Board-Level Connectors

COMPACT, ROBUST AND VERSATILE CONNECTOR SYSTEM MicroSpaceXS™ Crimp-to-Wire connector platform's unique design meets LV214 up to Severity-3 and up to USCAR-T4V2 specifications. These 1.27mm pitch connectors come with a current rating up to 4A per contact making them ideal for higher power applications.

MicroSpaceXS™ Waterproof connector platform's unique design meets LV214 up to Severity-3 and up to USCAR-T4V2 specifications. These 1.27mm pitch connectors come with a current rating up to 3A per contact making them ideal for higher power applications. MicroSpaceXS™ waterproof connectors are available in staggered pin configuration and in Wire-to-Wire and Wire-to-Board configurations.

FULLY COMPLIANT CONNECTOR FOR ADVANCED MC™ MODULES MicroTCA (μTCA) vertical card edge connectors provide 170 contacts on a 0.75mm pitch and enable Advanced MC™ modules to be plugged directly into a backplane. MicroTCA card edge connectors' conventional press-fit or surface mount assembly processes and connector designs require no costly hardware, resulting in low total applied cost.

Developed in alignment with The Open Group Sensor Open Systems Architecture™ (SOSA) technical standard, MIL-HD2 provides developers with a readily available, robust open architecture solution for tighter card pitches and chassis designs where space requirements and density are critical.

Millipacs® 2mm Hard Metric connectors fulfills the interconnection requirement of the PICMG 2.0 Revision 3.0, the Compact PCI core specification. Millipacs® for Compact PCI is featured with the 2-beam twisted tulip contact, which provides an equalized signal path, two-contact points for reliability and superior performance in an environment subject to shock and vibration.

FCI Basics Millipacs® Vertical header and receptacle mating combination offer a range of stack heights between 15mm and 25mm for low speed and 10Gb/s mezzanine applications. Millipacs® connector interfaces provide high reliability and robustness making them suitable for the most demanding applications in aerospace, industrial, and also traditional telecom segments.

Millipacs® is a 2.00mm modular board to board or cable to board Interconnection system in Hardmetric configuration designed in accordance with IEC 917 and IEC 61076-4-101 and Telcordia GR-1217-CORE standards. Millipacs® Right angle headers features hot plugging application with different mating sequences and are suitable for both Coplanar and Backplane mating.

FCI Basics Millipacs® is a 2.00mm modular, BTB & CTB Interconnection System in Hard Metric (HM) configuration designed in accordance with IEC 917, IEC 61076- 4-101, and Telcordia GR-1217-CORE standards. These connectors are enriched with additional options for higher speed, shielding, High operating temperature (175°C), higher current rating (3A/pin), and low smoke low halogen compatibility.

FCI Basics Millipacs® is a 2.00mm modular BTB or CTB Interconnection system in a hard metric configuration designed in accordance with IEC 917 and IEC 61076-4-101 and Telcordia GR-1217-CORE standards. These connectors are enriched with additional options for higher operating temperature (175°C), current rating (3A+/pin), low smoke low halogen (LSLH) materials, touch-proof / dust-free caps.

Millipacs® HM vertical receptacles are offered in standard 5 and 8 row signal modules and up to maximum of 200 signal contacts. Vertical receptacle module, when mated to a standard straight header are suitable for parallel Board-to-Board applications. Vertical receptacle can also be used in backplane in the place of vertical header and mated with right angle header on the daughter card.