All Products
Amphenol is one of the world’s largest providers of high-technology interconnect, sensor and antenna solutions. Our products Enable the Electronics Revolution across virtually every end market including Automotive, Broadband Communications, Commercial Aerospace, Industrial, Information Technology and Data Communications, Military, Mobile Devices and Mobile Networks.

XA Series
Pitch: 6.35mm/8.60mm
Poles: 1P-12P
Voltage Rating: 300V/600V
Current Rating: 30A/30A
Wire Range: 10-24 AWG
Wire Strip Length: 11-12mm
Withstanding Voltage: 2.0KV/2.2KV

XCede I/O
The XCede® I/O interconnect system is comprised of a 32-position, variable pitch connector built for use in high-speed serial applications. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. The XCede® I/O connector supports next-generation 100G+ applications and transmits up to 25 Gbps/serial-lane.

XCede Plus Backplane Connector
DESIGNED TO ACHIEVE 32G DATA RATE REQUIREMENTS
XCede Plus leverages the same core technologies as XCede with improved signal integrity performance while maintaining backward mating interface compatibility with existing XCede products.

XCede® Backplane Connector
ENABLING FUTURE DATA RATES
While maintaining the same mating interfaces, this connector design provides designers with readily available 85Ω and 100Ω solutions to meet a wide variety of application needs, including Ethernet and PCI.

XCede® Family Cable Assemblies
Cable Backplane Systems is part of Amphenol's Highspeed Backplane Product business, dedicated to developing and manufacturing cabled backplane solutions for next-generation system architectures. Our customers are leading providers of data center switches and routers, enterprise servers, and high-performance computers.

XCede® HD
XCede® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets the requirements of high-density architectures with a 35% increase in density as compared to standard XCede®.

XCede® HD2
DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY
While maintaining the same mating interfaces with XCede® HD and XCede® HD Plus, this connector provides developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical.

XCede® HD Plus
The XCede® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD Plus connector meets the high-density needs of today's challenging architectures.

XCede® Power Connectors
XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. The XCede® backplane header system provides the ruggedness and long-term reliability required by today's systems.

XD Series
Pitch: 5.0mm
Poles: 2P-12P
Part Number: XDxx70500000G
Voltage Rating: 300V
Current Rating: 8A
Wire Range: 14-26 AWG
Wire Strip Length: 8-9mm
Withstanding Voltage: 1.6KV