All Products
Amphenol is one of the world’s largest providers of high-technology interconnect, sensor and antenna solutions. Our products Enable the Electronics Revolution across virtually every end market including Automotive, Broadband Communications, Commercial Aerospace, Industrial, Information Technology and Data Communications, Military, Mobile Devices and Mobile Networks.
EFP HAZLOC
The EFP series has a similar modular design to the HDS series but is designed and certified for use in EX hazardous locations such as drilling rigs and oil refineries. CSA C22.2 No. 182.3-1987, CSA C22.2 No. 30-1986, CSA C22.2 No. 60079-0 – 2007, CSA C22.2 No. 60079-1 - 2007, UL 1977 2nd edition, ISA/ANSI 60079-0 -2009, ISA/ANSI 60079-1-2009, UL1203 4th edition, IEC 6007-0, IEC 60079-1
eHPCE® Enhanced High Power Card Edge Connector
CLASSIC HPCE® WITH ENHANCED PERFORMANCE
eHPCE® connector offers a 15% increase in power density with the same footprint as classic HPCE®. The all-new power contact design offers lower contact resistance and higher current carrying capacity compared to classic HPCE® connectors. eHPCE® connectors are designed to extend the life of power supplies using card edge output power connectors.
Electrical Plates
Electrical plates for busses, electrobusses, trolleybusses, railway vehicles, including fuses, circuit breakers, relays, and ECUs connected by wire harnesses.
Electro-Mechanical Integration
Full integration, in-house LRU capabilities include aluminum enclosures, rigid, flex, and panel circuit card assemblies, internal/external cable assemblies, integration, and final assembly, and fully functional testing and environmental stress screening (ESS) in order to support our customers with full turnkey solutions.
Electronic Assemblies
Capabilities include automated select solder, press-fit, and hand solder for through hold, single and double-sided BGA's and uBGA's, high-density packages, chip on board, lead-free, and conformal coating (UR, UL, Parylene). Process validation capabilities: 3D Solder Paste Inspection (SPI), Pre and Post-Reflow Automated Optical Inspection (AOI), 3D X-ray, and aqueous and non-aqueous cleaning.
Electronic Control Unit
ECUs allow for monitoring and controlling of critical applications such as Flight Controls, Avionic suites, Instrumentation, and Sensors. Electronic circuits are segregated and incorporate Front Face Panel, FPGA, MicroProcessors, and Software. We hold Part21G and PART145 certificates for production and maintenance.
Electrophysiology
Bernd Richter GmbH offers highly flexible catheter cables designed for sensitive cardiology applications such as electrophysiology. These cables combine exceptional durability with extra-small bending radii, low-noise performance to minimize interference, and materials that meet strict biocompatibility and cleanliness standards—ensuring reliable function in critical clinical environments.
Elite®
ULTRA-HIGH DENSITY BACKPLANE INTERCONNECT SOLUTION
Ultra-High density 56+ Gbp/s PAM4 interconnect platform utilizing proven press-fit technology and a single wafer design optimized for traditional backplane, direct orthogonal, and cable design solutions.
Embedded Antenna
Any type of antenna that is
surface mounted on the PCB. Most common antenna types are ceramic chip antennas,
composite material chip antennas and sheet metal antennas. The antenna design is often monopole, loop, IFA or PIFA antennas.
Embedded Phase Tuner
SV Microwave streamlines this with our innovative Embedded Phase Tuner. This component allows customers to independently adjust the phase of cable assemblies without external vendor involvement. The Embedded Phase Tuner operates by adjusting the transmission line length using a threaded coupling nut, simplifying the process.