Automotive
Amphenol is a leading supplier of advanced interconnect systems, sensors and antennas for a growing array of automotive applications. In addition, we have developed advanced technology solutions for hybrid and electric vehicles and are working with leading global customers to proliferate these advanced interconnect products into next-generation automobiles. Our primary solutions for automotive include antennas, electric vehicles, engine management and control, exhaust monitoring and cleaning, hybrid vehicles, infotainment and communications, lighting, power management, safety and security systems, sensing systems, telematics systems and transmission systems.
BATSOK
HV/HP connector for applications >60V. The connectors can be flexible or rigid and are available in various cross-sections. Also known as battery module connector.
Battery Structural Components
Modern high-voltage battery systems consist of many individual cells. These can be held together by cell connectors in the correct grid and thus safely contacted. Power rails for transferring the energy of the individual cells inside or outside the battery are also part of our portfolio.
Below Grade HDPE Handhole Enclosures
Charles Below Grade Enclosures (CBGE) are lightweight, molded HDPE handholes available in five rectangular and two round sizes. Designed for light-duty placements (parkway/greenbelt applications), these ANSI/SCTE rated below-grade enclosures store fiber optic and copper cable slack, meters, sealed cases, control valves, ground rods, signal controls, and various other equipment.
BergStak HS™ 0.50mm Mezzanine Connector
FLEXIBLE SOLUTION FOR HIGH-SPEED APPLICATIONS
Amphenol's FCI Basics BergStak HS™ connector family is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. BergStak HS™ 0.50mm connector family with 0.50mm pitch enables high-speed data applications with up to PCIe® Gen 5 32Gb/s.
BergStak® 0.40mm Connector
The BergStak® 0.40mm board-to-board connectors are in 0.4mm pitch with double row contacts, the family now supports stack height of 1.50/2.0/3.0/3.5/4.0mm and position ranges in 10-100 positions (10/20/24/30/34/40/50/60/70/80/90/100). The lock feature on contacts works together with shock-absorbing ribs on the housing to make it suitable for high-vibration applications and friendly for FPC applications.
BergStak® 0.40mm Self-Alignment Board-to-Board Connector
FCI Basics BergStak® 0.40mm self-alignment connectors come with a stack height of 3.50mm and 30 positions extendable up to 10 to 60 positions with 10 positions incremental. It has a unique self-alignment feature that supports blind mating, ensuring a reliable connection. The USCAR-2 compliant connector is also ideal for the automotive market.
BergStak® 0.50mm Mezzanine Connector
Amphenol's BergStak® 0.5mm is a comprehensive and versatile board-to-board solution designed for reliable and high-density applications. The unique design of scoop-proof housing ensures terminals are not damaged during mating.
BergStak® 0.635mm Connector
MICRO PITCH LOW PROFILE HIGH SPEED BOARD-TO-BOARD CONNECTOR
BergStak® 0.635mm pitch is a compact board-to-board connector with low stack height of 3.00mm. Available in 80 and 140 positions it support applications which require high pin counts and low profile connection.
BergStak® 0.635mm supports signal speeds up to 8Gb/s with an open-pin-field, providing design flexibility.
BergStak® FX10 0.50mm Board-to-Board Connector
FCI Basics BergStak® product range is expanded to include 0.50mm BergStak® FX10 board-to-board connector known for its fast data transmission and high signal quality. This connector is offered in 144 positions and is available in 4.30mm and 6.00mm stack height options. Position is extendable up to 168 positions.
BergStak® FX10 supports speed performance up to 15Gb/s+ and is available in vertical SMT
Bi-Component Molding
Seals can be assembled or also molded on in 2-component injection molding. 2-component hard-hard combinations are also possible.