Amphenol is one of the world’s largest designers, manufacturers and marketers of connectors and interconnect systems, antennas solutions, sensors and high-speed cable. Our connector and connector system solutions include fiber optic interconnect, harsh environment interconnect, high-speed interconnect, power interconnect, power distribution and busbars and radio frequency (RF) interconnect products. Our sensors and sensor-based product solutions include gas and moisture sensors, level sensors, position sensor, pressure sensors, temperature sensors and vibration sensors. Our value-added cable assemblies include cable assemblies and harnesses, cable management products and backplane interconnect systems. Our cable solutions include coaxial cable, power cable and specialty cable. We also provide combiner/splitter products, flexible and rigid printed circuit boards, hinges and molded parts.
ecomate® Family of circular, multiway connectors provide an IP65 thru IP69K rating range (in mated condition) for indoor/outdoor industrial applications and feature robust, durable, plastic or metal construction with either a circular bayonet, a quick-locking automatic, or a rapid coupling system option. With a max. amperage/voltage range of 56A-300A/600V-1000V, depending on the series.
Available in a variety of shell sizes and insert arrangements. ecomate® RM (Rugged Metal) Series of circular, metal connectors provide an IP67 rating (in mated condition) for industrial applications, all in a sealed connector system. With a bayonet coupling system and maximum current rating of 45A/600V, the ecomate® RM (Rugged Metal) Series is perfect for Indoor/Outdoor applications
Available in 8 Shell Sizes / 27 Insert Arrangements. The ecomate® RSSM (Rugged Superior Seal Metal) Series of circular, metal connectors provides an IP69K rating (in mated condition) for industrial applications. With a bayonet coupling system and a maximum current rating range of 7A to 45A/600V, the ecomate® RSSM Series is perfect for indoor/Outdoor applications.
EconoStik™ 2.54mm is an economical range of 2.54mm unshrouded header. It is available in single-row and double-row with vertical through-hole, right-angle through-hole, and vertical SMT terminations. EconoStik™ 2.54mm is a standard 0.64mm square header with high-temperature resin and 1μ" gold plating in contact and tail. It supports up to 50 mating cycles.
Metal CONNECTOR with push-pull locking system for quick and secure mating, rated for a min. of 1000 cycles. ECTA is offering power contacts rated up to 40A +PE or up to 41 signal contacts. The shells can be selected in aluminium alloy, stainless steel or brass for very demanding environmental requirements. Pressure-tight bulkhead feedthrough and touch proof shells are also available.
Thermoplastic circular CONNECTOR for min. 1000 hours salt spray test duration with push-pull locking system for quick and secure mating, rated for a minimum of 1000 mating cycles. Offering up to 27 contacts per connector and up to 25A current per contact for signal and powertransmission. Characterized by simple handling and maintenance thanks to easy-to-install shells and contacts.
SV Microwave’s Edge Launch Plus PCB Connectors are precision RF connectors engineered for board-edge applications where reliability and high-frequency performance are critical. This product line features an extended flange design at the PCB transition point to maintain ground contact in the event of copper pull-back, ensuring consistent electrical performance. Available in multiple detent styles.
SV Microwave’s new Edge-Lock PCB connector series is designed to pull the connector's contact lane into the edge of the PCB. The result is a fixture-less connector that is primed for reflow without any unnecessary custom fixtures to hold the connector in place. The secure fit between the connector and the PCB edge ensures optimal RF performance throughout the connector's full frequency range.
Amphenol introduces the next-generation OverPass™ solution - EDSFF Board Site Connector. The 0.60mm pitch connector comes with a slim form factor design, capable of transmitting a highspeed signal up to PCIe® Gen 5 and PCIe® Gen 6 and allowing much greater signal path lengths while maintaining SI performance compared to conventional PCB routing methods.
EDSFF ORTHOGONAL CABLE ASSEMBLY WITH DIFFERENTIAL SIGNALING TO 32GT/S NRZ FOR NEXT-GENERATION SYSTEMS
Amphenol's EDSFF E1/E3 high-speed cable assembly transmits power and high-speed signals via a cable that directly connects to the main PC board supporting EDSFF E1/E3 SSD and CXL or other modules.
The EFP series has a similar modular design to the HDS series but is designed and certified for use in EX hazardous locations such as drilling rigs and oil refineries. CSA C22.2 No. 182.3-1987, CSA C22.2 No. 30-1986, CSA C22.2 No. 60079-0 – 2007, CSA C22.2 No. 60079-1 - 2007, UL 1977 2nd edition, ISA/ANSI 60079-0 -2009, ISA/ANSI 60079-1-2009, UL1203 4th edition, IEC 6007-0, IEC 60079-1
CLASSIC HPCE® WITH ENHANCED PERFORMANCE
eHPCE® connector offers a 15% increase in power density with the same footprint as classic HPCE®. The all-new power contact design offers lower contact resistance and higher current carrying capacity compared to classic HPCE® connectors. eHPCE® connectors are designed to extend the life of power supplies using card edge output power connectors.
Electrical plates for busses, electrobusses, trolleybusses, railway vehicles, including fuses, circuit breakers, relays, and ECUs connected by wire harnesses.
Full integration, in-house LRU capabilities include aluminum enclosures, rigid, flex, and panel circuit card assemblies, internal/external cable assemblies, integration, and final assembly, and fully functional testing and environmental stress screening (ESS) in order to support our customers with full turnkey solutions.
Capabilities include automated select solder, press-fit, and hand solder for through hold, single and double-sided BGA's and uBGA's, high-density packages, chip on board, lead-free, and conformal coating (UR, UL, Parylene). Process validation capabilities: 3D Solder Paste Inspection (SPI), Pre and Post-Reflow Automated Optical Inspection (AOI), 3D X-ray, and aqueous and non-aqueous cleaning.
ECUs allow for monitoring and controlling of critical applications such as Flight Controls, Avionic suites, Instrumentation, and Sensors. Electronic circuits are segregated and incorporate Front Face Panel, FPGA, MicroProcessors, and Software. We hold Part21G and PART145 certificates for production and maintenance.
Bernd Richter GmbH offers highly flexible catheter cables designed for sensitive cardiology applications such as electrophysiology. These cables combine exceptional durability with extra-small bending radii, low-noise performance to minimize interference, and materials that meet strict biocompatibility and cleanliness standards—ensuring reliable function in critical clinical environments.
ULTRA-HIGH DENSITY BACKPLANE INTERCONNECT SOLUTION
Ultra-High density 56+ Gbp/s PAM4 interconnect platform utilizing proven press-fit technology and a single wafer design optimized for traditional backplane, direct orthogonal, and cable design solutions.
Any type of antenna that is
surface mounted on the PCB. Most common antenna types are ceramic chip antennas,
composite material chip antennas and sheet metal antennas. The antenna design is often monopole, loop, IFA or PIFA antennas.
SV Microwave streamlines this with our innovative Embedded Phase Tuner. This component allows customers to independently adjust the phase of cable assemblies without external vendor involvement. The Embedded Phase Tuner operates by adjusting the transmission line length using a threaded coupling nut, simplifying the process.