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HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE SUPPORTING INTEL® QPI AirMax VS® 85Ohms connectors are optimized to minimize impedance discontinuities and signal loss in 85Ohms channels. The connectors' mating interfaces also satisfy demands for backward compatibility to legacy 100 Ohms product interfaces ensuring a smooth transition to next-generation designs.

AirMax® high speed signal connectors meet the dimensional and electrical requirements described in CompactPCI® Serial (PICMG CPCI-S.0) specification. It moves CompactPCI® architecture to high speed serial interconnects to add greater support for serial point to point fabrics like PCI Express®, SATA, Ethernet and USB in the classic CompactPCI® form factor with mechanics fully compliant to IEC 1101.

AirMax VS® coplanar connectors permit mating 2 boards in the same plane. This is very useful for many applications, one base card can mate to many IO cards to cost effectively offer different system IO options. ATCA systems, Zone 3 connectors directly connect front and rear cards, bypassing the backplane, effectively doubling the electronic capabilities of each slot within the system.

AirMax VS® connectors use innovative edge-coupling and air dielectric between adjacent conductors to deliver insertion loss and crosstalk. The AirMax VS® connectors address a broad range of system architectures, including backplane, mid-plane, coplanar, mid-plane orthogonal, cabled backplane, and mezzanine applications.

AirMax VS® Orthogonal mid-plane interface features two back-to-back AirMax VS® headers oriented at 90 degrees to each other. The headers connect 16 differential signal pairs through shared vias in the mid-plane, providing a direct, high-speed connection while eliminating traces on the mid-plane. The AirMax VS® Orthogonal mid-plane interconnects can support differential signaling at up to 20Gb/s.

AirMax VS® high-speed signal connectors, guide modules, and power connectors meet the dimensional and electrical requirements for the Storage Bridge Bay Mid-plane Interface (SBBMI) to connect bridge/controller cards to the mid-plane in a drive enclosure. It comes with high-speed serial data rates that can scale from 2.5Gb/s to 12.5Gb/s without requiring the redesign of a basic platform.

Amphenol's AirMax VSX® connectors are high speed, high density, 2.00mm pitch connectors that support 56Gb/s PAM4 performance. Innovative design reduces crosstalk and reaches excellent SI performance. AirMax VSX provides a migration path to 56Gb/s PAM4 with backward mating compatibility with traditional AirMax VS®, AirMax VS2® and AirMax VSe® series. Industry leading robustness with field proved components.

Multiple options for alternate-to-cadmium platings, including Durmalon, Black Zinc Nickel, and the new AP-93 1000-hour salt spray approved plating. Amphenol uses the RoHS requirements and the latest revisions to the MIL-DTL-38999 specification to develop these platings.

Amphenol LTW’s 33-pin Ultra High-Density (UHD) X-Lok Metal Mini Size push-lock connector boasts a compact design and high contact density, providing space efficiency and enhanced data transmission. This connector serves as an excellent alternative to traditional M12 solutions【Video: https://www.youtube.com/watch?v=7gU_zye2zIw】【Quck guide: https://amphenolltw.com/down.php?supp_download=112】

Amphenol LTW’s X-Lok Micro Size connectors compatible with the M8 panel cutout, offer an advanced secure solution for signal, and data transmission. Featuring a spring-loaded push lock mechanism, ensure intuitive, fast, reliable connections with audible feedback, minimizes mating failures【Video: https://youtu.be/63FoeMHT9mM】【Quick Guide: https://amphenolltw.com/down.php?cn=news_content&id=151】