High Speed Connectors

Data connector according to VG96912, shielded, in size 12 including backshell for High-Speed and Ethernet applications up to CAT6_A (10Gbit/s according to DIN EN 50173-1, up to 500 MHz).

Amphenol's patented compression mount contact technology utilizes industry-leading alloys to make cost effective and electrically robust socket solutions that offer high performance. With designs supporting pitches down to 0.4mm and speeds up to 40GHz, the SK series sockets are being used in cutting edge BGA, LGA and other small form factor IC applications.

Slim Cool Edge Hybrid Power & Signal connectors provide a one-piece high speed and high power card-edge package. These connectors offer cost-competitive and high-density solutions. These versatile solutions based on a 0.65mm signal pitch design offer multiple BTB configurations like right angle, mezzanine, and coplanar. The connectors are designed as Open Pin Field & are hot-plug capable.

PROVEN, HIGH SPEED, NEXT-GENERATION SAS-4 INTERFACE SlimSAS™ connectors address issues in next-generation storage devices such as bulk cable form factor restrictions and the introduction of multi-lane storage devices. SlimSAS™ connector is a 0.60mm pitch interconnect system that offers superior signal integrity performance over standard Mini-SAS solutions.

In order to provide higher speed and smaller size solution on networking equipment and server, Amphenol has developed SlimSAS™ low profile connector which is used in application of UPI1.0, 11.2GT/s, 24Gb/s SAS signal or 16GT/s PCIe® signal. With 0.60mm contact pitch, Low Profile (LP) SlimSAS™ solutions are smaller than mainstream connectors in current market to save space in end devices.

TVµCom-10Gb+ combines 10 Gb/s Ethernet speed of the classic µCom-10Gb+ with the ruggedness of 38999 Series III shell. TVµCom-10Gb+ exceeds 10Gb/s according to the IEEE 802.3an-2006, 10GBase-T standard, and the 38999 series III size 11 shell provides environmental resistance similar to MIL-DTL-38999 Series III.

Amphenol's UltraPort™ QSFP+ interconnect system comprises a 38-position, 0.8mm pitch connector built for use in high-speed serial applications. Each port offers 4 channels to increase port density which allows more board real estate and cost-optimized solutions. The UltraPort™ QSFP+ connector supports next-generation 100G+ applications and transmits up to 28 Gb/s per channel.

Amphenol's UltraPort™ SFP+ interconnect system comprises of a 20-position hot-swappable I/O connector enclosed in a metal cage mounted to a host PCB. It supports 28Gb/s applications with backward compatibility for next-generation Ethernet and Fibre Channel applications. UltraPort™ SFP+ connector shares the same unique mating interface and EMI cage dimensions as the SFP+ form factor.

VHDM-HSD™ is a shielded, high-density, high-speed press-fit connector system optimized for differential pair architectures. The flexible, modular design of the product allows for the differential performance of our VHDM-HSD™ connector to be combined on the same rear organizer as the VHDM® connector which is a single-ended solution.

Amphenol's VHDM® connector's modular format and breadth of components provide unmatched design flexibility. VHDM® can be combined with VHDM-HSD™ to incorporate both single-ended and differential signaling within the same connector. VHDM® derivatives provide an upgrade path to 25 Gb/s with backward mate compatibility to allow for scale as needed.