertical through-hole, right-angle through-hole, and vertical SMT terminations. EconoStik™ 2.54mm is a standard 0.64mm square header with high-temperature resin and 1μ" gold plating in contact and tail. It supports up to 50 mating cycles.
Edge Launch Plus PCB Connectors
SV Microwave’s Edge Launch Plus PCB Connectors are precision RF connectors engineered for board-edge applications where reliability and high-frequency performance are critical. This product line features an extended flange design at the PCB transition point to maintain ground contact in the event of copper pull-back, ensuring consistent electrical performance. Available in multiple detent styles.
Edge Lock RF PCB Connectors
SV Microwave’s new Edge-Lock PCB connector series is designed to pull the connector's contact lane into the edge of the PCB. The result is a fixture-less connector that is primed for reflow without any unnecessary custom fixtures to hold the connector in place. The secure fit between the connector and the PCB edge ensures optimal RF performance throughout the connector's full frequency range.
EDSFF Board Site Connector
Amphenol introduces the next-generation OverPass™ solution - EDSFF Board Site Connector. The 0.60mm pitch connector comes with a slim form factor design, capable of transmitting a highspeed signal up to PCIe® Gen 5 and PCIe® Gen 6 and allowing much greater signal path lengths while maintaining SI performance compared to conventional PCB routing methods.
EDSFF E1/E3 High-Speed Cable Assembly
EDSFF ORTHOGONAL CABLE ASSEMBLY WITH DIFFERENTIAL SIGNALING TO 32GT/S NRZ FOR NEXT-GENERATION SYSTEMS
Amphenol's EDSFF E1/E3 high-speed cable assembly transmits power and high-speed signals via a cable that directly connects to the main PC board supporting EDSFF E1/E3 SSD and CXL or other modules.
EFP HAZLOC
The EFP series has a similar modular design to the HDS series but is designed and certified for use in EX hazardous locations such as drilling rigs and oil refineries. CSA C22.2 No. 182.3-1987, CSA C22.2 No. 30-1986, CSA C22.2 No. 60079-0 – 2007, CSA C22.2 No. 60079-1 - 2007, UL 1977 2nd edition, ISA/ANSI 60079-0 -2009, ISA/ANSI 60079-1-2009, UL1203 4th edition, IEC 6007-0, IEC 60079-1
eHPCE® Enhanced High Power Card Edge Connector
CLASSIC HPCE® WITH ENHANCED PERFORMANCE
eHPCE® connector offers a 15% increase in power density with the same footprint as classic HPCE®. The all-new power contact design offers lower contact resistance and higher current carrying capacity compared to classic HPCE® connectors. eHPCE® connectors are designed to extend the life of power supplies using card edge output power connectors.
Electrical Plates
Electrical plates for busses, electrobusses, trolleybusses, railway vehicles, including fuses, circuit breakers, relays, and ECUs connected by wire harnesses.
Electro-Mechanical Integration
Full integration, in-house LRU capabilities include aluminum enclosures, rigid, flex, and panel circuit card assemblies, internal/external cable assemblies, integration, and final assembly, and fully functional testing and environmental stress screening (ESS) in order to support our customers with full turnkey solutions.
Electronic Assemblies
Capabilities include automated select solder, press-fit, and hand solder for through hold, single and double-sided BGA's and uBGA's, high-density packages, chip on board, lead-free, and conformal coating (UR, UL, Parylene). Process validation capabilities: 3D Solder Paste Inspection (SPI), Pre and Post-Reflow Automated Optical Inspection (AOI), 3D X-ray, and aqueous and non-aqueous cleaning.