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i2s is your contact for the development and production of pressure sensors, temperature sensors, mass air flow sensors, as well as combination sensors for several measurements. Customers from the automotive, commercial vehicle, mechanical engineering, and metrology industries have been relying on our experience and know-how for more than 15 years.

Positronic Combo-D connectors are a combination of signal and power and are part of the D-sub family. Combo-D connectors are used in military, communications, space, industrial, and medical applications. These connectors are available in various performance levels for the best cost/performance ratio.

ComboLock® is a compact, hybrid wire-to-board connector system that saves space, allows for simpler assembly and simpler cable management. The connector system offers a hybrid 1.00mm pitch signal and 3.00mm pitch power configuration with an active latching feature. The connector has nominal current carrying capacity of 10A/pin max. for power and 1.5A/pin max. for signal.

SCALABLE, VERSATILE, MODULAR AUTOMOTIVE-GRADE CONNECTOR. The ComboNET™ Automotive Modular Connector is a versatile, scalable, space-efficient solution, allowing standard modules such as Ve-NET™, Mini-Fakra, and power and signal pins to be combined and interchanged freely to suit specific application requirements. It supports high-speed differential and coaxial data transmission as well as signal and power..

HYBRID AND HIGH SPEED SOLUTION The ComboStak® 0.50 mm BTB connectors are compact, hybrid (signal and power) board-to-board connectors. ComboStak® 0.50 mm combines existing, BergStak® 0.5mm pitch HS signal pins with 2.00mm pitch power blades. ComboStak® 0.50 mm provides high signal and current density with a wide range of stack heights.

HYBRID AND MEDIUM POWER SOLUTION ComboStak® and PowerStak® are compact, hybrid (signal and power) and power board-to-board connectors. ComboStak® combines existing, BergStak® 0.8mm pitch signal pins with 2.00mm pitch power blades. PowerStak® is the power only version. Both ComboStak® and PowerStak® provide high signal and current density with a wide range of stack heights.

400POS 0.635MM PITCH COM-HPC Amphenol has developed a pair of 400pos 0.635mm COM-HPC which support 5mm and 10mm stack heights. COM-HPC is a PICMG sponsored open standard for a family of high performance computer modules targeting the embedded computer space. We have developed a pair of 400pos 0.635mm COM-HPC which support 5mm and 10mm stack heights.

SIGNAL & HYBRID SOLUTIONS FOR BTB, WTW, AND WTB Solutions offer optimized space, high reliability with adequate creepage and clearance distances for power and allows easy to mate/crimp and cable management. The connector system offers hybrid solutions choice of signal and power loading with an active latching feature.

Amphenol-BSI’s range of PICMG compliant backplanes includes CompactPCI Serial which modernizes CompactPCI to include high-speed serial Ethernet, PCIe, SATA and USBinterconnects. These high-speed serial interconnects are capable of data rates up to 12Gb/s.

Compact Universal Enclosures were designed around the principle of “flexibility.” These versatile enclosures may be wall, pole, strand or pedestal-mounted and configured to meet a variety of fiber, copper, or coaxial distribution applications. With a universal backplane and interchangeable feed and drop cable port plates, they are especially efficient at meeting FTTX deployment challenges.