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Charles Below Grade Enclosures (CBGE) are lightweight, molded HDPE handholes available in five rectangular and two round sizes. Designed for light-duty placements (parkway/greenbelt applications), these ANSI/SCTE rated below-grade enclosures store fiber optic and copper cable slack, meters, sealed cases, control valves, ground rods, signal controls, and various other equipment.

FLEXIBLE SOLUTION FOR HIGH-SPEED APPLICATIONS Amphenol's FCI Basics BergStak HS™ connector family is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. BergStak HS™ 0.50mm connector family with 0.50mm pitch enables high-speed data applications with up to PCIe® Gen 5 32Gb/s.

FLEXIBLE SOLUTION FOR HIGH-SPEED APPLICATION FCI Basics BergStak HS™ connector family is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. BergStak HS™ 0.80mm connector family with 0.80mm pitch enables high-speed data applications with up to PCIe® Gen 5 32Gb/s.

BergStak+™ 0.80mm is designed to be the next generation PCIe 4.0 compliant mezzanine connector system. It is compatible with the existing BergStak® 0.80mm product recommended by the OCP. It guarantees to support up to 16Gb/s performance. Customers can upgrade its board-to-board performance from PCIe 3.0 to PCIe 4.0 while leveraging BergStak+™'s backward compatibility and same footprint feature.

The BergStak® 0.40mm board-to-board connectors are in 0.4mm pitch with double row contacts, the family now supports stack height of 1.50/2.0/3.0/3.5/4.0mm and position ranges in 10-100 positions (10/20/24/30/34/40/50/60/70/80/90/100). The lock feature on contacts works together with shock-absorbing ribs on the housing to make it suitable for high-vibration applications and friendly for FPC applications.

FCI Basics BergStak® 0.40mm self-alignment connectors come with a stack height of 3.50mm and 30 positions extendable up to 10 to 60 positions with 10 positions incremental. It has a unique self-alignment feature that supports blind mating, ensuring a reliable connection. The USCAR-2 compliant connector is also ideal for the automotive market.

Amphenol's BergStak® 0.5mm is a comprehensive and versatile board-to-board solution designed for reliable and high-density applications. The unique design of scoop-proof housing ensures terminals are not damaged during mating.

FINE PITCH SOLUTION WITH SELF-ALIGNMENT FEATURE FCI Basics BergStak® 0.50mm self-alignment connectors come with a stack height of 3mm and 50 positions extendable across 20 to 60 positions in increments of 10. It has a unique self-alignment feature that supports blind mating.

MICRO PITCH LOW PROFILE HIGH SPEED BOARD-TO-BOARD CONNECTOR BergStak® 0.635mm pitch is a compact board-to-board connector with low stack height of 3.00mm. Available in 80 and 140 positions it support applications which require high pin counts and low profile connection. BergStak® 0.635mm supports signal speeds up to 8Gb/s with an open-pin-field, providing design flexibility.

FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS Amphenol's BergStak® 0.8 mm is a flexible solution designed for high-speed and high-density, parallel board-to-board connector systems with 16 PCB stack heights in 10 sizes up to 200 positions.