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Amphenol’s CFP2 (surface mount receptacle connector) is considered to be a candidate of future generation multi hundred Gbps systems. CFP2 is comprised of 104 position, 0.6mm pitch host and pluggable connectors. It is rated for 28 Gbps per channel with resonance dampening for improved signal integrity. The plug connector on the mating interface improves accuracy and aids in achieving high speed performance. The CFP2 interconnect system includes insert molding assemblies for top side contacts and press-fit cage assemblies complying with IEEE and ITU-T applications.
Amphenol’s CFP2 (surface mount receptacle connector) is considered to be a candidate of future generation multi hundred Gbps systems. CFP2 is comprised of 104 position, 0.6 mm pitch host and pluggable connectors. It is rated for 28 Gbps per channel with resonance dampening for improved signal integrity. The plug connector on the mating interface improves accuracy and aids in achieving high speed performance. The CFP2 interconnect system includes insert molding assemblies for top side contacts and press-fit cage assemblies complying with IEEE and ITU-T applications.
The Amphenol CXP connectors come in a one-piece press-fit assembly system with twelve channels of up to 20 Gbps, resulting in 240 Gbps of total bandwidth. This allows our CXP to go beyond the 100 Gigabit Ethernet IEEE 802.3b,a and the InfinibandCXP12x QDR standards. The CXP series is the fastest and most dense I/O on the market today. It enables pluggable copper or optical cables to increase the flexibility of system level hardware for end users, and offers reduced cross-talk. The CXP interconnect system offers plug-to-receptacle containment with the various EMI gasket and EMI spring finger options, and is ideal for network switches, routers, servers and storage devices.
The standard and high density D-Subminiature connectors are available in five shell sizes offering a wide choice of contact positions: 9, 15, 25, 37, and 50 in standard density and 15, 26, 44, 62, 78, and 104 positions in high density. We offer filtered, sealed and compliant tail designs as well as custom crimp type or other terminations
The eQSFP interconnect system is comprised of a 38 position 0.8 mm pitch SMT connector, and a press-fit cage. With four channels of data in one pluggable, the system interface is capable of transferring data up to 28 Gbps / Channel, and replacing up to 4 standard SFP+ receptacles. These features result in greater port density and overall cost savings over traditional SFP+ products. Supporting standards include, Gigabit Ethernet, InfiniBand, and SONET/SDH with different data rate options. eQSFP includes cages in single and ganged configurations with multiple heat sink options supporting various thermal requirements and port status with light pipes options.
The ExpressPort QSFP+/QSFP interconnect system and the stacked combos are comprised of 38-position 0.8mm pitch SMT connectors, as well as press-fit cages intended for external connections. Each port offers 4 channels which increases port density and contributes to cost savings. The ExpressPort QSFP+ E-Series connector family is rated at 28 Gbps per channel. It features as tamped and formed contact design providing improved mechanical durability, an integrated grounding structure,and resonance dampening features for superior crosstalk performance. The contact design is optimized for a smooth impedance profile resulting in improved SI performance.
Times Microwave is the leader in providing high quality EZ style connectors. These non-solder type connectors use silver or gold plated beryllium copper spring contacts for optimal cable contact and offer considerable time savings, increased performance and more reliability than traditional solder-pin connectors. Most of our EZ connectors are available in an "X" version - no braid trim required.
Times Microwave produces sealed, flexible RF and microwave transmission line assemblies optimized for military environments. These cables exhibit an extremely long life in the rigorous environments found in airborne, shipboard and ground based applications. MilTech® cables are hermetically sealed and incorporate intermediate sections compatible with an assortment of connector systems.
The Mini-SAS external I/O connector system consists of a die-cast metal cage and a Compact Multi Lane SMT connector. The Mini-SAS can support Fiber Channel and Infini-Band standards, making it the perfect solution to the ever-growing demand of high-speed mass storage systems, servers, and storage area networks. Providing four serial send/receive channels per port, this connector system provides signal speeds of 6 Gbps per channel across the connector interface and is designed to satisfy the needs for gigabit serial data transmission applications. The connector satisfies the requirements of the INCITS T10 SAS 2.0 and SAS 2.1, and is also compliant with SFF-8086 and SFF-8088. The cage is mounted separately to the body so that the stress imposed by insertion and removal of the cable plug does not affect the signal/body solder joints. The connector is available with unique solder hold-down tabs designed to provide additional mechanical robustness in demanding applications.
The Mini-SAS High Density Interconnect is the next generation SAS system, with 4x, 8x and 16x cable-plugging options to provide faster data transmission and more bandwidth for end users. Our Mini-SAS HD is designed to be compliant with the SFF-8644 standard. It is also designed to save space with its increased density and reduced size as compared to the Mini-SAS 2.0. The Mini-SAS HD connector system has a 2-row, right angle connector with 12 Gbps per channel. Each connector handles 4 lanes of data for up to 48 Gbps of total bandwidth. Ganged options are also available up to a 1x4 configuration for up to 192 Gbps of total bandwidth. This connector will mate with active copper and optical cable assemblies, as well as active pluggable modules for extended-length applications in data centers. Main applications for Mini-SAS HD include HBA Servers, storage devices, and switches in data centers.
The OSFP interconnect system has 60 contacts per port and supports 16 high speed pairs. With a 0.6mm contact pitch, 4 rows of contacts and a horizontal port pitch of 23.38mm, the OSFP footprint is optimized for signal integrity performance. The stacked connector is enhanced for low crosstalk and has ground commoning for resonance dampening. It is also designed for 1U applications. An integrated heat sink for optimal thermal performance is a feature of the design.
PhaseTrack® cable assemblies are designed for applications demanding minimal phase change over temperature. All PhaseTrack cables use proprietary TF4® dielectric that does not have the abrupt shift in the phase that occurs with solid or tape wrapped PTFE based products under normal room ambient temperature conditions. PhaseTrack cable has the same triple shield construction used in Times popular SF®, SFT®, SilverLine® and MT cables.
RCx is a simple, high density, low cost, passive connector and cable system specifically designed for intra-rack connectivity of 25 Gb, 50 Gb and 100 Gb Ethernet allowing for a seamless intra-rack switch to adapter deployments. The streamlined design eliminates the need to include provision for active electrical components such as EEPROMs, optics, retimers, or management ICs. RCx is density optimized and can accommodate more than 128 25 G lanes in a RU faceplate. That leads two RCx2 receptables to fit on a half-height PCIe card faceplate or two Rcx4 to fit on a full-height PCIe card faceplate. Versatile, the 4-lane RCx4 receptacle can be used as a 4-lane port, or can be bifurcated to be used as multiple 2-lane and 1-lane ports.
The SFP interconnect system consists of a 20-position hot swappable I/O connector enclosed in a metal cage mounted to a host PCB. It is designed to support Gigabit Ethernet and Fiber Channel applications. The connector accepts multiple transceivers per INF-8074i and combines,transmits, and receives functions in a low cost, compact and flexible format. We offer a wide variety of cage configurations, which have a two-piece construction with enhanced transceiver mating tabs available in press-fit or solder tail versions. Stacked versions ( 2XN ) consist of a 2-row cage with integrated connectors. The entire assembly in press-fit pin compliant. Main applications of the SFP series include servers, storage, switches, and networking equipment.
SFT™ high performance microwave cables are rugged and flexible making them ideal for interconnect applications from inside LRUs to system interconnects and antenna feeders in military and commercial systems. The wide range of available connectors cover many interface types and frequency ranges.
Thermometrics NTC Type Surface Mount Devices (SMD) are intended for temperature measurement, control and compensation. They are suitable for standard soldering techniques and availabe in a range of sizes, including 0402, 0603, 0805 and 1206.
By Amphenol Advanced Sensors | Thermometrics, Inc.
The UltraPort QSFP+ interconnect system is comprised of a 38-position, 0.8mm pitch connector built for use in high speed serial applications. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. The UltraPort QSFP+ connector supports next generation 100 G+ applications and transmits up to 32 Gbps per-serial-lane making it the fastest connector in the QSFP+ market. It features a stamped and formed contact design providing improved mechanical durability and resonance dampening features for superior performance. The design minimizes cross talk and transmission line impedance discontinuity across the connector interface at speeds up to 32 Gbps.
The UltraPortTM SFP+ interconnect system is comprised of a 20-position hot swappable I/O connector enclosed in a metal cage mounted to a host PCB. It supports 32Gbps applications with a backward compatibility for next generation Ethernet and Fibre Channel applications. Amphenol’s UltraPortTM SFP+ connector shares the same exceptional mating interface and EMI cage dimensions as the SFP+ form factor. The cages are built for use with several board thicknesses and assembly processes to accommodate server and switch applications with great cost savings. The connector accepts multiple transceivers per INF-8081 and combines, transmits, and receives functions in a low cost, compact and flexible format. We offer a wide variety of cage configurations, which have a two-piece construction with enhanced transceiver mating tabs available in press-fit or solder tail versions. Stacked versions (2XN) consist of a 2-row cage with integrated connectors. The entire assembly is press-fit pin compliant.
Amphenol’s SlimLine SAS system addresses various interconnect issues in next generation storage devices such as bulk cable form factor restrictions and the introduction of multi lane storage devices. The 8-row, 0.6 mm pitch, 24 Gbps per lane internal solution consumes the same area as the MiniSAS HD 4x solution targeted for next generation SAS-4. The proven high-speed connector and ribbon cable friendly design supports blade and mainstream server designs.
The XCede IO interconnect system is comprised of a 32 position, variable pitch connector built for use in high speed serial applications. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. The XCede IO connector supports next generation 100 G+ applications and transmits up to 28 Gbps per-serial-lane. It features a stamped and formed contact design providing improved mechanical durability and resonance dampening features for superior performance. The design minimizes cross talk and transmission line impedance discontinuity across the connector interface at speeds up to 28 Gbps.
The XFP interconnect system is capable of a 10 Gbps data rate and is intended for external I/O connections. High speed serial interconnect applications include clusters, servers, and storage devices. Its single row cage configuration requires less space and is a lower cost alternative to parallel-optics VSR. XFP also requires less than one-third the power and physical space of an MSA interconnect with parallel interface. It has a single footprint for all links, and is hot-pluggable.