Amphenol is one of the world’s largest designers, manufacturers and marketers of connectors and interconnect systems, antennas solutions, sensors and high-speed cable. Our connector and connector system solutions include fiber optic interconnect, harsh environment interconnect, high-speed interconnect, power interconnect, power distribution and busbars and radio frequency (RF) interconnect products. Our sensors and sensor-based product solutions include gas and moisture sensors, level sensors, position sensor, pressure sensors, temperature sensors and vibration sensors. Our value-added cable assemblies include cable assemblies and harnesses, cable management products and backplane interconnect systems. Our cable solutions include coaxial cable, power cable and specialty cable. We also provide combiner/splitter products, flexible and rigid printed circuit boards, hinges and molded parts.
Inverter modules provide in-vehicle power from 400W to greater than 2kW to the consumer; enabling "at home" consumer use of laptops, household appliances, or equipment in vehicle.
Amphenol Broadband Solutions delivers reliable, high-quality solutions to power, protect, and monitor today’s network servers and equipment. With a variety of power distribution unit (PDU) solutions, including fuse panels and circuit breaker panels, current capacities up to 1000 amp inputs and 400 amp outputs, and nrgSMART™ power monitoring solutions.
DDR2 SO-DIMM sockets are designed to accept modules that conform to JEDEC MO-224. The sockets come with a small form factor which allows fitting into smaller chassis, aiding the development of smaller & lighter notebooks. It comes in two voltage options with different key-ID to prevent incorrect mating. It operates at a higher speed & bandwidth lowers power consumption.
DDR3 vertical DIMM sockets are designed to accept 240 position DDR3 memory modules that conform to JEDEC M0-269. Low-resistance contacts support the use of RDIMM (registered DIMM), which helps to further reduce power consumption in data center hardware.
Vertical DDR4 DIMM sockets from Amphenol provide 288 contacts on 0.85mm pitch and are designed to accept DDR4 memory modules that conform to JEDEC MO-309. The DDR4 series complies with the new interface standard JEDEC POD12. It allows a module seating plane of 2.40mm and supports module variants in UDIMM, RDIMM, and LRDIMM.
HIGH-SPEED HIGH-DENSITY SO-DIMM SOCKETS
DDR4 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. Different key positions aid alignment and prevent mismating. 260 position SO-DIMM connectors are available in 4.00mm, 5.20mm, 8.00mm, 9.20mm height, in standard or reverse options.
DDR4 Ultra Low Profile (ULP) vertical DIMM sockets provide 288 contacts on 0.85mm pitch. It facilitates convenient memory expansion in servers, workstations, desktop PCs, and embedded applications in communications and industrial equipment. With an ultra-low module seating height of 1.1mm and connector height of 13.1mm, it reduces the overall profile of the connector.
COMPLIES TO NEW INTERFACE STANDARD JEDEC SO-023
Vertical DDR5 DIMM sockets from Amphenol provide 288 contacts on 0.85mm pitch and are designed to accept DDR5 memory modules that conform to JEDEC MO-329. The sockets facilitate convenient memory expansion in servers, workstations, desktop PCs, and embedded applications in communications and industrial equipment.
HIGH-SPEED HIGH-DENSITY SO-DIMM SOCKETS
DDR5 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. 262 positions SO-DIMM connector is available in 4.00mm height with the standard option. Sketching design of DDR5 SO-DIMM 8.00mm height with the standard option now.
The Deep Space 38999 Connector series is designed for extreme cold environments. They are built to retain a grommet-to-wire and contact-to-contact seal in temperatures beyond -85 °F (-65 °C), with inserts that have been cycle tested between -148 °F (-100 °C) to 392 °F (200 °C)
Defibrillation shock therapy demands safe, high-performance cable systems capable of transmitting up to 360 joules and 15 amperes. Bernd Richter GmbH develops customized, high-voltage-safe connectors and cables with reinforced isolation, vibration resistance for emergency use, Kevlar or steel tensile support, and full traceability via serial labeling.
Amphenol's DensiShield® I/O system is designed to support the transmission of high-speed, serial differential signals while taking customers' equipment packaging requirements into consideration. Combining high density, mechanical robustness, and ease of PCB assembly with excellent shielding and signal integrity performance means that system designers no longer have to compromise.
DHR (Down-hole Rotatable ) is made from high-temperature material (200°C operations) with gold-plated BeCu contact bands. Our process enables the creation of 1-piece contacts, from the ring- through the back end. 4, 8, and 10 Contacts available. These solid connectors have eliminated solder and laser-weld failure points within the connector, and have increased the strength and life.
Used to facilitate the launching of controlled impedance signals to printed circuit boards. Two strategically spaced inner contacts form two 100 or 150 Ohm matched impedance differential pairs. Requires modification of MIL-DTL-38999 connector to accommodate keyed contacts. Available in size 8 crimp termination style. Also available in size 8 with PC tails.
Offers several advantages for high data transfer rates, low power consumption and excellent EMI compatibility. Amphenol Twinax contacts terminate to a variety of cables and are also available with PCB tails.
Proven line of Digital Video Interface media converters that can be used in harsh environment avionics, ground systems, or naval applications that need to transmit and receive such encoded interfaces over fiber optic cables.
FCI Basics DIN 41612 connector systems are the most popular backplane interconnect systems in IEC 603-2 specifications due to the widespread standard adoption, easy availability, cost-effectiveness, and durability. The product design for Board-to-Board and I/O solutions involve both standard mount and reverse mount mating combination.