Board-Level Connectors

COMPLIES TO NEW INTERFACE STANDARD JEDEC SO-023D AND JEDEC SO-023 The new DDR5 connector with only 287 terminals addresses the resonance from the floating RFU pin 220 which resulted in a margin delta. Both RDIMM and UDIMM versions of the new DDR5 socket are tooled and available.

LATEST MEMORY FORM FACTOR FOR AI SERVERS The LP DDR5 Small Outline Compression Attached Memory Module (SOCAMM) is designed specifically for server and data center applications. It utilizes a compression connector interface and offers all the advantages of LPCAMM DDR5 in a more optimized form factor, making it ideal for high-performance computing (HPC) and artificial intelligence (AI) servers.

HIGH SPEED HIGH DENSITY SO-DIMM SOCKETS DDR5 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. 262 positions SO-DIMM connector are available in various height options.

Ideal for miniature applications, the DensiMate™ connector system provides highly reliable performance, which meets industrial automation and IT/Datacom challenges. With wire gauge range from 30AWG-26AWG, these connectors are available in double row, vertical SMT, and right angle SMT configurations. DensiMate™ comes with an active latch to provide enhanced contact reliability.

HIGH DENSITY / HIGH SPEED / DUAL-BEAM CONTACT / USCAR-2 COMPLIANT BOARD-TO-BOARD CONNECTOR Amphenol FCI Basics DensiStak™ connector is designed with its 11 rows 1000+ high density pin count, high speed up to PCIe® Gen 4 with 16Gb/s. Reliable dual-beam contact system, compact size with pitch 0.80mm x 1.25mm, USCAR-2 compliant, and optional shields

DIN 41612 connector systems are the most popular backplane interconnect systems in IEC 603-2 specifications due to the widespread standard adoption, easy availability, cost-effectiveness, and durability. The product design for Board-to-Board and I/O solutions involve both standard mount and reverse mount mating combination.

DIN 41612 High Temperature (HT) connectors meet the fire safety standards required in the Industrial (Transportation, Power) market. DIN is most suitable for hazardous and high-risk product platforms of fire safety applications required in the industrial market. The 2.54mm pitch HT connectors comply with the relevant standards like IEC 603-2, NFF 16-101/102, and EN45545-2.

SUPPORTS 10/100T, 1GT, 2.5G, 5G, AND 10G TRANSMISSION SPEEDS WITH 2 & 4 PAIR POE UP TO 140W The Discrete Magnetic Series can offer a variety of products that can support 10/100T, 1GT, 2.5G, 5G & 10G transmission speed. It supports 2 & 4 pair PoE up to 140W. Configurations of both through-hole and SMT type are available for soldering process application.

Amphenol's sockets for DLP® products are interconnect solutions for the Texas Instruments DLP® chips suitable for ultra-mobile and portable applications. TI's DLP technology leads the industry in display and advanced light control solutions.

The 0.80mm pitch Double Density Cool Edge connectors and cable assemblies offer a compact design with 2 rows of contacts. This highly configurable single piece connector can accommodate both high speed and low speed signal and power. This hybrid connector reduces more than half of the PCB footprint when compared to 1.00mm PCIe Cool Edge. It supports PCIe Gen 5 and is designed for multiple Add-In-Card...