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0.80MM PITCH, 100Ω BOARD-TO-BOARD SOLUTION
Amphenol high speed board-to-board connectors provide high contact force reliability ensuring strong connectivity, forced insertions, and removals.
Broad range of stacking heights and pin counts are offered to provide maximum design flexibility.
Amphenol 0.80mm pitch connector design is suitable for high performance applications.
The compact design of the 1.0/2.3 connector series permits dense connector packing. They are ideally suited to applications where space savings is critical. Versions are available with threaded coupling mechanisms which provide positive mating or a unique push-pull coupling system which allows quick installation. Amphenol 1.0/2.3 coaxial connectors operate from DC-10 GHz. Common applications are amplifiers, base stations, routers and switching equipment.
The 29-position, SAS receptacle and plug connectors enable the implementation of the high-speed, Serial Attached SCSI (SAS) hard disk drive (HDD) interface that is replacing the SCSI drive connection in enterprise storage applications in servers and storage systems. This range conforms to SFF8482, SFF8680 and is capable of meeting up to 12Gb/s.
The SAS connector system is designed to support hot plugging and blind mating of HDDs. Staggered contact lengths provide sequential mating of contacts to enable hot plugging. Molded guide posts provide angled lead-in to compensate for connector misalignment, allowing the device plug and the receptacle to self-align during the mating process. Most connectors also feature stamped retention clips that provide additional mechanical strength for robust PCB attachment.
Amphenol ICC also offers wide-base housing options on vertical backplane receptacles for even more stability.
The high-speed, serial interface is designed to support differential signaling, initially at speeds of 3Gb/s and evolving to 12Gb/s. A SAS receptacle accepts either SAS or SATA (Serial ATA) drives, giving the system manufacturer the option to plug either drive to a backplane. Because both technologies have similiar electrical interfaces, users have the choice of deploying cost-effective SATA drives for bulk storage or higher-performance SAS drives for mission-critical applications.
Amphenol ICC offers a wide range of SAS plug and receptacle connectors for enterprise applications. Vertical and right angle connector configurations provide options for use in servers, server or storage blades, storage backplanes, HDD carriers and HDDs.
Amphenol RF offers a full range of 50 Ohm 4.1/9.5 connectors, adapters, and cable assemblies. These interconnect products are engineered for the wireless market and ideal for applications requiring low passive intermodulation, or PIM. The Amphenol version features a patented ultra-slim push-pull coupling system which allows quick installation and ensures positive locking and high retention.
Amphenol RF offers a full range of 4.3-10 connectors and adapters, which are engineered for the wireless market and are ideal for applications requiring low passive intermodulation, or PIM.
The 7/16 series provides superior performance for both return loss and intermodulation distortion (IMD). These connectors are very robust, extremely stable and mostly with waterproof specifications, making them ideal for applications where vibration resistance and environmental protection is important.
AirMax VS2® connectors provide a migration path from AirMax VS® for speeds up to 20Gb/s, providing margin of safety for typical 802.3ap system performance with the flexibility of an open pin field design. The connectors leverage AirMax VS® and VSe® design features and technology to achieve improved signal integrity and mechanical attributes compared to AirMax VS® connectors.
The connector utilizes Amphenol ICC technology for a shieldless design with no metallic plates and closely coupled differential pair design to yield low loss and low crosstalk.
AirMax VS2® connectors are mating-compatible to both AirMax VS® and AirMax VSe® connectors and require no changes to connector PCB footprints. The mating-compatible interfaces and capability to preserve critical pin assignments can provide opportunities for cost savings as new and upgraded equipment is deployed. For example, a backplane or chassis can be designed to allow the installation and continued use of legacy daughter cards, line cards, or blades that are already in the field as well as new or future higher-speed module cards.
Right angle and vertical receptacles and headers support backplane, midplane and coplanar applications.
Next-generation AirMax VSe® connectors provide a migration path for up to 25Gb/s per differential pair with the flexibility of an open pin field design. The connectors also feature backwards mating-compatible interfaces to existing AirMax VS® connectors with minimal changes to connector footprints.
The connectors combine Amphenol ICC technologies for a shieldless design with no metallic plates and closely edge-coupled differential pairs with innovative design improvements to yield low loss and low crosstalk.
Right angle receptacles and right angle headers will support backplane, midplane or coplanar applications.
The mating-compatible interfaces and capability to preserve critical pin assignments can provide opportunities for cost savings as new or upgraded equipment is deployed. For example, a backplane or chassis can be designed to allow the installation and continued use of legacy daughter cards, line cards or blades that are already in the field as well as new or future higher-speed module cards.
The AirMax VS® connectors use innovative edge-coupling and air dielectric between adjacent conductors to deliver insertion loss and crosstalk. This technology, invented by Amphenol ICC, enabled low cost, high performance connectors that are a leading backplane interconnect solution for telecom, networking, server, and storage applications.
The shieldless Open Pin Field Design with no pre-assigned ground pins provides the ultimate flexibility in board layout. The AirMax VS® connectors addresse a broad range of system architectures, including backplane, midplane, coplanar, midplane orthogonal, cabled backplane, and mezzanine applications.
This is a broad, high volume product family that system continues to earn business when competing with the many more expensive and complex shielded connector systems. This is due in part because of its high density, simple modular construction and low cost.
Further enhancements of the AirMax® product family are seeing speeds increase up to 25Gb/s, enabling customers to design electronic systems that are highly functional and cost effective. This enables backward compatibility with legacy systems and forward compatibility with the most advanced designs.
Amphenol Industrial Operations introduces a new power connector family, the Amphe-BTS. This innovative connector series is designed for the next generation of base stations.
Amphe-BTS is a circular connector based on the MIL-C-26482 series 2 with clip retention contacts. Features brass shell construction for greater corrosion resistance, provides EMI shielding, is shock & vibration resistant, and uses screw termination contacts making it well suited for field installation.
We offer the Amphe-BTS in our standard 2-way 48V DC power configuration but also manufacture a 48V DC 2-way reverse gender and a 3-way 400VDC/250V AC connector. Standard current for all variations is 10A.
Amphenol Industrial Products Group introduces a new power connector family, the Amphe-OBTS. This innovative connector series is designed for the next generation of base stations.
Amphe-OBTS is a circular connector based on the MIL-C-26482 series 2 with clip retention contacts. Features zinc shell construction, provides EMI shielding, is shock & vibration resistant, and uses screw termination contacts making it well suited for field installation.
We offer the Amphe-OBTS in our standard 2-way 60V DC power configuration but also manufacture a 60V DC 2-way reverse gender and a 3-way 400VDC/250V AC connector. Standard current for the two pole version is 26A per contact while the three pole version supplies 16A per contact.
The Amphe-Power® Series consists of three of the time-tested and reliable families of Amphenol Industrial Connectors, all of which are MIL-5015 styles, medium to heavy duty cylindricals. This series, enhanced with RADSOK® sockets, can now handle up to 50% higher amperages. Current Amphe-Power® product lines support from 50A to 1000A continuous duty.
The Amphe-TVS connector is designed for communications equipment manufacturers with power interconnect requirements. Applications for this product would be in harsh environments such as towers, outdoor and roof-top applications. The Amphe-TVS connector offers the highest performance capabilities for severe environment applications. There are 2 insert patterns to choose from: The 2 pole for DC power and the 3 pole for AC power.
300A SINGLE POLE /150A DUAL POLE (P/N 612040001)
The APB300 dual pole, feed-through socket design delivers 300A current capability and is hot pluggable. The dual pole contact design allows both contacts to be used together or individually. The connector is mounted using the 4 holes located at the bottom.
500A SINGLE POLE (P/N 622440002)
The APB500 connector accommodates a 0.125” thick plated busbar for a separable connection and supports blind mating. The guide plate permits a slightly misaligned busbar to connect and provides over stress protection for the contact.
BarGuide® connectors provides a high current power interconnection with quick connect/disconnect function for space constrained board-to-board, board-to-busbar, and busbar-to-busbar power distribution applications.
Large surface contact area ensures small voltage loss, minimum heat generation and low insertion/ extraction forces
Current carrying capacity from 65Amps to 140Amps
Press-fit tails for mounting on both circuit boards and busbars
Vertical design for parallel/mezzanine applications
LOW RESISTANCE BUSBAR CONNECTOR
The BarKlip® BK150 connector features 10 independent conducting beams that maintain contact with the mating busbar in common misaligned positions, therefore lowering resistance connectors.
Up to 170A at 30°C temperature rise in still air
10 independent points of contact for low resistance and high reliability
Optional grounding shield on the board connector
Stainless steel helper spring ensures proper mating force and contact resistance
AGT® plated contacts deliver lower resistance without the high cost of gold
LOW RESISTANCE BUSBAR CONNECTOR
The BarKlip® BK300 connector features 14 independent conducting beams that maintain contact with the mating busbar in common misaligned positions, therefore lowering resistance.
Amphenol Private Networks' product programme of VHF & UHF base station antennas reflects state-of-the-art modern antenna construction, and comprises directional and omnidirectional fixed site antennas for frequencies between 27MHz and 5.8GHz, including:
Amphenol Private Networks' diverse range of products are suited to applications within:
FLEXIBLE SOLUTION FOR HIGH SPEED APPLICATIONS
BergStak HS™ 0.50mm connector is a flexible solution designed for high speed and high density, parallel board-to-board applications with various heights in different sizes.
The BergStak HS™ series meets the new 25Gb/s performance requirement.
BOARD-TO-BOARD SOLUTION FOR HIGH SPEED AND HIGH DENSITY APPLICATIONS
BergStak+™ 0.80mm is designed to be the next generation PCIe 4.0 compliant mezzanine connector system. It is fully compatible with the existing BergStak® 0.80mm product recommended by the Open Compute Project (OCP).
Backward mateable and footprint compatible with existing BergStak® 0.80mm
Available in 80 and 120 positions. Other position
Available in 5, 8, 12 and 16mm stack heights
The BergStak® product range is expanded to include 0.5mm mezzanine connectors.
Available in 3mm to 6mm stack height options in 0.5mm increments, this connector is also offered in 10 to 60 positions in 10 position increments.
Designed with scoop-proof housing, the terminals are protected from damage when parts are mated.
BergStak® 0.5mm mezzanine connector comes with two options: Metal hold-down option ensures higher retention force; Locating pegs option eases manual assembly. Both options can be configured within a single connector.
BergStak® 0.5mm mezzanine connector is a comprehensive and versatile solution. The 0.5mm double row contact pitch feature saves space on PCB and is highly suitable for high density applications in consumer and industrial markets.
FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS
Amphenol ICC's BergStak® 0.8mm is a flexible solution designed for high speed and high density, parallel board-to-board connector system with 16 PCB stack heights in 9 sizes up to 200 positions.
Housing and terminal profile guarantees support of up to 12Gb/s
Vertical versus vertical mating configuration
40 to 200 position sizes in 20 position increments
5mm to 20mm stack heights in 1mm increments
BergStik® 2.54mm unshrouded headers are available in surface-mount (SMT), through-hole (THT), press-fit, stacking and pin-in-paste (PIP) versions. Designed in single and double row, they are available in straight or right angle options, from 2 to 72 positions.
Featuring a "breakaway" design, each connector can be cut or broken to length to suit the application profile. The maximum current rating is 3A per contact.
This product range is extended with BergStik® 2.54mm unshrouded vertical headers in 0.25μm plating, available in standard sizes. It offers an economical solution for various applications. It is also specified up to 100 mating cycles.
BergStik® product range provides Board-to-Board, Wire to-Board and Cable-to-Board interconnect solutions for all electronic equipment and devices.
HIGH PERFORMANCE I/O FOR PoE & INDUSTRIAL
Boltrack™ connector is a robust and reliable interconnect solution. It features high power and signal performance, small form factor, field termination, EMI shielding, lightning protection and resistivity to over voltages. Boltrack™ connector comes in 4 pair right angle board and plug mating combination.
In an era of hyper connectivity, Internet of Things (IoT) calls for more Power over Ethernet (PoE) enabled devices on the network. Besides this, PoE market continues to expand as increased power levels support broader range of powered devices. There is a growing demand for higher power delivery of 100 Watts plus over the four pair ecosystem. At the same time, prolific data growth demands connectors with good signal integrity performance. Boltrack™ connector enables best in class power and signal performance.
Custom designed power conductor made from aluminum to reduce weight and cost
Custom designed power conductor made from copper
The Clincher™ 2.54mm pitch connector family includes single-row pin and receptacle connectors designed for termination to flat flexible circuitry. Amphenol ICC's proven Clincher design has become the standard by which other products are judged. The addition of keying and active latching options to the receptacle offering make Clincher products the smart choice for even more applications. All receptacle connectors use the same customer-preferred and patented Clincher contact and are ideal for applications where shock or vibration are concerns.
HYBRID CONNECTOR FOR VERSATILE BOARD-TO-BOARD (BTB) APPLICATIONS
Cool Edge Hybrid Power and Signal connectors bring high speed and high power into a one-piece card-edge package. These versatile solutions address multiple standards like PCIe, SAS/SATA, networking and offer multiple BTB configurations such as mezzanine, coplanar and midplane/backplane. Moreover, the connectors are designed as Open Pin Field and are hot plug capable.
HIGH SPEED SPACE-SAVING CONNECTOR FOR BOARD-TO-BOARD (BTB) APPLICATIONS
Cool Edge Signal connectors bring high speed PCIe support into a one-piece card edge package with 16Gb/s Gen4 and 32Gb/s Gen 5 capabilities. Slim connector design saves space on the motherboard while facilitating other higher density applications. Housing design is kept simple with an overall reduced footprint, providing additional benefits over Standard PCIe solutions.